EEWORLDEEWORLDEEWORLD

Part Number

Search

HSMS-2804-BLK

Description
SILICON, MIXER DIODE, SOT-23, 3 PIN
CategoryDiscrete semiconductor    diode   
File Size88KB,1 Pages
ManufacturerHP(Keysight)
Websitehttp://www.semiconductor.agilent.com/
Download Datasheet Parametric Compare View All

HSMS-2804-BLK Overview

SILICON, MIXER DIODE, SOT-23, 3 PIN

HSMS-2804-BLK Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerHP(Keysight)
Parts packaging codeSOT-23
package instructionR-PDSO-G3
Contacts3
Reach Compliance Codeunknown
ConfigurationCOMMON CATHODE, 2 ELEMENTS
Maximum diode capacitance2 pF
Diode component materialsSILICON
Diode typeMIXER DIODE
Maximum forward voltage (VF)0.4 V
JESD-30 codeR-PDSO-G3
JESD-609 codee0
Humidity sensitivity levelNOT SPECIFIED
Number of components2
Number of terminals3
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum repetitive peak reverse voltage70 V
surface mountYES
technologySCHOTTKY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Microwave Diodes, Integrated Circuits, GaAs FETs, Amplifiers and Mixers
Diodes (continued)
Please reference artwork on previous page.
A g i l e n t
Technologies
Surface Mount RF Schottky Barrier Diodes
Mfr.Õs
Type
Bulk
5082-2800
HSMS-2800-BLK
HSMS-2802-BLK
HSMS-2804-BLK
HSMS-2805-BLK
5082-2810
HSMS-2812-BLK
HSMS-2814-BLK
HSMS-2815-BLK
5082-2835
HSMS-2820-BLK
HSMS-2822-BLK
HSMS-2823-BLK
HSMS-2824-BLK
HSMS-2825-BLK
Tape and
Reel
Ñ
Ñ
HSMS-2802-TR1
Ñ
Ñ
Ñ
HSMS-2812-TR1
Ñ
HSMS-2815-TR1
Ñ
Ñ
HSMS-2822-TR1
Ñ
Ñ
HSMS-2825-TR1
Fig.
Min. V
BR
(V) @
10 µA
 I
R
= 100 µA
70
70
70
70
70
20
20
20
20
Ñ
15
15
15
15
15
Max. C
T
(pF)
@ V
R
= 0 V
2.0
2.0
2.0
2.0
2.0
1.2
1.2
1.2
1.2
Ñ
1.0
1.0
1.0
1.0
1.0
Max. V
F
@
1 mA (mV)
f = 100 MHz
 I
F
= 10 mA
àI
F
= 5 mA
410
410
400
400
400
400
400
400
400
480
340
340
340
340
340
Surface Mount RF Schottky Barrier Diodes (continued)
Mfr.Õs
Type
Bulk
HSMS-2829-BLK
Tape and
Reel
Ñ
Fig.
Min. V
BR
(V) @
10 µA
 I
R
= 100 µA
15
Max. C
T
(pF)
@ V
R
= 0 V
1.0
Max. V
F
@
1 mA (mV)
f = 100 MHz
 I
F
= 10 mA
àI
F
= 5 mA
340
1
2
4
3
5
1
4
3
5
1
2
4
6
3
5
7
Surface Mount High Performance Schottky Diodes
DC Electrical Specifications:
T
A
= +25¡C, single diode.
Mfr.Õs
Type
Bulk
HSMS-2850-BLK
Ñ
HSMS-2855-BLK
HSMS-2863-BLK
Tape and
Reel
Ñ
HSMS-2852-TR1
Ñ
Ñ
Max.
Forward
Voltage
V
F
(mV)
IF = 1.0 mA
150
150
150
250
Min.
Breakdown
Voltage
V
BR
(V)
I
R
= 10 µA
250
250
250
350
Typ. C
T
(pF)
@ VR = Ð0.5 to Ð1.0 V
f = 1 MHz
0.30
0.30
0.30
0.25
Fig.
2
4
5
6
Silicon Monolithic Integrated Circuits
Low Noise Amplifiers
Mfr.Õs
Type
INA-02186-BLK
INA-10386-BLK
MSA-0611-BLK
GP @
0.1 GHz
(dB)
31.5
25.0
19.5
Typical specifications at +25¡C case temperature.
GP @
1 GHz
(dB)
28.5
25.0
15.0
NF @
1 GHz
(dB)
2.0 
3.7 
3.2
P
1dB
(dBm)
+11.0
+11.0
+2.0
Min. Supply
Voltage
(V
cc
)*
5.5
6.0
5.0
Device
Voltage
(V
d
)*
5.5
6.0
3.3
Device
Current
(mA)*
35
50
16
Package
86 Plastic
86 Plastic
SOT-143 SM Plastic
*Refer to schematic drawing.  Noise figure at 0.5 GHz.
General Purpose GaAs FETs
Mfr.Õs
Type
ATF-26884-STR
Gate Width
(µm)
250
Typical specifications at +25¡C case temperature.
Optimum
Freq. Range
(GHz)
2.0-16
Test Freq.
(GHz)
12
NF
o
(dB)
2.2
G
a
(dB)
9.0
P
1dB
(dBm)
+18
Package
84 Plastic
High Speed Digital Communications
Variable Gain Control Amplifier
Mfr.Õs
Type
IVA-14208-STR
GP @
(dB)
24 @ 1.0 GHz
Typical specifications at +25¡C case temperature.
Gain
Control Range
(dB)
34 @ 1.0 GHz
3 db
Bandwidth
(GHz)
2.5
P
1dB
@
0.5 GHz
Ñ
Supply
Voltage
(V)
6
Device
Current
(mA)
3.8
Package
SO-8 SM Plastic
13
Wide Dynamic Range Amplifier
Mfr.Õs
Type
MSA-1105-STR
GP @
0.1 GHz
(dB)
12.5
GP @
1 GHz
(dB)
10.5
Typical specifications at +25¡C case temperature.
NF
(dB)
4.2
P
1dB
(dBm)
+17.5
Min. Supply
Voltage
(V
cc
)*
8
Device
Voltage
(V
d
)*
5.5
Device
Current
(mA)*
60
Package
05 Plastic
*Refer to schematic drawing.
Low Noise Amplifier
Mfr.Õs
Type
INA-03184-BLK
Typical specifications at +25¡C case temperature.
GP @
0.1 GHz
(dB)
25.5
GP @
1 GHz
(dB)
25.0
NF @
1 GHz
(dB)
2.6
P
1dB
(dBm)
Ð2.0
Min. Supply
Voltage
(V
cc
)*
4
Device
Voltage
(V
d
)*
4.0
Device
Current
(mA)*
10
Package
84 Plastic
*Refer to schematic drawing.
3-Port Double-Balanced Mixers
Mfr.Õs
Type
IAM-82008-STR
IAM-81008-STR
RF and LO
Freq.
(GHz)
0.05-5.0
0.05-5.0
Typical specifications at +25¡C case temperature.
Active Max. IF
Freq. with Gain
(GHz)
Up to 2.0
Up to 1.0
RF-IF
Gain
(dB)
15.0*
8.5 
IP
3
(dBm)
+18*
+3 
LO-RF
Iso.
(dB)
22*
30 
Supply
Voltage
(V)
10
5
Device
Current
(mA)
55
13
Package
SO-8 SM
SO-8 SM
*Noise figure at 0.1 GHz.  Refer to schematic drawing.
Turn To Section 1 For Allied Office Addresses and Local Phone Numbers
ALLIED
c
791

HSMS-2804-BLK Related Products

HSMS-2804-BLK RNR55E2641BMRSL65 HSMS-2863-BLK HSMS-2802-TR1 HSMS-2802-BLK HSMS-2805-BLK
Description SILICON, MIXER DIODE, SOT-23, 3 PIN Fixed Resistor, Metal Film, 0.1W, 2640ohm, 200V, 0.1% +/-Tol, 25ppm/Cel, Through Hole Mount, AXIAL LEADED SILICON, UHF-C BAND, MIXER DIODE, SOT-23, 3 PIN Mixer Diode, Silicon, SOT-23, 3 PIN SILICON, MIXER DIODE, SOT-23, 3 PIN SILICON, MIXER DIODE, SOT-143, 4 PIN
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
package instruction R-PDSO-G3 AXIAL LEADED R-PDSO-G3 R-PDSO-G3 SOT-23, 3 PIN R-PDSO-G4
Reach Compliance Code unknown compliant unknown unknown unknown unknown
Number of terminals 3 2 3 3 3 4
Package form SMALL OUTLINE Axial SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
surface mount YES NO YES YES YES YES
technology SCHOTTKY METAL FILM SCHOTTKY SCHOTTKY SCHOTTKY SCHOTTKY
Maker HP(Keysight) - HP(Keysight) HP(Keysight) HP(Keysight) HP(Keysight)
Parts packaging code SOT-23 - SOT-23 SOT-23 SOT-23 SOT-143
Contacts 3 - 3 3 3 4
Configuration COMMON CATHODE, 2 ELEMENTS - COMMON ANODE, 2 ELEMENTS SERIES CONNECTED, CENTER TAP, 2 ELEMENTS SERIES CONNECTED, CENTER TAP, 2 ELEMENTS SEPARATE, 2 ELEMENTS
Maximum diode capacitance 2 pF - - 2 pF 2 pF 0.2 pF
Diode component materials SILICON - SILICON SILICON SILICON SILICON
Diode type MIXER DIODE - MIXER DIODE MIXER DIODE MIXER DIODE MIXER DIODE
Maximum forward voltage (VF) 0.4 V - - 0.4 V 0.4 V 0.4 V
JESD-30 code R-PDSO-G3 - R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G4
JESD-609 code e0 - - e0 e0 e0
Humidity sensitivity level NOT SPECIFIED - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
Number of components 2 - 2 2 2 2
Maximum operating temperature 150 °C 175 °C - 150 °C 150 °C 150 °C
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified
Maximum repetitive peak reverse voltage 70 V - - 70 V 70 V 70 V
Terminal surface Tin/Lead (Sn/Pb) - - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING - GULL WING GULL WING GULL WING GULL WING
Terminal location DUAL - DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Lei Jun lost the 1 billion bet with Dong Mingzhu. It seems that the typhoon still can't blow up the pigs.
[color=#000][font=-apple-system-font, "][size=19px]Xiaomi Group announced its 2018 annual report on the 19th: Xiaomi achieved revenue of 174.915 billion yuan. So far, the five-year, billion-dollar bet...
高进 Talking
Please tell me what warming means
After my code is compiled, a warming occurs, and the content is as follows: Warning: LATCH primitive "ether_mac:ether_mac|ethermac_recv:recv|fsm_ram_wr_ns.RECV_PRENUM_7327" is permanently enabled. Exc...
zgm1193 FPGA/CPLD
Infrared decoding LPC214X
I saw the following infrared code structure in a tutorial. I don't understand how the 1.125ms period representing 0 is converted into 0x109c0? How is the 2.25ms period representing 1 converted into 0x...
tekkon MCU
The pad is 0.3mm/center distance is 0.5mm and the wire cannot come out
In this case, I wonder how you guys route the wires? I used padless vias with inner and outer diameters of 0.3mm, and routed them from the bottom layer. Now I have a problem, some power vias cannot be...
yangxf1217 PCB Design
Switching Power Supply Design Series 2 - "EMI Suppression"
[font=微软雅黑][size=3]Following [url=https://www.eeworld.com.cn/training/2014/TI_power_0213/383.html]《Switching Power Supply Design: PCB Thermal Management》[/url], Daxuetang has launched another practica...
linjiang Analogue and Mixed Signal
MicroPython will be upgraded to 1.9.1
MicroPython will be upgraded to 1.9.1 to fix the USB bug on Win10....
dcexpert MicroPython Open Source section

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2717  317  2260  2277  1126  55  7  46  23  50 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号