|
MM74HC266N |
MM74HC266J |
MM54HC266J |
| Description |
HC/UH SERIES, QUAD 2-INPUT XNOR GATE, PDIP14, PLASTIC, DIP-14 |
HC/UH SERIES, QUAD 2-INPUT XNOR GATE, CDIP14, CERDIP-14 |
HC/UH SERIES, QUAD 2-INPUT XNOR GATE, CDIP14, CERDIP-14 |
| Is it lead-free? |
Contains lead |
Contains lead |
Contains lead |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
| Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Parts packaging code |
DIP |
DIP |
DIP |
| package instruction |
DIP, DIP14,.3 |
DIP, DIP14,.3 |
DIP, DIP14,.3 |
| Contacts |
14 |
14 |
14 |
| Reach Compliance Code |
unknown |
unknown |
unknow |
| series |
HC/UH |
HC/UH |
HC/UH |
| JESD-30 code |
R-PDIP-T14 |
R-GDIP-T14 |
R-GDIP-T14 |
| JESD-609 code |
e0 |
e0 |
e0 |
| length |
19.215 mm |
19.43 mm |
19.43 mm |
| Load capacitance (CL) |
50 pF |
50 pF |
50 pF |
| Logic integrated circuit type |
XNOR GATE |
XNOR GATE |
XNOR GATE |
| Number of functions |
4 |
4 |
4 |
| Number of entries |
2 |
2 |
2 |
| Number of terminals |
14 |
14 |
14 |
| Maximum operating temperature |
85 °C |
85 °C |
125 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-55 °C |
| Output characteristics |
OPEN-DRAIN |
OPEN-DRAIN |
OPEN-DRAIN |
| Package body material |
PLASTIC/EPOXY |
CERAMIC, GLASS-SEALED |
CERAMIC, GLASS-SEALED |
| encapsulated code |
DIP |
DIP |
DIP |
| Encapsulate equivalent code |
DIP14,.3 |
DIP14,.3 |
DIP14,.3 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
IN-LINE |
IN-LINE |
IN-LINE |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| power supply |
2/6 V |
2/6 V |
2/6 V |
| propagation delay (tpd) |
30 ns |
30 ns |
36 ns |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
| Schmitt trigger |
NO |
NO |
NO |
| Maximum seat height |
5.08 mm |
5.08 mm |
5.08 mm |
| Maximum supply voltage (Vsup) |
6 V |
6 V |
6 V |
| Minimum supply voltage (Vsup) |
2 V |
2 V |
2 V |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
| surface mount |
NO |
NO |
NO |
| technology |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
MILITARY |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
| Terminal pitch |
2.54 mm |
2.54 mm |
2.54 mm |
| Terminal location |
DUAL |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
7.62 mm |
7.62 mm |
7.62 mm |