Low-Voltage 16-Bit I2C and SMBus I/O Expander 24-BGA MICROSTAR JUNIOR -40 to 85
| Parameter Name | Attribute value |
| Brand Name | Texas Instruments |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Texas Instruments |
| Parts packaging code | BGA |
| package instruction | VFBGA, BGA24,5X5,20 |
| Contacts | 24 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Factory Lead Time | 1 week |
| Other features | IT ALSO OPERATES AT 2.5V, 3.3V AND 5V |
| maximum clock frequency | 0.4 MHz |
| JESD-30 code | S-PBGA-B24 |
| JESD-609 code | e1 |
| length | 3 mm |
| Humidity sensitivity level | 1 |
| Number of digits | 16 |
| Number of I/O lines | 16 |
| Number of ports | 2 |
| Number of terminals | 24 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | VFBGA |
| Encapsulate equivalent code | BGA24,5X5,20 |
| Package shape | SQUARE |
| Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 1.8/5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1 mm |
| Maximum slew rate | 0.02 mA |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 1.65 V |
| Nominal supply voltage | 1.8 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form | BALL |
| Terminal pitch | 0.5 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 3 mm |
| uPs/uCs/peripheral integrated circuit type | PARALLEL IO PORT, GENERAL PURPOSE |
| TCA6416AZQSR | TCA6416ARTWR | |
|---|---|---|
| Description | Low-Voltage 16-Bit I2C and SMBus I/O Expander 24-BGA MICROSTAR JUNIOR -40 to 85 | Low-Voltage 16-Bit I2C and SMBus I/O Expander 24-WQFN -40 to 85 |
| Brand Name | Texas Instruments | Texas Instruments |
| Is it lead-free? | Lead free | Lead free |
| Is it Rohs certified? | conform to | conform to |
| Maker | Texas Instruments | Texas Instruments |
| Parts packaging code | BGA | QFN |
| package instruction | VFBGA, BGA24,5X5,20 | QFN-24 |
| Contacts | 24 | 24 |
| Reach Compliance Code | compli | compli |
| ECCN code | EAR99 | EAR99 |
| Factory Lead Time | 1 week | 1 week |
| maximum clock frequency | 0.4 MHz | 0.4 MHz |
| JESD-30 code | S-PBGA-B24 | S-PQCC-N24 |
| JESD-609 code | e1 | e4 |
| length | 3 mm | 4 mm |
| Humidity sensitivity level | 1 | 2 |
| Number of digits | 16 | 16 |
| Number of I/O lines | 16 | 16 |
| Number of ports | 2 | 2 |
| Number of terminals | 24 | 24 |
| Maximum operating temperature | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | VFBGA | HVQCCN |
| Encapsulate equivalent code | BGA24,5X5,20 | LCC24,.16SQ,20 |
| Package shape | SQUARE | SQUARE |
| Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 260 | 260 |
| power supply | 1.8/5 V | 1.8/5 V |
| Certification status | Not Qualified | Not Qualified |
| Maximum seat height | 1 mm | 0.8 mm |
| Maximum slew rate | 0.02 mA | 0.02 mA |
| Maximum supply voltage | 5.5 V | 5.5 V |
| Minimum supply voltage | 1.65 V | 1.65 V |
| Nominal supply voltage | 1.8 V | 1.8 V |
| surface mount | YES | YES |
| technology | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form | BALL | NO LEAD |
| Terminal pitch | 0.5 mm | 0.5 mm |
| Terminal location | BOTTOM | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
| width | 3 mm | 4 mm |
| uPs/uCs/peripheral integrated circuit type | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE |
| Part Number | Manufacturer | Description |
|---|---|---|
| MAX7314ATG | Rochester Electronics | 16 I/O, PIA-GENERAL PURPOSE, QCC24, 4 X 4 MM, 0.80 MM HEIGHT, MO-220WGGD2, TQFN-24 |
| MAX7312ATG | Rochester Electronics | 16 I/O, PIA-GENERAL PURPOSE, QCC24, 4 X 4 MM, 0.80 MM PITCH, MO-220WGGD-2, TQFN-24 |
| PCA9555RGERG4 | Texas Instruments(德州仪器) | Remote 16-Bit I2C And SMBus I/O Expander With Interrupt Output And Configuration Registers 24-VQFN -40 to 85 |
| PCA9535CHF | NXP(恩智浦) | 16-bit I2C and SMBus, low power I/O port with interrupt |
| PCA9539BS | NXP(恩智浦) | 16 I/O, PIA-GENERAL PURPOSE, PDSO24 |
| PCA9555AHF | NXP(恩智浦) | Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up |
| PCA9535AHF,128 | NXP(恩智浦) | 接口-I/O扩展器 16bit I2C IO Port |
| MAX7318ATG+ | Maxim(美信半导体) | interface - I/O expanders 16-bit I/O port expander |
| MAX7314ATG+ | Maxim(美信半导体) | Interface - I/O Expanders 18-Port GPIO |
| MAX7313ATG+ | Maxim(美信半导体) | Interface - I/O Expanders 16-Bit I/O Port Expander |
| PCA9539RBS | NXP(恩智浦) | 16 I/O, PIA-GENERAL PURPOSE, PDSO24 |
| MAX7313ATG+T | Maxim(美信半导体) | Interface - I/O Expanders 16-Bit I/O Port Expander |
| MAX7311ATG+ | Maxim(美信半导体) | interface - I/O expanders 16-bit I/O port expander |
| PCA9539RBS,118 | NXP(恩智浦) | IC I/O EXPANDER I2C 16B 24HVQFN |
| PCA9555RGER | Texas Instruments(德州仪器) | Remote 16-Bit I2C And SMBus I/O Expander With Interrupt Output And Configuration Registers 24-VQFN -40 to 85 |
| MAX7312ATG+T | Maxim(美信半导体) | interface - I/O expanders 16-bit I/O port expander |
| TCA6416ARTWR | Texas Instruments(德州仪器) | Low-Voltage 16-Bit I2C and SMBus I/O Expander 24-WQFN -40 to 85 |
| MAX7311ATG+T | NXP(恩智浦) | IC,I/O PORT,16-BIT,BICMOS,LLCC,24PIN,PLASTIC |
| PCA9535HF | NXP(恩智浦) | 16-bit I2C and SMBus, low power I/O port with interrupt |
| PCA9555AHF,128 | NXP(恩智浦) | 接口-I/O扩展器 Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up |
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