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MH89790BN

Description
Framer, Hybrid, PDIP40,
CategoryWireless rf/communication    Telecom circuit   
File Size488KB,32 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric Compare View All

MH89790BN Overview

Framer, Hybrid, PDIP40,

MH89790BN Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeDIP
package instructionDIP, DIP40,.8
Contacts40
Reach Compliance Codeunknown
JESD-30 codeR-PDIP-T40
JESD-609 codee0
Number of functions1
Number of terminals40
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP40,.8
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum slew rate45 mA
Nominal supply voltage5 V
surface mountNO
technologyHYBRID
Telecom integrated circuit typesFRAMER
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
®
ST-BUS™ FAMILY
MH89790B
CEPT PCM 30/CRC-4 Framer & Interface
Preliminary Information
Features
Complete primary rate 2048 kbit/s CEPT
transceiver with CRC-4 option
Selectable HDB3 or AMI line code
Two frame elastic buffer with 32µs jitter buffer
Tx and Rx frame and multiframe
synchroniza-tion signals
Frame alignment and CRC error counters
Insertion and detection of A, B, C, D signalling
bits with optional debounce
Line driver and receiver
Per channel, overall, and remote loop around
Digital phase detector between E1 line and
ST-BUS
ST-BUS compatible
Pin compatible with the MH89790
Inductorless clock recovery
Loss of Signal (LOS) indication
Available in standard, narrow and surface
mount formats
Supports single supply rail operation
MH89790B
MH89790BN
MH89790BS
ISSUE 5
May 1995
Ordering Information
40 Pin DIL Hybrid 1.3” row pitch
40 Pin DIL Hybrid 0.8“ row pitch
40 Pin Surface Mount Hybrid
0°C to 70°C
Description
The MH89790B is Mitel’s CEPT PCM 30 interface
solution, designed to meet the latest CCITT
standards PCM 30 format with CRC-4.
The
MH89790B provides a complete interface between a
2.048 Mbit/sec digital trunk and Mitel’s
Serial
Telecom Bus, the ST-BUS.
The MH89790B is a pin-compatible enhancement of
the MH89790, permitting the removal of the tuneable
inductor and inclusion of the external NAND gate
used for generating RxD.
Applications
Primary rate ISDN network nodes
Multiplexing equipment
Private network: PBX to PBX links
TxMF
C2i
F0i
RxMF
DSTo
DSTi
CSTi0
CSTi1
CSTo
ST-BUS
Timing
Cicuitry
Digital
Attenu-
ator
ROM
2 Frame
Elastic
Buffer
with Slip
Control
PADi
TxG
PADo
CEPT
Link
Interface
Transmitter
OUTA
OUTB
RxA
RxT
Receiver
LOS
RxR
RxB
Data
Interface
Serial
Control
Interface
ABCD
Signalling RAM
Control
Logic
Phase
Detector
Clock
Extractor
CEPT
Counter
E2o
VDD
ADl
XCtl
XSt
E8Ko
VSS
Figure 1 - Functional Block Diagram
4-187

MH89790BN Related Products

MH89790BN MH89790B MH89790BS
Description Framer, Hybrid, PDIP40, Framer, Hybrid, PDIP40, Framer, Hybrid, PDSO40,
Is it Rohs certified? incompatible incompatible incompatible
Maker Microsemi Microsemi Microsemi
Parts packaging code DIP DIP SOIC
package instruction DIP, DIP40,.8 DIP, DIP40,1.3 SOP, GWDIP40,.9
Contacts 40 40 40
Reach Compliance Code unknown unknown unknown
JESD-30 code R-PDIP-T40 R-PDIP-T40 R-PDSO-G40
JESD-609 code e0 e0 e0
Number of functions 1 1 1
Number of terminals 40 40 40
Maximum operating temperature 70 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP SOP
Encapsulate equivalent code DIP40,.8 DIP40,1.3 GWDIP40,.9
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum slew rate 45 mA 45 mA 45 mA
Nominal supply voltage 5 V 5 V 5 V
surface mount NO NO YES
technology HYBRID HYBRID HYBRID
Telecom integrated circuit types FRAMER FRAMER FRAMER
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE GULL WING
Terminal pitch 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Is it lead-free? Contains lead Contains lead -
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