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MC87C251SB16

Description
Microcontroller, 8-Bit, UVPROM, 16MHz, CMOS, CDIP40, SIDE BRAZED, DIP-40
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size509KB,33 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
Download Datasheet Parametric Compare View All

MC87C251SB16 Overview

Microcontroller, 8-Bit, UVPROM, 16MHz, CMOS, CDIP40, SIDE BRAZED, DIP-40

MC87C251SB16 Parametric

Parameter NameAttribute value
MakerIntel
Parts packaging codeDIP
package instructionDIP,
Contacts40
Reach Compliance Codecompliant
ECCN code3A001.A.2.C
Has ADCNO
Address bus width18
bit size8
maximum clock frequency16 MHz
DAC channelNO
DMA channelNO
External data bus width8
JESD-30 codeR-CDIP-T40
Number of I/O lines32
Number of terminals40
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
PWM channelYES
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
ROM programmabilityUVPROM
speed16 MHz
Maximum slew rate85 mA
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal formTHROUGH-HOLE
Terminal locationDUAL
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER

MC87C251SB16 Related Products

MC87C251SB16 MR87C251SB16 TR87C251SB16
Description Microcontroller, 8-Bit, UVPROM, 16MHz, CMOS, CDIP40, SIDE BRAZED, DIP-40 Microcontroller, 8-Bit, UVPROM, 80251 CPU, 16MHz, CMOS, CQCC44, LCC-44 Microcontroller, 8-Bit, UVPROM, 16MHz, CMOS, CQCC44, LCC-44
Maker Intel Intel Intel
Parts packaging code DIP LCC LCC
package instruction DIP, LCC-44 QCCN,
Contacts 40 44 44
Reach Compliance Code compliant compliant unknown
Has ADC NO NO NO
Address bus width 18 18 18
bit size 8 8 8
maximum clock frequency 16 MHz 16 MHz 16 MHz
DAC channel NO NO NO
DMA channel NO NO NO
External data bus width 8 8 8
JESD-30 code R-CDIP-T40 S-CQCC-N44 S-CQCC-N44
Number of I/O lines 32 32 32
Number of terminals 40 44 44
Maximum operating temperature 125 °C 125 °C 110 °C
Minimum operating temperature -55 °C -55 °C -40 °C
PWM channel YES YES YES
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code DIP QCCN QCCN
Package shape RECTANGULAR SQUARE SQUARE
Package form IN-LINE CHIP CARRIER CHIP CARRIER
Certification status Not Qualified Not Qualified Not Qualified
ROM programmability UVPROM UVPROM UVPROM
speed 16 MHz 16 MHz 16 MHz
Maximum slew rate 85 mA 85 mA 85 mA
Maximum supply voltage 5.5 V 5.5 V 5.5 V
Minimum supply voltage 4.5 V 4.5 V 4.5 V
surface mount NO YES YES
technology CMOS CMOS CMOS
Temperature level MILITARY MILITARY INDUSTRIAL
Terminal form THROUGH-HOLE NO LEAD NO LEAD
Terminal location DUAL QUAD QUAD
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER
ECCN code 3A001.A.2.C 3A001.A.2.C -
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