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MPC7400RX400LX

Description
RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size56KB,16 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

MPC7400RX400LX Overview

RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360

MPC7400RX400LX Parametric

Parameter NameAttribute value
MakerMotorola ( NXP )
package instructionBGA,
Reach Compliance Codeunknown
ECCN code3A001.A.3
Other featuresALSO REQUIRES 1.8V, 2.5V AND 3.3V I/O SUPPLY
Address bus width32
bit size32
boundary scanYES
maximum clock frequency100 MHz
External data bus width64
FormatFLOATING POINT
Integrated cacheYES
JESD-30 codeS-CBGA-B360
length25 mm
low power modeYES
Number of terminals360
Maximum operating temperature105 °C
Minimum operating temperature
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Certification statusNot Qualified
Maximum seat height3.2 mm
speed400 MHz
Maximum supply voltage1.9 V
Minimum supply voltage1.7 V
Nominal supply voltage1.8 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
width25 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
Advance Information
AN1812/D
Rev. 1, 12/2001
Common Footprint for the
MPC750, MPC755,
MPC7400, and MPC7410
CPD Applications
This document describes how to design a platform with a common footprint for the MPC750,
MPC755, MPC7400, and MPC7410; that is, it is intended to help design a single board
compatible with all of these devices. Although this document contains relevant information, it
is not intended to be a complete migration guide for moving from G3- to G4-class systems.
As a general note, refer to the appropriate hardware specifications and user’s manual for the
specific device under consideration.
For this document, the following system definition is assumed for the MPC750, MPC755,
MPC7400 and MPC7410:
64-bit data bus mode
No data retry
Bus operates in 60x mode
Note that all the CPUs can run in 60x bus, and the MPC7400 and MPC7410 have the ability
to run in an enhanced mode MPX.

MPC7400RX400LX Related Products

MPC7400RX400LX MPC755BPX300TD XPC755BRX300LE MPC755BRX400LX MPC755BZT300RD MPC7410RX400LX
Description RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, PLASTIC, BGA-360 RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, CERAMIC, BGA-360 RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, PLASTIC, BGA-360 RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
package instruction BGA, BGA, 25 X 25 MM, CERAMIC, BGA-360 BGA, BGA, BGA,
Reach Compliance Code unknown unknown unknown unknown unknown unknown
Address bus width 32 32 32 32 32 32
bit size 32 32 32 32 32 32
boundary scan YES NO YES YES NO YES
External data bus width 64 64 64 64 64 64
Format FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT
Integrated cache YES YES YES YES YES YES
JESD-30 code S-CBGA-B360 S-PBGA-B360 S-CBGA-B360 S-CBGA-B360 S-PBGA-B360 S-CBGA-B360
low power mode YES YES YES YES YES YES
Number of terminals 360 360 360 360 360 360
Package body material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
encapsulated code BGA BGA BGA BGA BGA BGA
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
speed 400 MHz 300 MHz 300 MHz 400 MHz 300 MHz 400 MHz
Nominal supply voltage 1.8 V 2 V 2 V 2 V 2 V 1.8 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Terminal form BALL BALL BALL BALL BALL BALL
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Maker Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) - Motorola ( NXP ) Motorola ( NXP )
ECCN code 3A001.A.3 - 3A001.A.3 3A001.A.3 - 3A001.A.3
maximum clock frequency 100 MHz - 100 MHz 100 MHz - 133 MHz
length 25 mm - 25 mm 25 mm - 25 mm
Maximum seat height 3.2 mm - 3.2 mm 3.2 mm - 3.2 mm
Maximum supply voltage 1.9 V - 2.1 V 2.1 V - 1.9 V
Minimum supply voltage 1.7 V - 1.8 V 1.9 V - 1.7 V
Terminal pitch 1.27 mm - 1.27 mm 1.27 mm - 1.27 mm
width 25 mm - 25 mm 25 mm - 25 mm

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