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SN74AUP3G34DCUR

Description
Low-Power Triple Buffer Gate 8-VSSOP -40 to 85
Categorylogic    logic   
File Size1MB,22 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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SN74AUP3G34DCUR Overview

Low-Power Triple Buffer Gate 8-VSSOP -40 to 85

SN74AUP3G34DCUR Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeSOIC
package instructionSSOP-8
Contacts8
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time6 weeks
seriesAUP/ULP/V
JESD-30 codeR-PDSO-G8
JESD-609 codee4
length2.3 mm
Load capacitance (CL)30 pF
Logic integrated circuit typeBUFFER
MaximumI(ol)0.004 A
Humidity sensitivity level1
Number of functions3
Number of entries1
Number of terminals8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeVSSOP
Encapsulate equivalent codeTSSOP8,.12,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
method of packingTR
Peak Reflow Temperature (Celsius)260
power supply1.2/3.3 V
Maximum supply current (ICC)0.0009 mA
Prop。Delay @ Nom-Sup25.5 ns
propagation delay (tpd)25.5 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height0.9 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)0.8 V
Nominal supply voltage (Vsup)1.2 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width2 mm
Base Number Matches1

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Description Low-Power Triple Buffer Gate 8-VSSOP -40 to 85 Low-Power Triple Buffer Gate 8-DSBGA -40 to 85 Low-Power Triple Buffer Gate 8-X2SON -40 to 85 Low-Power Triple Buffer Gate 8-UQFN -40 to 85 Low-Power Triple Buffer Gate 8-VSSOP -40 to 85
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Is it lead-free? Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Parts packaging code SOIC BGA SON QFN SOIC
package instruction SSOP-8 DSBGA-8 VSON, SOLCC8,.04,14 VQCCN, LCC8,.06SQ,20 VSSOP, TSSOP8,.12,20
Contacts 8 8 8 8 8
Reach Compliance Code compliant compliant compliant compliant compliant
Factory Lead Time 6 weeks 1 week 6 weeks 6 weeks 6 weeks
series AUP/ULP/V AUP/ULP/V AUP/ULP/V AUP/ULP/V AUP/ULP/V
JESD-30 code R-PDSO-G8 R-XBGA-B8 R-PDSO-N8 S-PQCC-N8 R-PDSO-G8
JESD-609 code e4 e1 e4 e4 e4
length 2.3 mm 1.57 mm 1.4 mm 1.5 mm 2.3 mm
Load capacitance (CL) 30 pF 30 pF 30 pF 30 pF 30 pF
Logic integrated circuit type BUFFER BUFFER BUFFER BUFFER BUFFER
MaximumI(ol) 0.004 A 0.004 A 0.004 A 0.004 A 0.004 A
Humidity sensitivity level 1 1 1 1 1
Number of functions 3 3 3 3 3
Number of entries 1 1 1 1 1
Number of terminals 8 8 8 8 8
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code VSSOP VFBGA VSON VQCCN VSSOP
Encapsulate equivalent code TSSOP8,.12,20 BGA8,2X4,16 SOLCC8,.04,14 LCC8,.06SQ,20 TSSOP8,.12,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR
Package form SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, VERY THIN PROFILE CHIP CARRIER, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
method of packing TR TR TR TR TR
Peak Reflow Temperature (Celsius) 260 260 260 260 260
power supply 1.2/3.3 V 1.2/3.3 V 1.2/3.3 V 1.2/3.3 V 1.2/3.3 V
Maximum supply current (ICC) 0.0009 mA 0.0009 mA 0.0009 mA 0.0009 mA 0.0009 mA
Prop。Delay @ Nom-Sup 25.5 ns 25.5 ns 25.5 ns 25.5 ns 25.5 ns
propagation delay (tpd) 25.5 ns 25.5 ns 25.5 ns 25.5 ns 25.5 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO NO NO
Maximum seat height 0.9 mm 0.5 mm 0.4 mm 0.6 mm 0.9 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 0.8 V 0.8 V 0.8 V 0.8 V 0.8 V
Nominal supply voltage (Vsup) 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Silver/Copper (Sn/Ag/Cu) Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form GULL WING BALL NO LEAD NO LEAD GULL WING
Terminal pitch 0.5 mm 0.4 mm 0.35 mm 0.5 mm 0.5 mm
Terminal location DUAL BOTTOM DUAL QUAD DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 2 mm 0.77 mm 1 mm 1.5 mm 2 mm
ECCN code EAR99 EAR99 EAR99 EAR99 -
Base Number Matches 1 1 - 1 1
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