SN74AUP3G34YFPR datasheet, PDF

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SN74AUP3G34YFPR: DescriptionLow-Power Triple Buffer Gate 8-DSBGA -40 to 85; Categorylogic logic; File Size1MB，22 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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SN74AUP3G34YFPR Overview

Low-Power Triple Buffer Gate 8-DSBGA -40 to 85

SN74AUP3G34YFPR Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	DSBGA-8
Contacts	8
Reach Compliance Code	compliant
ECCN code	EAR99
Factory Lead Time	1 week
Samacsys Description	LOW-POWER TRIPLE BUFFER GATE
series	AUP/ULP/V
JESD-30 code	R-XBGA-B8
JESD-609 code	e1
length	1.57 mm
Load capacitance (CL)	30 pF
Logic integrated circuit type	BUFFER
MaximumI(ol)	0.004 A
Humidity sensitivity level	1
Number of functions	3
Number of entries	1
Number of terminals	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	UNSPECIFIED
encapsulated code	VFBGA
Encapsulate equivalent code	BGA8,2X4,16
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing	TR
Peak Reflow Temperature (Celsius)	260
power supply	1.2/3.3 V
Maximum supply current (ICC)	0.0009 mA
Prop。Delay @ Nom-Sup	25.5 ns
propagation delay (tpd)	25.5 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	0.5 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	0.8 V
Nominal supply voltage (Vsup)	1.2 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.4 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	0.77 mm
Base Number Matches	1

SN74AUP3G34YFPR Related Products

	SN74AUP3G34YFPR	SN74AUP3G34DCUR	SN74AUP3G34DQER	SN74AUP3G34RSER	SN74AUP3G34DCURG4
Description	Low-Power Triple Buffer Gate 8-DSBGA -40 to 85	Low-Power Triple Buffer Gate 8-VSSOP -40 to 85	Low-Power Triple Buffer Gate 8-X2SON -40 to 85	Low-Power Triple Buffer Gate 8-UQFN -40 to 85	Low-Power Triple Buffer Gate 8-VSSOP -40 to 85
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	BGA	SOIC	SON	QFN	SOIC
package instruction	DSBGA-8	SSOP-8	VSON, SOLCC8,.04,14	VQCCN, LCC8,.06SQ,20	VSSOP, TSSOP8,.12,20
Contacts	8	8	8	8	8
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant
Factory Lead Time	1 week	6 weeks	6 weeks	6 weeks	6 weeks
series	AUP/ULP/V	AUP/ULP/V	AUP/ULP/V	AUP/ULP/V	AUP/ULP/V
JESD-30 code	R-XBGA-B8	R-PDSO-G8	R-PDSO-N8	S-PQCC-N8	R-PDSO-G8
JESD-609 code	e1	e4	e4	e4	e4
length	1.57 mm	2.3 mm	1.4 mm	1.5 mm	2.3 mm
Load capacitance (CL)	30 pF	30 pF	30 pF	30 pF	30 pF
Logic integrated circuit type	BUFFER	BUFFER	BUFFER	BUFFER	BUFFER
MaximumI(ol)	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A
Humidity sensitivity level	1	1	1	1	1
Number of functions	3	3	3	3	3
Number of entries	1	1	1	1	1
Number of terminals	8	8	8	8	8
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VFBGA	VSSOP	VSON	VQCCN	VSSOP
Encapsulate equivalent code	BGA8,2X4,16	TSSOP8,.12,20	SOLCC8,.04,14	LCC8,.06SQ,20	TSSOP8,.12,20
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE	CHIP CARRIER, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
method of packing	TR	TR	TR	TR	TR
Peak Reflow Temperature (Celsius)	260	260	260	260	260
power supply	1.2/3.3 V	1.2/3.3 V	1.2/3.3 V	1.2/3.3 V	1.2/3.3 V
Maximum supply current (ICC)	0.0009 mA	0.0009 mA	0.0009 mA	0.0009 mA	0.0009 mA
Prop。Delay @ Nom-Sup	25.5 ns	25.5 ns	25.5 ns	25.5 ns	25.5 ns
propagation delay (tpd)	25.5 ns	25.5 ns	25.5 ns	25.5 ns	25.5 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	NO	NO	NO	NO
Maximum seat height	0.5 mm	0.9 mm	0.4 mm	0.6 mm	0.9 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	0.8 V	0.8 V	0.8 V	0.8 V	0.8 V
Nominal supply voltage (Vsup)	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	BALL	GULL WING	NO LEAD	NO LEAD	GULL WING
Terminal pitch	0.4 mm	0.5 mm	0.35 mm	0.5 mm	0.5 mm
Terminal location	BOTTOM	DUAL	DUAL	QUAD	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	0.77 mm	2 mm	1 mm	1.5 mm	2 mm
ECCN code	EAR99	EAR99	EAR99	EAR99	-
Base Number Matches	1	1	-	1	1

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