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MC74LCX374SD

Description
IC,FLIP-FLOP,OCTAL,D TYPE,LCX/LVC-CMOS,SSOP,20PIN,PLASTIC
Categorylogic    logic   
File Size262KB,5 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

MC74LCX374SD Overview

IC,FLIP-FLOP,OCTAL,D TYPE,LCX/LVC-CMOS,SSOP,20PIN,PLASTIC

MC74LCX374SD Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNXP
package instructionSSOP, SSOP20,.3
Reach Compliance Codeunknown
JESD-30 codeR-PDSO-G20
JESD-609 codee0
Load capacitance (CL)50 pF
Logic integrated circuit typeD FLIP-FLOP
Maximum Frequency@Nom-Sup150000000 Hz
MaximumI(ol)0.024 A
Number of functions8
Number of terminals20
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeSSOP
Encapsulate equivalent codeSSOP20,.3
Package shapeRECTANGULAR
Package formSMALL OUTLINE, SHRINK PITCH
power supply3.3 V
Prop。Delay @ Nom-Sup8.5 ns
Certification statusNot Qualified
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationDUAL
Trigger typePOSITIVE EDGE

MC74LCX374SD Related Products

MC74LCX374SD MC74LCX374DT
Description IC,FLIP-FLOP,OCTAL,D TYPE,LCX/LVC-CMOS,SSOP,20PIN,PLASTIC IC,FLIP-FLOP,OCTAL,D TYPE,LCX/LVC-CMOS,TSSOP,20PIN,PLASTIC
Is it Rohs certified? incompatible incompatible
Maker NXP NXP
package instruction SSOP, SSOP20,.3 TSSOP, TSSOP20,.25
Reach Compliance Code unknown unknown
JESD-30 code R-PDSO-G20 R-PDSO-G20
JESD-609 code e0 e0
Load capacitance (CL) 50 pF 50 pF
Logic integrated circuit type D FLIP-FLOP D FLIP-FLOP
Maximum Frequency@Nom-Sup 150000000 Hz 150000000 Hz
MaximumI(ol) 0.024 A 0.024 A
Number of functions 8 8
Number of terminals 20 20
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Output characteristics 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SSOP TSSOP
Encapsulate equivalent code SSOP20,.3 TSSOP20,.25
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
power supply 3.3 V 3.3 V
Prop。Delay @ Nom-Sup 8.5 ns 8.5 ns
Certification status Not Qualified Not Qualified
Nominal supply voltage (Vsup) 3.3 V 3.3 V
surface mount YES YES
technology CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING
Terminal pitch 0.635 mm 0.635 mm
Terminal location DUAL DUAL
Trigger type POSITIVE EDGE POSITIVE EDGE
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