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AS2524F

Description
SPEAKER PHONE CIRCUIT, UUC34
CategoryTopical application    Wireless rf/communication   
File Size708KB,20 Pages
ManufacturerAMS
Websitehttps://ams.com/zh
Download Datasheet Parametric Compare View All

AS2524F Overview

SPEAKER PHONE CIRCUIT, UUC34

AS2524F Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals34
Maximum operating temperature70 Cel
Minimum operating temperature-25 Cel
Processing package descriptionDIE
stateCONSULT MFR
CraftsmanshipCMOS
packaging shapeUNSPECIFIED
Package SizeUNCASED CHIP
surface mountYes
Terminal formNO LEAD
Terminal locationUPPER
Packaging MaterialsUNSPECIFIED
Temperature levelOTHER
Communication typeSPEAKER PHONE CIRCUIT
austriamicrosystems AG
is now
ams AG
The technical content of this austriamicrosystems datasheet is still valid.
Contact information:
Headquarters:
ams AG
Tobelbaderstrasse 30
8141 Unterpremstaetten, Austria
Tel: +43 (0) 3136 500 0
e-Mail:
ams_sales@ams.com
Please visit our website at
www.ams.com

AS2524F Related Products

AS2524F AS2523_1 AS2524B AS2523F AS2524BF AS2523T AS2524BT AS2524T AS2524TT
Description SPEAKER PHONE CIRCUIT, UUC34 AMS - AS2524 - IC; LINE/SPEAKER PHONE CIRCUIT; SOIC-28 AMS - AS2524 - IC; LINE/SPEAKER PHONE CIRCUIT; SOIC-28 SPEAKER PHONE CIRCUIT, UUC34 SPEAKER PHONE CIRCUIT, UUC SPEAKER PHONE CIRCUIT, PDSO28 SPEAKER PHONE CIRCUIT, PDSO28 SPEAKER PHONE CIRCUIT, PDSO28 AS2524 T SOIC28 LF T&RDP;
Number of functions 1 - - 1 1 1 1 1 -
Number of terminals 34 - - 34 - 28 28 28 -
Maximum operating temperature 70 Cel - - 70 Cel 70 Cel 70 Cel 70 Cel 70 °C -
Minimum operating temperature -25 Cel - - -25 Cel -25 Cel -25 Cel -25 Cel -25 °C -
Processing package description DIE - - DIE DIE Plastic, SOIC-28 PLASTIC, SOIC-28 - -
state CONSULT MFR - - CONSULT MFR CONSULT MFR CONSULT MFR CONSULT MFR - -
Craftsmanship CMOS - - CMOS CMOS CMOS CMOS - -
packaging shape UNSPECIFIED - - UNSPECIFIED UNSPECIFIED Rectangle RECTANGULAR - -
Package Size UNCASED CHIP - - UNCASED chip UNCASED CHIP SMALL OUTLINE SMALL OUTLINE - -
surface mount Yes - - Yes Yes Yes Yes YES -
Terminal form NO LEAD - - NO NO LEAD GULL WING GULL WING GULL WING -
Terminal location UPPER - - UPPER UPPER pair DUAL DUAL -
Packaging Materials UNSPECIFIED - - UNSPECIFIED UNSPECIFIED Plastic/Epoxy PLASTIC/EPOXY - -
Temperature level OTHER - - other OTHER other OTHER OTHER -
Communication type SPEAKER PHONE CIRCUIT - - speaker phone circuit SPEAKER PHONE CIRCUIT speaker phone circuit SPEAKER PHONE CIRCUIT - -

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