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AS2523T

Description
SPEAKER PHONE CIRCUIT, PDSO28
CategoryTopical application    Wireless rf/communication   
File Size708KB,20 Pages
ManufacturerAMS
Websitehttps://ams.com/zh
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AS2523T Overview

SPEAKER PHONE CIRCUIT, PDSO28

AS2523T Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals28
Maximum operating temperature70 Cel
Minimum operating temperature-25 Cel
Processing package descriptionPlastic, SOIC-28
Lead-freeYes
EU RoHS regulationsYes
stateCONSULT MFR
CraftsmanshipCMOS
packaging shapeRectangle
Package SizeSMALL OUTLINE
surface mountYes
Terminal formGULL WING
Terminal spacing1.27 mm
terminal coatingMATTE Tin
Terminal locationpair
Packaging MaterialsPlastic/Epoxy
Temperature levelother
Communication typespeaker phone circuit
austriamicrosystems AG
is now
ams AG
The technical content of this austriamicrosystems datasheet is still valid.
Contact information:
Headquarters:
ams AG
Tobelbaderstrasse 30
8141 Unterpremstaetten, Austria
Tel: +43 (0) 3136 500 0
e-Mail:
ams_sales@ams.com
Please visit our website at
www.ams.com

AS2523T Related Products

AS2523T AS2523_1 AS2524B AS2523F AS2524BF AS2524F AS2524BT AS2524T AS2524TT
Description SPEAKER PHONE CIRCUIT, PDSO28 AMS - AS2524 - IC; LINE/SPEAKER PHONE CIRCUIT; SOIC-28 AMS - AS2524 - IC; LINE/SPEAKER PHONE CIRCUIT; SOIC-28 SPEAKER PHONE CIRCUIT, UUC34 SPEAKER PHONE CIRCUIT, UUC SPEAKER PHONE CIRCUIT, UUC34 SPEAKER PHONE CIRCUIT, PDSO28 SPEAKER PHONE CIRCUIT, PDSO28 AS2524 T SOIC28 LF T&RDP;
Number of functions 1 - - 1 1 1 1 1 -
Number of terminals 28 - - 34 - 34 28 28 -
Maximum operating temperature 70 Cel - - 70 Cel 70 Cel 70 Cel 70 Cel 70 °C -
Minimum operating temperature -25 Cel - - -25 Cel -25 Cel -25 Cel -25 Cel -25 °C -
Processing package description Plastic, SOIC-28 - - DIE DIE DIE PLASTIC, SOIC-28 - -
state CONSULT MFR - - CONSULT MFR CONSULT MFR CONSULT MFR CONSULT MFR - -
Craftsmanship CMOS - - CMOS CMOS CMOS CMOS - -
packaging shape Rectangle - - UNSPECIFIED UNSPECIFIED UNSPECIFIED RECTANGULAR - -
Package Size SMALL OUTLINE - - UNCASED chip UNCASED CHIP UNCASED CHIP SMALL OUTLINE - -
surface mount Yes - - Yes Yes Yes Yes YES -
Terminal form GULL WING - - NO NO LEAD NO LEAD GULL WING GULL WING -
Terminal location pair - - UPPER UPPER UPPER DUAL DUAL -
Packaging Materials Plastic/Epoxy - - UNSPECIFIED UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY - -
Temperature level other - - other OTHER OTHER OTHER OTHER -
Communication type speaker phone circuit - - speaker phone circuit SPEAKER PHONE CIRCUIT SPEAKER PHONE CIRCUIT SPEAKER PHONE CIRCUIT - -

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