AS2524BT datasheet, PDF - EEWORLD Datasheet

AS2524BT: DescriptionSPEAKER PHONE CIRCUIT, PDSO28; CategoryTopical application Wireless rf/communication; File Size708KB，20 Pages; ManufacturerAMS; Websitehttps://ams.com/zh

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SPEAKER PHONE CIRCUIT, PDSO28

Parameter Name	Attribute value
Number of functions	1
Number of terminals	28
Maximum operating temperature	70 Cel
Minimum operating temperature	-25 Cel
Processing package description	PLASTIC, SOIC-28
state	CONSULT MFR
Craftsmanship	CMOS
packaging shape	RECTANGULAR
Package Size	SMALL OUTLINE
surface mount	Yes
Terminal form	GULL WING
Terminal location	DUAL
Packaging Materials	PLASTIC/EPOXY
Temperature level	OTHER
Communication type	SPEAKER PHONE CIRCUIT

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ams AG

The technical content of this austriamicrosystems datasheet is still valid.

Contact information:

Headquarters:

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8141 Unterpremstaetten, Austria

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	AS2524BT	AS2523_1	AS2524B	AS2523F	AS2524BF	AS2524F	AS2523T	AS2524T	AS2524TT
Description	SPEAKER PHONE CIRCUIT, PDSO28	AMS - AS2524 - IC; LINE/SPEAKER PHONE CIRCUIT; SOIC-28	AMS - AS2524 - IC; LINE/SPEAKER PHONE CIRCUIT; SOIC-28	SPEAKER PHONE CIRCUIT, UUC34	SPEAKER PHONE CIRCUIT, UUC	SPEAKER PHONE CIRCUIT, UUC34	SPEAKER PHONE CIRCUIT, PDSO28	SPEAKER PHONE CIRCUIT, PDSO28	AS2524 T SOIC28 LF T&RDP;
Number of functions	1	-	-	1	1	1	1	1	-
Number of terminals	28	-	-	34	-	34	28	28	-
Maximum operating temperature	70 Cel	-	-	70 Cel	70 Cel	70 Cel	70 Cel	70 °C	-
Minimum operating temperature	-25 Cel	-	-	-25 Cel	-25 Cel	-25 Cel	-25 Cel	-25 °C	-
Processing package description	PLASTIC, SOIC-28	-	-	DIE	DIE	DIE	Plastic, SOIC-28	-	-
state	CONSULT MFR	-	-	CONSULT MFR	CONSULT MFR	CONSULT MFR	CONSULT MFR	-	-
Craftsmanship	CMOS	-	-	CMOS	CMOS	CMOS	CMOS	-	-
packaging shape	RECTANGULAR	-	-	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	Rectangle	-	-
Package Size	SMALL OUTLINE	-	-	UNCASED chip	UNCASED CHIP	UNCASED CHIP	SMALL OUTLINE	-	-
surface mount	Yes	-	-	Yes	Yes	Yes	Yes	YES	-
Terminal form	GULL WING	-	-	NO	NO LEAD	NO LEAD	GULL WING	GULL WING	-
Terminal location	DUAL	-	-	UPPER	UPPER	UPPER	pair	DUAL	-
Packaging Materials	PLASTIC/EPOXY	-	-	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	Plastic/Epoxy	-	-
Temperature level	OTHER	-	-	other	OTHER	OTHER	other	OTHER	-
Communication type	SPEAKER PHONE CIRCUIT	-	-	speaker phone circuit	SPEAKER PHONE CIRCUIT	SPEAKER PHONE CIRCUIT	speaker phone circuit	-	-

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