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HY5PS2G431AMP

Description
2Gb DDR2 SDRAM(DDP)
File Size590KB,35 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
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HY5PS2G431AMP Overview

2Gb DDR2 SDRAM(DDP)

HY5PS2G431AMP
HY5PS2G831AMP
2Gb DDR2 SDRAM(DDP)
HY5PS2G431AMP
HY5PS2G831AMP
This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any
responsibility for use of circuits described. No patent licenses are implied.
Rev. 0.6 / Oct. 2007
1

HY5PS2G431AMP Related Products

HY5PS2G431AMP HY5PS2G431AMP-E3 HY5PS2G431AMP-C4 HY5PS2G431AMP-Y5 HY5PS2G831AMP HY5PS2G831AMP-C4 HY5PS2G831AMP-E3 HY5PS2G831AMP-Y5
Description 2Gb DDR2 SDRAM(DDP) 2Gb DDR2 SDRAM(DDP) 2Gb DDR2 SDRAM(DDP) 2Gb DDR2 SDRAM(DDP) 2Gb DDR2 SDRAM(DDP) 2Gb DDR2 SDRAM(DDP) 2Gb DDR2 SDRAM(DDP) 2Gb DDR2 SDRAM(DDP)
Is it Rohs certified? - conform to conform to conform to - conform to conform to conform to
Maker - SK Hynix SK Hynix SK Hynix - SK Hynix SK Hynix SK Hynix
Parts packaging code - BGA BGA BGA - BGA BGA BGA
package instruction - LFBGA, BGA71,9X19,32 LFBGA, BGA71,9X19,32 LFBGA, BGA71,9X19,32 - LFBGA, BGA71,9X19,32 LFBGA, BGA71,9X19,32 LFBGA, BGA71,9X19,32
Contacts - 71 71 71 - 71 71 71
Reach Compliance Code - unknow unknow unknow - unknow unknow unknow
ECCN code - EAR99 EAR99 EAR99 - EAR99 EAR99 EAR99
access mode - FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST - FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Maximum access time - 0.6 ns 0.5 ns 0.45 ns - 0.5 ns 0.6 ns 0.45 ns
Other features - AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH - AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
Maximum clock frequency (fCLK) - 200 MHz 267 MHz 333 MHz - 267 MHz 200 MHz 333 MHz
I/O type - COMMON COMMON COMMON - COMMON COMMON COMMON
interleaved burst length - 4,8 4,8 4,8 - 4,8 4,8 4,8
JESD-30 code - R-PBGA-B71 R-PBGA-B71 R-PBGA-B71 - R-PBGA-B71 R-PBGA-B71 R-PBGA-B71
JESD-609 code - e1 e1 e1 - e1 e1 e1
length - 17.5 mm 17.5 mm 17.5 mm - 17.5 mm 17.5 mm 17.5 mm
memory density - 2147483648 bi 2147483648 bi 2147483648 bi - 2147483648 bi 2147483648 bi 2147483648 bi
Memory IC Type - DDR DRAM DDR DRAM DDR DRAM - DDR DRAM DDR DRAM DDR DRAM
memory width - 4 4 4 - 8 8 8
Number of functions - 1 1 1 - 1 1 1
Number of ports - 1 1 1 - 1 1 1
Number of terminals - 71 71 71 - 71 71 71
word count - 536870912 words 536870912 words 536870912 words - 268435456 words 268435456 words 268435456 words
character code - 512000000 512000000 512000000 - 256000000 256000000 256000000
Operating mode - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature - 95 °C 95 °C 95 °C - 95 °C 95 °C 95 °C
organize - 512MX4 512MX4 512MX4 - 256MX8 256MX8 256MX8
Output characteristics - 3-STATE 3-STATE 3-STATE - 3-STATE 3-STATE 3-STATE
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - LFBGA LFBGA LFBGA - LFBGA LFBGA LFBGA
Encapsulate equivalent code - BGA71,9X19,32 BGA71,9X19,32 BGA71,9X19,32 - BGA71,9X19,32 BGA71,9X19,32 BGA71,9X19,32
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR
Package form - GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH - GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) - 260 260 260 - 260 260 260
power supply - 1.8 V 1.8 V 1.8 V - 1.8 V 1.8 V 1.8 V
Certification status - Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified
refresh cycle - 8192 8192 8192 - 8192 8192 8192
Maximum seat height - 1.35 mm 1.35 mm 1.35 mm - 1.35 mm 1.35 mm 1.35 mm
self refresh - YES YES YES - YES YES YES
Continuous burst length - 4,8 4,8 4,8 - 4,8 4,8 4,8
Maximum standby current - 0.016 A 0.016 A 0.02 A - 0.016 A 0.016 A 0.02 A
Maximum slew rate - 0.268 mA 0.303 mA 0.32 mA - 0.303 mA 0.268 mA 0.32 mA
Maximum supply voltage (Vsup) - 1.9 V 1.9 V 1.9 V - 1.9 V 1.9 V 1.9 V
Minimum supply voltage (Vsup) - 1.7 V 1.7 V 1.7 V - 1.7 V 1.7 V 1.7 V
Nominal supply voltage (Vsup) - 1.8 V 1.8 V 1.8 V - 1.8 V 1.8 V 1.8 V
surface mount - YES YES YES - YES YES YES
technology - CMOS CMOS CMOS - CMOS CMOS CMOS
Temperature level - OTHER OTHER OTHER - OTHER OTHER OTHER
Terminal surface - Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) - Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form - BALL BALL BALL - BALL BALL BALL
Terminal pitch - 0.8 mm 0.8 mm 0.8 mm - 0.8 mm 0.8 mm 0.8 mm
Terminal location - BOTTOM BOTTOM BOTTOM - BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature - 20 20 20 - 20 20 20
width - 11 mm 11 mm 11 mm - 11 mm 11 mm 11 mm

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