
2Gb DDR2 SDRAM(DDP)
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | SK Hynix |
| Parts packaging code | BGA |
| package instruction | LFBGA, BGA71,9X19,32 |
| Contacts | 71 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| access mode | FOUR BANK PAGE BURST |
| Maximum access time | 0.45 ns |
| Other features | AUTO/SELF REFRESH |
| Maximum clock frequency (fCLK) | 333 MHz |
| I/O type | COMMON |
| interleaved burst length | 4,8 |
| JESD-30 code | R-PBGA-B71 |
| JESD-609 code | e1 |
| length | 17.5 mm |
| memory density | 2147483648 bi |
| Memory IC Type | DDR DRAM |
| memory width | 4 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 71 |
| word count | 536870912 words |
| character code | 512000000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 95 °C |
| Minimum operating temperature | |
| organize | 512MX4 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LFBGA |
| Encapsulate equivalent code | BGA71,9X19,32 |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 1.8 V |
| Certification status | Not Qualified |
| refresh cycle | 8192 |
| Maximum seat height | 1.35 mm |
| self refresh | YES |
| Continuous burst length | 4,8 |
| Maximum standby current | 0.02 A |
| Maximum slew rate | 0.32 mA |
| Maximum supply voltage (Vsup) | 1.9 V |
| Minimum supply voltage (Vsup) | 1.7 V |
| Nominal supply voltage (Vsup) | 1.8 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | OTHER |
| Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | 20 |
| width | 11 mm |

| HY5PS2G431AMP-Y5 | HY5PS2G431AMP-E3 | HY5PS2G431AMP-C4 | HY5PS2G831AMP | HY5PS2G431AMP | HY5PS2G831AMP-C4 | HY5PS2G831AMP-E3 | HY5PS2G831AMP-Y5 | |
|---|---|---|---|---|---|---|---|---|
| Description | 2Gb DDR2 SDRAM(DDP) | 2Gb DDR2 SDRAM(DDP) | 2Gb DDR2 SDRAM(DDP) | 2Gb DDR2 SDRAM(DDP) | 2Gb DDR2 SDRAM(DDP) | 2Gb DDR2 SDRAM(DDP) | 2Gb DDR2 SDRAM(DDP) | 2Gb DDR2 SDRAM(DDP) |
| Is it Rohs certified? | conform to | conform to | conform to | - | - | conform to | conform to | conform to |
| Maker | SK Hynix | SK Hynix | SK Hynix | - | - | SK Hynix | SK Hynix | SK Hynix |
| Parts packaging code | BGA | BGA | BGA | - | - | BGA | BGA | BGA |
| package instruction | LFBGA, BGA71,9X19,32 | LFBGA, BGA71,9X19,32 | LFBGA, BGA71,9X19,32 | - | - | LFBGA, BGA71,9X19,32 | LFBGA, BGA71,9X19,32 | LFBGA, BGA71,9X19,32 |
| Contacts | 71 | 71 | 71 | - | - | 71 | 71 | 71 |
| Reach Compliance Code | unknow | unknow | unknow | - | - | unknow | unknow | unknow |
| ECCN code | EAR99 | EAR99 | EAR99 | - | - | EAR99 | EAR99 | EAR99 |
| access mode | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | - | - | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
| Maximum access time | 0.45 ns | 0.6 ns | 0.5 ns | - | - | 0.5 ns | 0.6 ns | 0.45 ns |
| Other features | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | - | - | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
| Maximum clock frequency (fCLK) | 333 MHz | 200 MHz | 267 MHz | - | - | 267 MHz | 200 MHz | 333 MHz |
| I/O type | COMMON | COMMON | COMMON | - | - | COMMON | COMMON | COMMON |
| interleaved burst length | 4,8 | 4,8 | 4,8 | - | - | 4,8 | 4,8 | 4,8 |
| JESD-30 code | R-PBGA-B71 | R-PBGA-B71 | R-PBGA-B71 | - | - | R-PBGA-B71 | R-PBGA-B71 | R-PBGA-B71 |
| JESD-609 code | e1 | e1 | e1 | - | - | e1 | e1 | e1 |
| length | 17.5 mm | 17.5 mm | 17.5 mm | - | - | 17.5 mm | 17.5 mm | 17.5 mm |
| memory density | 2147483648 bi | 2147483648 bi | 2147483648 bi | - | - | 2147483648 bi | 2147483648 bi | 2147483648 bi |
| Memory IC Type | DDR DRAM | DDR DRAM | DDR DRAM | - | - | DDR DRAM | DDR DRAM | DDR DRAM |
| memory width | 4 | 4 | 4 | - | - | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | - | - | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | - | - | 1 | 1 | 1 |
| Number of terminals | 71 | 71 | 71 | - | - | 71 | 71 | 71 |
| word count | 536870912 words | 536870912 words | 536870912 words | - | - | 268435456 words | 268435456 words | 268435456 words |
| character code | 512000000 | 512000000 | 512000000 | - | - | 256000000 | 256000000 | 256000000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 95 °C | 95 °C | 95 °C | - | - | 95 °C | 95 °C | 95 °C |
| organize | 512MX4 | 512MX4 | 512MX4 | - | - | 256MX8 | 256MX8 | 256MX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | - | - | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | LFBGA | LFBGA | LFBGA | - | - | LFBGA | LFBGA | LFBGA |
| Encapsulate equivalent code | BGA71,9X19,32 | BGA71,9X19,32 | BGA71,9X19,32 | - | - | BGA71,9X19,32 | BGA71,9X19,32 | BGA71,9X19,32 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | - | - | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | - | - | 260 | 260 | 260 |
| power supply | 1.8 V | 1.8 V | 1.8 V | - | - | 1.8 V | 1.8 V | 1.8 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified |
| refresh cycle | 8192 | 8192 | 8192 | - | - | 8192 | 8192 | 8192 |
| Maximum seat height | 1.35 mm | 1.35 mm | 1.35 mm | - | - | 1.35 mm | 1.35 mm | 1.35 mm |
| self refresh | YES | YES | YES | - | - | YES | YES | YES |
| Continuous burst length | 4,8 | 4,8 | 4,8 | - | - | 4,8 | 4,8 | 4,8 |
| Maximum standby current | 0.02 A | 0.016 A | 0.016 A | - | - | 0.016 A | 0.016 A | 0.02 A |
| Maximum slew rate | 0.32 mA | 0.268 mA | 0.303 mA | - | - | 0.303 mA | 0.268 mA | 0.32 mA |
| Maximum supply voltage (Vsup) | 1.9 V | 1.9 V | 1.9 V | - | - | 1.9 V | 1.9 V | 1.9 V |
| Minimum supply voltage (Vsup) | 1.7 V | 1.7 V | 1.7 V | - | - | 1.7 V | 1.7 V | 1.7 V |
| Nominal supply voltage (Vsup) | 1.8 V | 1.8 V | 1.8 V | - | - | 1.8 V | 1.8 V | 1.8 V |
| surface mount | YES | YES | YES | - | - | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | - | - | CMOS | CMOS | CMOS |
| Temperature level | OTHER | OTHER | OTHER | - | - | OTHER | OTHER | OTHER |
| Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form | BALL | BALL | BALL | - | - | BALL | BALL | BALL |
| Terminal pitch | 0.8 mm | 0.8 mm | 0.8 mm | - | - | 0.8 mm | 0.8 mm | 0.8 mm |
| Terminal location | BOTTOM | BOTTOM | BOTTOM | - | - | BOTTOM | BOTTOM | BOTTOM |
| Maximum time at peak reflow temperature | 20 | 20 | 20 | - | - | 20 | 20 | 20 |
| width | 11 mm | 11 mm | 11 mm | - | - | 11 mm | 11 mm | 11 mm |