DM87SR476J datasheet, PDF - EEWORLD Datasheet

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DM87SR476J: Description512X8 OTPROM, CDIP24, CERAMIC, DIP-24; Categorystorage storage; File Size158KB，4 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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DM87SR476J Overview

512X8 OTPROM, CDIP24, CERAMIC, DIP-24

DM87SR476J Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Texas Instruments
Parts packaging code	DIP
package instruction	DIP, DIP24,.3
Contacts	24
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	50 ns
JESD-30 code	R-GDIP-T24
JESD-609 code	e0
memory density	4096 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	24
word count	512 words
character code	512
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512X8
Output characteristics	3-STATE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	4.572 mm
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	BIPOLAR
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm

DM87SR476J Related Products

	DM87SR476J	DM87SR476V	DM87SR476VX	DM87SR476BN	DM87SR476BV	DM87SR476BVX	DM87SR476N	DM77SR476J	DM77SR476BJ	DM87SR476BJ
Description	512X8 OTPROM, CDIP24, CERAMIC, DIP-24	512X8 OTPROM, PQCC28, PLASTIC, LCC-28	512X8 OTPROM, PQCC28, PLASTIC, LCC-28	IC 512 X 8 OTPROM, PDIP24, PLASTIC, DIP-24, Programmable ROM	512X8 OTPROM, PQCC28, PLASTIC, LCC-28	512X8 OTPROM, PQCC28, PLASTIC, LCC-28	512X8 OTPROM, PDIP24, PLASTIC, DIP-24	512X8 OTPROM, CDIP24, CERAMIC, DIP-24	512X8 OTPROM, CDIP24, CERAMIC, DIP-24	512X8 OTPROM, CDIP24, CERAMIC, DIP-24
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	DIP	QLCC	QLCC	DIP	QLCC	QLCC	DIP	DIP	DIP	DIP
package instruction	DIP, DIP24,.3	QCCJ, LDCC28,.5SQ	QCCJ,	DIP, DIP24,.3	QCCJ, LDCC28,.5SQ	QCCJ,	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3
Contacts	24	28	28	24	28	28	24	24	24	24
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
JESD-30 code	R-GDIP-T24	S-PQCC-J28	S-PQCC-J28	R-PDIP-T24	S-PQCC-J28	S-PQCC-J28	R-PDIP-T24	R-GDIP-T24	R-GDIP-T24	R-GDIP-T24
memory density	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of terminals	24	28	28	24	28	28	24	24	24	24
word count	512 words	512 words	512 words	512 words	512 words	512 words	512 words	512 words	512 words	512 words
character code	512	512	512	512	512	512	512	512	512	512
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	125 °C	125 °C	70 °C
organize	512X8	512X8	512X8	512X8	512X8	512X8	512X8	512X8	512X8	512X8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	QCCJ	QCCJ	DIP	QCCJ	QCCJ	DIP	DIP	DIP	DIP
Package shape	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.572 mm	4.57 mm	4.57 mm	5.334 mm	4.57 mm	4.57 mm	5.334 mm	4.572 mm	4.572 mm	4.572 mm
Maximum supply voltage (Vsup)	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.5 V	5.5 V	5.25 V
Minimum supply voltage (Vsup)	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.5 V	4.5 V	4.75 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	NO	YES	YES	NO	NO	NO	NO
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY	COMMERCIAL
Terminal form	THROUGH-HOLE	J BEND	J BEND	THROUGH-HOLE	J BEND	J BEND	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	QUAD	QUAD	DUAL	QUAD	QUAD	DUAL	DUAL	DUAL	DUAL
width	15.24 mm	11.43 mm	11.43 mm	15.24 mm	11.43 mm	11.43 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm
Is it lead-free?	Contains lead	Contains lead	-	Contains lead	Contains lead	-	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	-	incompatible	incompatible	-	incompatible	incompatible	incompatible	incompatible
Maximum access time	50 ns	50 ns	-	35 ns	35 ns	-	50 ns	55 ns	40 ns	35 ns
JESD-609 code	e0	e0	-	e0	e0	-	e0	e0	e0	e0
Encapsulate equivalent code	DIP24,.3	LDCC28,.5SQ	-	DIP24,.3	LDCC28,.5SQ	-	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
length	-	11.43 mm	11.43 mm	31.915 mm	11.43 mm	11.43 mm	31.915 mm	-	-	-

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