XR2T-2011-N datasheet, PDF - EEWORLD Datasheet

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XR2T-2011-N: DescriptionDIP24, IC SOCKET; CategoryThe connector; File Size1MB，12 Pages; ManufacturerOMRON; Websitehttps://www.omron.com

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XR2T-2011-N Overview

DIP24, IC SOCKET

XR2T-2011-N Parametric

Parameter Name	Attribute value
Number of contacts	24
Type of equipment used	DIP24
EU RoHS regulations	Yes
state	ACTIVE
Device slot type	IC SOCKET
Manufacturer Series	XR2
Contact surface matching	GOLD (10)
Contact coated terminals	GOLD (10)

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IC Sockets

XR2

OMRON’s IC Connectors Have Excellent

Reliability and Can Tolerate Momentary

Interruptions in Power.

• Round pins and 4-point (4-finger) contact construction with

contact entry holes that are large for easy insertion.

• IC lead contacts placed high for solid connections.

• A wide product range: open-frame, closed-frame, single-

row, carrier-type DIP terminals, wrap terminals, solder-

sleeve terminals, and low-profile DIP terminals.

• Conforms to UL standards (file no. E 103202) and CSA

standards (file no. LR 62678).

■

Construction

Inner clip

Base

■

Contact Dimensions

DIP

Terminals

1.83 dia.

Wrap

Terminals

1.83 dia.

Low-profile DIP

Terminals

1.83 dia.

Solder-sleeve

Terminals

1.83 dia.

Outer sleeve

Carrier

Inner clip

0.79 dia.

1.35 dia.

0.51 dia.

0.635 0.635

Outer sleeve

■

Ratings and Characteristics

Item

Rated current

Rated voltage

Contact resistance

Insulation resistance

Dielectric strength

Contact insertion

(See note.)

Contact removal

(See note.)

Insertion durability

Gold plated

Gold flash plated

300 VAC

20 mΩ max. (at 20 mV, 100 mA max.)

1,000 MΩ min. (at 500 VDC)

1,000 VAC for 1 min (leakage current: 1 mA max.)

400 gf (3.92 N) max.

65 gf (0.64 N) min. with gold plating or with solder plating

■

Applicable Wrap Post Wire Sizes

AWG30, AWG28, AWG26, AWG24

(Solid wire: 0.25 to 0.51 mm dia.)

■

Wrap Post Length

3 wires

■

Applicable IC Lead Dimensions

DIP, Wrap, and Solder-sleeve Terminals

Depth

width (mm)

Flat lead

Round lead

0.29

±0.09 ×

0.46

±0.08

(See note.)

0.53 dia. max.

0.41 dia. min.

100 times (0.75-μm gold plating), 20 times

50 times (0.25-μm gold plating)

Ambient temperature Operating: –55 to 125°C (with no icing)

Note:

The contact insertion force and contact removal force are for a

test gauge, t = 0.432 mm.

Note:

Do not use wire where the diagonal is more than 0.56 mm.

■

Materials and Finish

Base

Carrier

Inner clip

Outer sleeve

Fiber-glass reinforced PBT resin (UL94V-0)/black

Aluminum

Beryllium copper/nickel base, gold plated

Brass/nickel base, gold flash plating

Low-profile DIP Terminals

Depth

width (mm)

Flat lead

Round lead

0.29

±0.09 ×

0.46

±0.08

(See note.)

0.50 dia. max.

0.41 dia. min.

Note:

Do not use wire where the diagonal is more than 0.52 mm.

Note:

For non-standard plating, contact your OMRON representative.

IC Sockets

XR2

111

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