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BZT52C27-TP-HF

Description
Zener Diode,
CategoryDiscrete semiconductor    diode   
File Size413KB,4 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance
Download Datasheet Parametric View All

BZT52C27-TP-HF Overview

Zener Diode,

BZT52C27-TP-HF Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
package instructionR-PDSO-G2
Reach Compliance Codecompliant
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JESD-30 codeR-PDSO-G2
Humidity sensitivity level1
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation0.5 W
Nominal reference voltage27 V
surface mountYES
technologyZENER
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperature10
Maximum voltage tolerance7.04%
Working test current2 mA
MCC
Micro Commercial Components
TM
  omponents
20736 Marilla
Street Chatsworth

  !"#
$ %    !"#
BZT52C2V4
THRU
BZT52C51
500 mW
Zener Diode
2.4 to
51
Volts
Features
Planar Die Construction
500mW Power Dissipation on Ceramic PCB
General Purpose Medium Current
Ideally Suited for Automated Assembly Processes
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Lead Free Finish/RoHS Compliant("P" Suffix
designates RoHS Compliant. See ordering information)
Halogen
free available upon request by adding suffix "-HF"
SOD-123
A
B
Unit
Absolute Maximum Ratings
Symbol
Rating
Rating
C
P
D
Power dissipation
500
mW
E
T
J
Junction Temperature
-65 to +150
T
STG
Storage Temperature Range
-65 to +150
H
D
J
Absolute Maximum Ratings
Symbol
Rating
Rating
Unit
G
DIM
R
thJA
Thermal Resistance Junction to
Ambient*
250
/W
* Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with
pad areas 25
mm
2
Electrical Characteristics
Symbol
Rating
Rating
Unit
A
B
C
D
E
G
H
J
DIMENSIONS
INCHES
MM
MIN
MAX
MIN
MAX
.140
.152
3.55
3.85
.100
.112
2.55
2.85
.055
.071
1.40
1.80
-----
.053
-----
1.35
.012
.031
0.30
.78
.006
-----
0.15
-----
-----
.01
-----
.25
-----
.006
-----
.15
NOTE
SUGGESTED SOLDER
PAD LAYOUT
V
F
Maximum Forward Voltage
(I
F
=10mAdc)
0.9
V
0.093"
0.048”
0.036”
Revision: C
www.mccsemi.com
1
of
4
2013/10/07
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