IDT7MP1023S50Z datasheet, PDF - EEWORLD Datasheet

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IDT7MP1023S50Z: DescriptionMulti-Port SRAM Module, 64KX8, 50ns, CMOS, PZIP64; Categorystorage storage; File Size445KB，9 Pages; ManufacturerIDT (Integrated Device Technology)

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IDT7MP1023S50Z Overview

Multi-Port SRAM Module, 64KX8, 50ns, CMOS, PZIP64

IDT7MP1023S50Z Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Reach Compliance Code	not_compliant
Maximum access time	50 ns
I/O type	COMMON
JESD-30 code	R-PZIP-T64
JESD-609 code	e0
memory density	524288 bit
Memory IC Type	MULTI-PORT SRAM MODULE
memory width	8
Number of ports	2
Number of terminals	64
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	64KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	ZIP
Encapsulate equivalent code	ZIP64/68,.1,.1
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
Certification status	Not Qualified
Maximum standby current	0.065 A
Minimum standby current	4.5 V
Maximum slew rate	0.66 mA
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	1.27 mm
Terminal location	ZIG-ZAG
Maximum time at peak reflow temperature	30

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IDT7MP1023S50Z Related Products

	IDT7MP1023S50Z	IDT7MP1023S65Z	7MP1023S65Z	IDT7MP1021S40Z	IDT7MP1021S50Z	IDT7MP1021S65Z	IDT7MP1023S40Z
Description	Multi-Port SRAM Module, 64KX8, 50ns, CMOS, PZIP64	Multi-Port SRAM Module, 64KX8, 65ns, CMOS, PZIP64	Multi-Port SRAM Module, 64KX8, 65ns, CMOS, PZIP64	Application Specific SRAM, 128KX8, 40ns, CMOS, PZIP64	Multi-Port SRAM Module, 128KX8, 50ns, CMOS, PZIP64	Multi-Port SRAM Module, 128KX8, 65ns, CMOS, PZIP64	Multi-Port SRAM Module, 64KX8, 40ns, CMOS, PZIP64
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
Maximum access time	50 ns	65 ns	65 ns	40 ns	50 ns	65 ns	40 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PZIP-T64	R-PZIP-T64	R-PZIP-T64	R-PZIP-T64	R-PZIP-T64	R-PZIP-T64	R-PZIP-T64
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
memory density	524288 bit	524288 bit	524288 bit	1048576 bit	1048576 bit	1048576 bit	524288 bit
Memory IC Type	MULTI-PORT SRAM MODULE	MULTI-PORT SRAM MODULE	MULTI-PORT SRAM MODULE	APPLICATION SPECIFIC SRAM	MULTI-PORT SRAM MODULE	MULTI-PORT SRAM MODULE	MULTI-PORT SRAM MODULE
memory width	8	8	8	8	8	8	8
Number of ports	2	2	2	2	2	2	2
Number of terminals	64	64	64	64	64	64	64
word count	65536 words	65536 words	65536 words	131072 words	131072 words	131072 words	65536 words
character code	64000	64000	64000	128000	128000	128000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	64KX8	64KX8	64KX8	128KX8	128KX8	128KX8	64KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	ZIP	ZIP	ZIP	ZIP	ZIP	ZIP	ZIP
Encapsulate equivalent code	ZIP64/68,.1,.1	ZIP64/68,.1,.1	ZIP64/68,.1,.1	ZIP64/68,.1,.1	ZIP64/68,.1,.1	ZIP64/68,.1,.1	ZIP64/68,.1,.1
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	225	225	225	225	225	225	225
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.065 A	0.065 A	0.065 A	0.125 A	0.125 A	0.125 A	0.065 A
Minimum standby current	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Maximum slew rate	0.66 mA	0.66 mA	0.66 mA	0.94 mA	0.94 mA	0.94 mA	0.66 mA
surface mount	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG
Maximum time at peak reflow temperature	30	30	30	30	30	30	30

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