Multi-Port SRAM Module, 64KX8, 65ns, CMOS, PZIP64
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| Reach Compliance Code | not_compliant |
| Maximum access time | 65 ns |
| I/O type | COMMON |
| JESD-30 code | R-PZIP-T64 |
| JESD-609 code | e0 |
| memory density | 524288 bit |
| Memory IC Type | MULTI-PORT SRAM MODULE |
| memory width | 8 |
| Number of ports | 2 |
| Number of terminals | 64 |
| word count | 65536 words |
| character code | 64000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 64KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | ZIP |
| Encapsulate equivalent code | ZIP64/68,.1,.1 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 |
| Certification status | Not Qualified |
| Maximum standby current | 0.065 A |
| Minimum standby current | 4.5 V |
| Maximum slew rate | 0.66 mA |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 1.27 mm |
| Terminal location | ZIG-ZAG |
| Maximum time at peak reflow temperature | 30 |
| Base Number Matches | 1 |
| IDT7MP1023S65Z | 7MP1023S65Z | IDT7MP1021S40Z | IDT7MP1021S50Z | IDT7MP1021S65Z | IDT7MP1023S40Z | IDT7MP1023S50Z | |
|---|---|---|---|---|---|---|---|
| Description | Multi-Port SRAM Module, 64KX8, 65ns, CMOS, PZIP64 | Multi-Port SRAM Module, 64KX8, 65ns, CMOS, PZIP64 | Application Specific SRAM, 128KX8, 40ns, CMOS, PZIP64 | Multi-Port SRAM Module, 128KX8, 50ns, CMOS, PZIP64 | Multi-Port SRAM Module, 128KX8, 65ns, CMOS, PZIP64 | Multi-Port SRAM Module, 64KX8, 40ns, CMOS, PZIP64 | Multi-Port SRAM Module, 64KX8, 50ns, CMOS, PZIP64 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| Maximum access time | 65 ns | 65 ns | 40 ns | 50 ns | 65 ns | 40 ns | 50 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-PZIP-T64 | R-PZIP-T64 | R-PZIP-T64 | R-PZIP-T64 | R-PZIP-T64 | R-PZIP-T64 | R-PZIP-T64 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 524288 bit | 524288 bit | 1048576 bit | 1048576 bit | 1048576 bit | 524288 bit | 524288 bit |
| Memory IC Type | MULTI-PORT SRAM MODULE | MULTI-PORT SRAM MODULE | APPLICATION SPECIFIC SRAM | MULTI-PORT SRAM MODULE | MULTI-PORT SRAM MODULE | MULTI-PORT SRAM MODULE | MULTI-PORT SRAM MODULE |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of ports | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| word count | 65536 words | 65536 words | 131072 words | 131072 words | 131072 words | 65536 words | 65536 words |
| character code | 64000 | 64000 | 128000 | 128000 | 128000 | 64000 | 64000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 64KX8 | 64KX8 | 128KX8 | 128KX8 | 128KX8 | 64KX8 | 64KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | ZIP | ZIP | ZIP | ZIP | ZIP | ZIP | ZIP |
| Encapsulate equivalent code | ZIP64/68,.1,.1 | ZIP64/68,.1,.1 | ZIP64/68,.1,.1 | ZIP64/68,.1,.1 | ZIP64/68,.1,.1 | ZIP64/68,.1,.1 | ZIP64/68,.1,.1 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 | 225 | 225 | 225 | 225 | 225 | 225 |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.065 A | 0.065 A | 0.125 A | 0.125 A | 0.125 A | 0.065 A | 0.065 A |
| Minimum standby current | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Maximum slew rate | 0.66 mA | 0.66 mA | 0.94 mA | 0.94 mA | 0.94 mA | 0.66 mA | 0.66 mA |
| surface mount | NO | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG |
| Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
京公网安备 11010802033920号
EEWORLD
