Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(V
CC
= +12V, V
EE
= -7V, V
L
= +3.3V, T
A
= +25°C, unless otherwise noted. Specifications at T
A
= T
MIN
and T
A
= T
MAX
are guaranteed
by design and characterization. Typical values are at T
A
= +25°C, unless otherwise noted.) (Note 2)
PARAMETER
FORCE VOLTAGE
Force Input Voltage
Range
Forced Voltage
Input Bias Current
Forced-Voltage Offset
Forced-Voltage-Offset
Temperature Coefficient
Forced-Voltage Gain
Error
Forced-Voltage-Gain
Temperature Coefficient
Forced-Voltage Linearity
Error
MEASURE CURRENT
Measure-Current Offset
Measure-Current-Offset
Temperature Coefficient
Measure-Current Gain
Error
Measure-Current-Gain
Temperature Coefficient
Linearity Error
2
SYMBOL
V
IN0_
,
V
IN1_
V
DUT
CONDITIONS
MIN
TYP
MAX
UNITS
V
EE
+ 2.5
DUT current at full scale
DUT current = 0A
V
CC
= +12V, V
EE
= -7V
V
CC
= +18V, V
EE
= -12V
-2
-7
V
EE
+ 2.5
±1
-25
±100
V
CC
- 2.5
+7
+13
V
CC
- 2.5
V
V
µA
V
FOS
+25
mV
µV/°C
V
FGE
Nominal gain of +1
-1
0.005
±10
+1
%
ppm/°C
V
FLER
Gain and offset errors calibrated out (Notes 3, 4)
-0.02
+0.02
%FSR
I
MOS
(Note 3)
-1
±20
+1
%FSR
ppm/°C
I
MGE
(Note 5)
-1
±20
+1
%
ppm/°C
I
MLER
Gain and offset errors calibrated out
(Notes 3, 4, 6)
-0.02
+0.02
%FSR
Maxim Integrated
MAX9951/MAX9952
Dual Per-Pin Parametric
Measurement Units
DC ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= +12V, V
EE
= -7V, V
L
= +3.3V, T
A
= +25°C, unless otherwise noted. Specifications at T
A
= T
MIN
and T
A
= T
MAX
are guaranteed
by design and characterization. Typical values are at T
A
= +25°C, unless otherwise noted.) (Note 2)
PARAMETER
Measure-Output-Voltage
Range Over Full-Current
Range
Current-Sense Amp
Offset-Voltage Input
Rejection of Output-
Measure Error Due to
Common-Mode Sense
Voltage
SYMBOL
V
IOS
= V
DUTGND
V
MSR_
V
IOS
= 4V + V
DUTGND
V
IOS
Relative to V
DUTGND
0
-0.2
+8
+4.4
V
CONDITIONS
MIN
-4
TYP
MAX
+4
V
UNITS
CMVR
LER
(Notes 5 and 7)
+0.001
+0.007
%FSR/V
Range E, R_E = 500kΩ
Range D, R_D = 50kΩ
Measure-Current Range
Range C, R_C = 5kΩ
Range B, R_B = 500Ω
Range A, R_A = 15.6Ω
FORCE CURRENT
Input Voltage Range for
Setting Forced Current
Over Full Range
Current-Sense Amp
Offset-Voltage Input
IOS_ Input Bias Current
Forced-Current Offset
Forced-Current-Offset
Temperature Coefficient
Forced-Current Gain
Error
Forced-Current-Gain
Temperature Coefficient
Forced-Current Linearity
Error
Rejection of Output Error
Due to Common-Mode
Load Voltage
I
FLER
Gain and offset errors calibrated out
(Notes 3, 4, 6)
(Note 5)
(Note 3)
V
IN0_,
V
IN1_
V
IOS
V
IOS
= V
DUTGND
V
IOS
= 4V + V
DUTGND
Relative to V
DUTGND
-2
-20
-200
-2
-64
+2
+20
+200
+2
+64
mA
µA
-4
0
-0.2
±1
-1
±20
-1
±20
-0.02
+4
V
+8
+4.4
V
µA
+1
%FSR
ppm/°C
+1
%
ppm/°C
+0.02
%FSR
CMRI
OER
(Notes 5 and 7)
Range E, R_E = 500kΩ
Range D, R_D = 50kΩ
-2
-20
-200
-2
-64
+0.001
+0.007
+2
+20
+200
+2
+64
%FSR/V
µA
Forced-Current Range
Range C, R_C = 5kΩ
Range B, R_B = 500Ω
Range A, R_A = 15.6Ω
mA
Maxim Integrated
3
MAX9951/MAX9952
Dual Per-Pin Parametric
Measurement Units
DC ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= +12V, V
EE
= -7V, V
L
= +3.3V, T
A
= +25°C, unless otherwise noted. Specifications at T
A
= T
MIN
and T
A
= T
MAX
are guaranteed
by design and characterization. Typical values are at T
A
= +25°C, unless otherwise noted.) (Note 2)
PARAMETER
MEASURE VOLTAGE
Measure-Voltage-Offset
Measure-Voltage-Offset
Temperature Coefficient
Gain Error
Measure-Voltage-Gain
Temperature Coefficient
Measure-Voltage
Linearity Error
Measure-Output-Voltage
Range Over Full DUT
Voltage
FORCE OUTPUT
Off-State Leakage
Current
Short-Circuit Current
Limit
Force-to-Sense Resistor
SENSE INPUT
Input Voltage Range
Leakage Current
COMPARATOR INPUTS
Input Voltage Range
Offset Voltage
Input Bias Current
VOLTAGE CLAMPS
Input Control Voltage
Clamp Voltage
Accuracy
DIGITAL INPUTS
Input High Voltage
(Note 9)
Input Low Voltage
(Note 9)
Input Current
Input Capacitance
V
L
= 5V
V
IH
V
L
= 3.3V
V
L
= 2.5V
V
IL
I
IN
C
IN
V
L
= 5V or 3.3V
V
L
= 2.5V
±1
3.0
+3.5
+2.0
+1.7
+0.8
+0.7
V
µA
pF
V
V
CLLO_
,
V
CLHI_
(Note 8)
V
EE
+ 2.4
-100
V
CC
- 2.4
+100
V
mV
V
EE
+ 2.5
-25
±1
V
CC
- 2.5
+25
V
mV
µA
F option only
V
EE
+ 2.5
-1
V
CC
- 2.5
+1
V
nA
I
LIM-
I
LIM+
R
FS
D option only
-1
-92
+65
8
10
+1
-65
+92
12
nA
mA
kΩ
V
MLER
Gain and offset errors calibrated out
(Notes 3, 4, 6)
DUT current at full scale
DUT current = 0A
V
CC
= +12V, V
EE
= -7V
V
CC
= +18V, V
EE
= -12V
-0.02
-2
-7
V
EE
+ 2.5
V
MGER
Nominal gain of +1
-1
V
MOS
-25
±100
±0.005
±10
+0.02
+7
+13
V
CC
- 2.5
V
+1
+25
mV
µV/°C
%
ppm/°C
%FSR
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
V
MSR
4
Maxim Integrated
MAX9951/MAX9952
Dual Per-Pin Parametric
Measurement Units
DC ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= +12V, V
EE
= -7V, V
L
= +3.3V, T
A
= +25°C, unless otherwise noted. Specifications at T
A
= T
MIN
and T
A
= T
MAX
are guaranteed
by design and characterization. Typical values are at T
The Hercules safety microcontrollers are based on TI's 20 years of expertise in safety-critical systems, industry collaboration in the automotive market and proven hardware. The platform includes thre...
A piece of ice in the Sahara Desert was melted by the sun until only a small piece remained. The ice sighed: The desert is the hell of ice, and the Arctic is the paradise of ice. The sand said to the ...
My MCU communicates with the host computer and needs to process some affairs at the same time. However, when processing certain affairs, the host computer communication is not allowed to be interrupte...
ActiveSync has always been working fine when connecting to the device via the USB interface, but today when I unplugged the USB cable and disconnected it, the machine crashed. After restarting, it sto...
The P0 pin of the at89c51 chip is used as the output of two four-bit BCD codes to the CD4511BCN, and then output to two 8-segment displays through the CD4511BCN, but there is always no response. Pleas...
Reflow soldering, a common soldering method in modern electronics manufacturing, primarily melts solder paste and pads to form solder joints. With technological advancements, soldering equipment ha...[Details]
To understand why car engines need gearboxes, we must first understand the characteristics of different types of engines. An engine refers to a machine that can convert a form of energy into kineti...[Details]
Multi-touch mobile phone
Multi-touch is a system that can respond to multiple touches on the screen at the same time. Multi-touch phones are divided into capacitive and resistive types. Capaci...[Details]
Introduction to the principles of speech recognition technology
Automatic speech recognition (ASR) technology aims to enable computers to understand human speech and extract the textual inform...[Details]
1 Introduction
In the mid-1960s, American scientist Maas conducted extensive experimental research on the charging process of open-cell batteries and proposed an acceptable charging curve for ...[Details]
Definition of interactive projection system:
Interactive projection systems, also known as multimedia interactive projection, are available in floor, wall, and tabletop interactive projection....[Details]
Overview
As handheld voice communication devices become more and more popular, they are increasingly used in noisy environments, such as airports, busy roads, crowded bars, etc. In such noisy ...[Details]
On August 22, the Wall Street Journal reported on the 21st local time that the new US government does not plan to acquire equity in semiconductor wafer foundry giant TSMC and Micron, one of the thr...[Details]
Recently, Joyson Electronics has made positive progress in the core technology research and development of the robot's "brain and brain" and key components, and launched the industry's first integr...[Details]
Intel®
Xeon®
6
-
core processors now support the new Amazon EC2 R8i and R8i-flex instances on Amazon Web Services (AWS).
These new instances offer superior performance and fast...[Details]
We often hear about the precautions for using pure electric vehicles in winter, and many owners even develop relevant strategies, such as adopting a "charge as you go" principle for their vehicles,...[Details]
Electric vehicles are composed of three main components: electric motors, electric motors, and electric vehicles. Maintenance is much simpler than for gasoline-powered vehicles. Maintenance for ele...[Details]
Common Mode Semiconductor has officially launched the GM6503 series—a 5 V, 3 A synchronous step-down DC/DC power module designed for optical communications, servers, industrial applications, and FP...[Details]
New version helps developers build secure and trustworthy embedded systems
Shanghai, China—August 21, 2025—
QNX, a division of BlackBerry Ltd., today announced the release of QNX...[Details]
1. Introduction
In 2015, Apple's new MacBook and Apple Watch both featured force-sensing technology, which Apple calls Force Touch. Each time a user presses the touchpad, the device not only p...[Details]