|
IS61C64AH-20U |
IS61C64AH-15J |
IS61C64AH-25U |
IS61C64AH-15U |
| Description |
Standard SRAM, 8KX8, 20ns, CMOS, PDSO28, 0.330 INCH, PLASTIC, SOP-28 |
Standard SRAM, 8KX8, 15ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28 |
Standard SRAM, 8KX8, 25ns, CMOS, PDSO28, 0.330 INCH, PLASTIC, SOP-28 |
Standard SRAM, 8KX8, 15ns, CMOS, PDSO28, 0.330 INCH, PLASTIC, SOP-28 |
| Is it lead-free? |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
| Maker |
Integrated Silicon Solution ( ISSI ) |
Integrated Silicon Solution ( ISSI ) |
Integrated Silicon Solution ( ISSI ) |
Integrated Silicon Solution ( ISSI ) |
| Parts packaging code |
SOIC |
SOJ |
SOIC |
SOIC |
| package instruction |
0.330 INCH, PLASTIC, SOP-28 |
0.300 INCH, PLASTIC, SOJ-28 |
0.330 INCH, PLASTIC, SOP-28 |
0.330 INCH, PLASTIC, SOP-28 |
| Contacts |
28 |
28 |
28 |
28 |
| Reach Compliance Code |
compliant |
compli |
compliant |
compliant |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| Maximum access time |
20 ns |
15 ns |
25 ns |
15 ns |
| Other features |
AUTOMATIC POWER-DOWN |
AUTOMATIC POWER-DOWN |
LOW POWER STANDBY MODE; AUTOMATIC POWER-DOWN |
AUTOMATIC POWER-DOWN |
| I/O type |
COMMON |
COMMON |
COMMON |
COMMON |
| JESD-30 code |
R-PDSO-G28 |
R-PDSO-J28 |
R-PDSO-G28 |
R-PDSO-G28 |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
| length |
18.1 mm |
18.161 mm |
18.1 mm |
18.1 mm |
| memory density |
65536 bit |
65536 bi |
65536 bit |
65536 bit |
| Memory IC Type |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
| memory width |
8 |
8 |
8 |
8 |
| Humidity sensitivity level |
3 |
3 |
3 |
3 |
| Number of functions |
1 |
1 |
1 |
1 |
| Number of terminals |
28 |
28 |
28 |
28 |
| word count |
8192 words |
8192 words |
8192 words |
8192 words |
| character code |
8000 |
8000 |
8000 |
8000 |
| Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
| Maximum operating temperature |
70 °C |
70 °C |
70 °C |
70 °C |
| organize |
8KX8 |
8KX8 |
8KX8 |
8KX8 |
| Output characteristics |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
SOP |
SOJ |
SOP |
SOP |
| Encapsulate equivalent code |
SOP28,.5 |
SOJ28,.34 |
SOP28,.5 |
SOP28,.5 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
| Parallel/Serial |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| power supply |
5 V |
5 V |
5 V |
5 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
2.8448 mm |
3.556 mm |
2.8448 mm |
2.8448 mm |
| Maximum standby current |
0.006 A |
0.006 A |
0.006 A |
0.006 A |
| Minimum standby current |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
| Maximum slew rate |
0.12 mA |
0.135 mA |
0.11 mA |
0.135 mA |
| Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
| Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
| surface mount |
YES |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
GULL WING |
J BEND |
GULL WING |
GULL WING |
| Terminal pitch |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
| Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
8.4 mm |
7.59 mm |
8.4 mm |
8.4 mm |