MT48LC16M8A2FB-7EL:G datasheet, PDF

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MT48LC16M8A2FB-7EL:G: DescriptionSynchronous DRAM, 16MX8, 5.4ns, CMOS, PBGA60, 8 X 16 MM, PLASTIC, FBGA-60; Categorystorage storage; File Size4MB，85 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/

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MT48LC16M8A2FB-7EL:G Overview

Synchronous DRAM, 16MX8, 5.4ns, CMOS, PBGA60, 8 X 16 MM, PLASTIC, FBGA-60

MT48LC16M8A2FB-7EL:G Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Micron Technology
Parts packaging code	BGA
package instruction	8 X 16 MM, PLASTIC, FBGA-60
Contacts	60
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FOUR BANK PAGE BURST
Maximum access time	5.4 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	143 MHz
I/O type	COMMON
interleaved burst length	1,2,4,8
JESD-30 code	R-PBGA-B60
JESD-609 code	e0
length	16 mm
memory density	134217728 bit
Memory IC Type	SYNCHRONOUS DRAM
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	60
word count	16777216 words
character code	16000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16MX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA60,8X15,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	235
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	4096
Maximum seat height	1.2 mm
self refresh	YES
Continuous burst length	1,2,4,8,FP
Maximum standby current	0.002 A
Maximum slew rate	0.33 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead/Silver (Sn/Pb/Ag)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	8 mm

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128Mb: x4, x8, x16 SDRAM

Features

SDR SDRAM

MT48LC32M4A2 – 8 Meg x 4 x 4 Banks

MT48LC16M8A2 – 4 Meg x 8 x 4 Banks

MT48LC8M16A2 – 2 Meg x 16 x 4 Banks

Features

• PC100- and PC133-compliant

• Fully synchronous; all signals registered on positive

edge of system clock

• Internal, pipelined operation; column address can

be changed every clock cycle

• Internal banks for hiding row access/precharge

• Programmable burst lengths (BL): 1, 2, 4, 8, or full

page

• Auto precharge, includes concurrent auto precharge

and auto refresh modes

• Self refresh modes: Standard and low power

(not available on AT devices)

• Auto Refresh

– 64ms, 4096-cycle refresh (commercial and

industrial)

– 16ms, 4096-cycle refresh (automotive)

• LVTTL-compatible inputs and outputs

• Single 3.3V ±0.3V power supply

• Plastic package – OCPL

– 54-pin TSOP II (400 mil)

– 54-pin TSOP II (400 mil) Pb-free

– 60-ball FBGA (8mm x 16mm)

– 60-ball FBGA (8mm x 16mm) Pb-free

– 54-ball VFBGA (x16 only) (8mm x

8mm)

– 54-ball VFBGA (x16 only) (8mm x

8mm) Pb-free

• Timing – cycle time

– 7.5ns @ CL = 3 (PC133)

– 7.5ns @ CL = 2 (PC133)

– 6.0ns @ CL = 3 (x16 only)

• Self refresh

– Standard

– Low power

• Revision

• Operating temperature range

– Commercial (0˚C to +70˚C)

– Industrial (–40˚C to +85˚C)

– Automotive (–40˚C to +105˚C)

Notes:

1. Contact Micron for availability.

2. Off-center parting line.

3. Only available on Revision G.

Options

Marking

-75

-7E

-6A

None

:G/:L

None

Options

• Configurations

– 32 Meg x 4 (8 Meg x 4 x 4 banks)

– 16 Meg x 8 (4 Meg x 8 x 4 banks)

– 8 Meg x 16 (2 Meg x 16 x 4 banks)

• Write recovery (

WR)

–

WR = 2 CLK

Table 1: Key Timing Parameters

CL = CAS (READ) latency

Speed Grade

-6A

-75

-7E

Clock

Frequency (MHz)

167

133

Marking

32M4

16M8

8M16

Target

RCD-

RP-CL

3-3-3

2-2-2

RCD

(ns)

CL (ns)

PDF: 09005aef8091e66d

128mb_x4x8x16_sdram.pdf - Rev. R 10/12 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

128Mb: x4, x8, x16 SDRAM

Features

Contents

General Description ......................................................................................................................................... 7

Automotive Temperature .............................................................................................................................. 7

Functional Block Diagrams ............................................................................................................................... 8

Pin and Ball Assignments and Descriptions ..................................................................................................... 11

Package Dimensions ....................................................................................................................................... 15

Temperature and Thermal Impedance ............................................................................................................ 18

Electrical Specifications .................................................................................................................................. 22

Electrical Specifications – I

Parameters ........................................................................................................ 24

Electrical Specifications – AC Operating Conditions ......................................................................................... 26

Functional Description ................................................................................................................................... 29

Commands .................................................................................................................................................... 30

COMMAND INHIBIT .................................................................................................................................. 30

NO OPERATION (NOP) ............................................................................................................................... 31

LOAD MODE REGISTER (LMR) ................................................................................................................... 31

ACTIVE ...................................................................................................................................................... 31

READ ......................................................................................................................................................... 32

WRITE ....................................................................................................................................................... 33

PRECHARGE .............................................................................................................................................. 34

BURST TERMINATE ................................................................................................................................... 34

REFRESH ................................................................................................................................................... 35

AUTO REFRESH ..................................................................................................................................... 35

SELF REFRESH ....................................................................................................................................... 35

Truth Tables ................................................................................................................................................... 36

Initialization .................................................................................................................................................. 41

Mode Register ................................................................................................................................................ 43

Burst Length .............................................................................................................................................. 45

Burst Type .................................................................................................................................................. 45

CAS Latency ............................................................................................................................................... 47

Operating Mode ......................................................................................................................................... 47

Write Burst Mode ....................................................................................................................................... 47

Bank/Row Activation ...................................................................................................................................... 48

READ Operation ............................................................................................................................................. 49

WRITE Operation ........................................................................................................................................... 58

Burst Read/Single Write .............................................................................................................................. 65

PRECHARGE Operation .................................................................................................................................. 66

Auto Precharge ........................................................................................................................................... 66

AUTO REFRESH Operation ............................................................................................................................. 78

SELF REFRESH Operation ............................................................................................................................... 80

Power-Down .................................................................................................................................................. 82

Clock Suspend ............................................................................................................................................... 83

PDF: 09005aef8091e66d

128mb_x4x8x16_sdram.pdf - Rev. R 10/12 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

128Mb: x4, x8, x16 SDRAM

Features

List of Figures

Figure 1: 32 Meg x 4 Functional Block Diagram ................................................................................................. 8

Figure 2: 16 Meg x 8 Functional Block Diagram ................................................................................................. 9

Figure 3: 8 Meg x 16 Functional Block Diagram ............................................................................................... 10

Figure 4: 54-Pin TSOP (Top View) .................................................................................................................. 11

Figure 5: 60-Ball FBGA (TopView) .................................................................................................................. 12

Figure 6: 54-Ball VFBGA (Top View) ............................................................................................................... 13

Figure 7: 54-Pin Plastic TSOP (400 mil) ........................................................................................................... 15

Figure 8: 60-Ball FBGA (x8 Device), 8mm x 16mm – Package Code FB/BB ........................................................ 16

Figure 9: 54-Ball VFBGA (x16 Device), 8mm x 8mm – Package Code F4/B4 ....................................................... 17

Figure 10: Example: Temperature Test Point Location, 54-Pin TSOP (Top View) ............................................... 20

Figure 11: Example: Temperature Test Point Location, 54-Ball VFBGA (Top View) ............................................ 21

Figure 12: Example: Temperature Test Point Location, 60-Ball FBGA (Top View) .............................................. 21

Figure 13: ACTIVE Command ........................................................................................................................ 31

Figure 14: READ Command ........................................................................................................................... 32

Figure 15: WRITE Command ......................................................................................................................... 33

Figure 16: PRECHARGE Command ................................................................................................................ 34

Figure 17: Initialize and Load Mode Register .................................................................................................. 42

Figure 18: Mode Register Definition ............................................................................................................... 44

Figure 19: CAS Latency .................................................................................................................................. 47

Figure 20: Example: Meeting

RCD (MIN) When 2 <

RCD (MIN)/

CK < 3 .......................................................... 48

Figure 21: Consecutive READ Bursts .............................................................................................................. 50

Figure 22: Random READ Accesses ................................................................................................................ 51

Figure 23: READ-to-WRITE ............................................................................................................................ 52

Figure 24: READ-to-WRITE With Extra Clock Cycle ......................................................................................... 53

Figure 25: READ-to-PRECHARGE .................................................................................................................. 53

Figure 26: Terminating a READ Burst ............................................................................................................. 54

Figure 27: Alternating Bank Read Accesses ..................................................................................................... 55

Figure 28: READ Continuous Page Burst ......................................................................................................... 56

Figure 29: READ – DQM Operation ................................................................................................................ 57

Figure 30: WRITE Burst ................................................................................................................................. 58

Figure 31: WRITE-to-WRITE .......................................................................................................................... 59

Figure 32: Random WRITE Cycles .................................................................................................................. 60

Figure 33: WRITE-to-READ ............................................................................................................................ 60

Figure 34: WRITE-to-PRECHARGE ................................................................................................................. 61

Figure 35: Terminating a WRITE Burst ............................................................................................................ 62

Figure 36: Alternating Bank Write Accesses ..................................................................................................... 63

Figure 37: WRITE – Continuous Page Burst ..................................................................................................... 64

Figure 38: WRITE – DQM Operation ............................................................................................................... 65

Figure 39: READ With Auto Precharge Interrupted by a READ ......................................................................... 67

Figure 40: READ With Auto Precharge Interrupted by a WRITE ........................................................................ 68

Figure 41: READ With Auto Precharge ............................................................................................................ 69

Figure 42: READ Without Auto Precharge ....................................................................................................... 70

Figure 43: Single READ With Auto Precharge .................................................................................................. 71

Figure 44: Single READ Without Auto Precharge ............................................................................................. 72

Figure 45: WRITE With Auto Precharge Interrupted by a READ ........................................................................ 73

Figure 46: WRITE With Auto Precharge Interrupted by a WRITE ...................................................................... 73

Figure 47: WRITE With Auto Precharge ........................................................................................................... 74

Figure 48: WRITE Without Auto Precharge ..................................................................................................... 75

Figure 49: Single WRITE With Auto Precharge ................................................................................................. 76

Figure 50: Single WRITE Without Auto Precharge ............................................................................................ 77

PDF: 09005aef8091e66d

128mb_x4x8x16_sdram.pdf - Rev. R 10/12 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

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