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MMBZ5226B-TP-HF

Description
Zener Diode, 3.3V V(Z), 5%, 0.35W,
CategoryDiscrete semiconductor    diode   
File Size237KB,5 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance
Download Datasheet Parametric View All

MMBZ5226B-TP-HF Overview

Zener Diode, 3.3V V(Z), 5%, 0.35W,

MMBZ5226B-TP-HF Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
package instructionSOT-23, 3 PIN
Reach Compliance Codecompliant
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance28 Ω
Maximum forward voltage (VF)1.2 V
JESD-30 codeR-PDSO-G3
Maximum knee impedance1600 Ω
Number of components1
Number of terminals3
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
polarityUNIDIRECTIONAL
Maximum power dissipation0.35 W
Nominal reference voltage3.3 V
Maximum reverse current25 µA
Reverse test voltage1 V
surface mountYES
technologyZENER
Terminal formGULL WING
Terminal locationDUAL
Maximum voltage tolerance5%
Working test current20 mA
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

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$ %    !"#
MMBZ5221B
THRU
MMBZ5259B
350 mW
Zener Diode
2.4 to 39 Volts
SOT-23
A
D
Features
Halogen
free available upon request by adding suffix "-HF"
Lead Free Finish/RoHS Compliant ("P" Suffix designates
RoHS Compliant. See ordering information)
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Wide Voltage Range Available
Small Outline Package For Space Savings
High Temp Soldering: 260°C for 10 Seconds At Terminals
Surface Mount Package
Maximum Ratings
Operating
Junction
Temperature: -55°C to +150°C
Storage Temperature: -55°C to +150°C
Maximum Thermal Resistance; 357°C/W Junction To Ambient
Maximum Ratings @ 25
o
C Unless Otherwise Specified
100
mA
Zener Current
I
F
Maximum Forward
V
F
1.2
V
Voltage
Power Dissipation
P
d
350
mWatt
(No te s A)
Pe ak Forward S urge I
FSM
4.0
Amps
Current (Not e s B)
NOTES:
A. Mounted on FR4 PC board with our suggested solder pad layout .
B. Measured on 8.3ms, single half sine-wave or equivalent
square wave, duty cycle = 4 pulses per minute maximum
.
C
B
E
F
J
G
H
K
DIMENSIONS
INCHES
MIN
.110
.086
.047
.033
.066
---
.035
.002
.013
.007
MM
MIN
2.80
2.20
1.20
.85
1.70
---
.90
.05
.35
.20
DIM
A
B
C
D
E
F
G
H
J
K
MAX
.119
.103
.056
.041
.083
.006
.044
.006
.020
---
MAX
3.00
2.60
1.40
1.05
2.10
.15
1.10
.15
.50
---
NOTE
Suggested Solder
Pad Layout
.035
.900
*Pin Configuration - Top View
.055
1.40
.102
2.60
inches
mm
.035
.880
.035
.880
Revision: B
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