BAS86
0.2A Surface-mount Small-signal Schottky Diode
PRODUCT SUMMARY
Voltage range 50 Volts
Popular small Mini-MELF package
Dissipation 200mW at T
A
= 25°C
SOD-80 (Mini-MELF)
FEATURES
For general-purpose applications.
This diode features low turn-on voltage.
This Schottky barrier device is protected by a PN junction
guard ring against excessive voltage, such as
electrostatic discharges
The low forward voltage drop and fast switching make it ideal for
protecting MOS devices, or as steering, biasing and coupling
diodes for fast switching and low logic level applications.
This diode is also available in the DO-35 case as a BAT86.
MECHANICAL DATA
Case: MiniMELF glass case (SOD-80)
Weight: approx. 0.05g
Cathode band color: Green
Dimensions in inches and (millimeters)
Pb-free, RoHS compliant.
MAXIMUM RATINGS
Rating at 25°C ambient temperature unless otherwise specified.
P
arameter
Continuous reverse voltage
Forward continuous current at T
amb
=25
o
C
Repetitive peak forward current
at tp<1s, d<0.5, T
amb
=25
o
C
Power dissipation at T
amb
=25
o
C
Thermal resistance junction to ambient air
Junction temperature
Ambient operating temperature range
Storage temperature range
Symbo
l
V
R
I
F
I
FRM
P
tot
R
θ
JA
T
j
T
amb
T
S
Value
50
200
500
200
300
125
-65 to +125
-65 to +150
(Note 1)
Unit
Volts
mA
mA
mW
°C/W
°C
°C
°C
(Note 1)
(Note 1)
(Note 1)
Notes: 1. Valid as long as the electrodes are maintained at 25°C.
10/1/2006 Rev.3.01
www.SiliconStandard.com
1 of 2
BAS86
ELECTRICAL CHARACTERISTICS
T
j
=25°C unless otherwise noted.
Parameter
Reverse breakdown voltage
Leakage current
Symbol
V
(BR)R
I
R
Test Condition
I
R
=10
u
A (pulsed)
V
R
=25V
Pulse Test tp<300
u
s, d<2 %
I
F
=0.1mA
I
F
=1mA
I
F
=10mA
I
F
=30mA
I
F
=100mA
V
R
=1V, f=1MHz
I
F
=10mA, I
R
=10mA,
I
R
=1mA
-
-
-
-
-
-
-
Min.
50
Typ.
-
0.2
0.200
0.275
0.365
0.460
0.700
-
-
Max.
-
0.5
0.300
0.380
0.450
0.600
0.900
8
5
Unit
Volts
mA
Forward voltage
V
F
Volt
Capacitance
Reverse recovery time
C
tot
t
rr
pF
ns
o
Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no
guarantee or warranty, expressed or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no
responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its
use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including
without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to
the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of
Silicon Standard Corporation or any third parties.
10/1/2006 Rev.3.01
www.SiliconStandard.com
2 of 2
Embedded System
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