74LVC157APW-T datasheet, PDF - EEWORLD Datasheet

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74LVC157APW-T: DescriptionMultiplexer, 4-Func, 2 Line Input, CMOS, PDSO16; Categorylogic logic; File Size336KB，8 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/; Environmental Compliance

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74LVC157APW-T Overview

Multiplexer, 4-Func, 2 Line Input, CMOS, PDSO16

74LVC157APW-T Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	TSSOP, TSSOP16,.25
Reach Compliance Code	unknown
JESD-30 code	R-PDSO-G16
Load capacitance (CL)	50 pF
Logic integrated circuit type	MULTIPLEXER
MaximumI(ol)	0.024 A
Number of functions	4
Number of entries	2
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP16,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing	TAPE AND REEL
power supply	3.3 V
Prop。Delay @ Nom-Sup	5.7 ns
Certification status	Not Qualified
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.635 mm
Terminal location	DUAL

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74LVC157APW-T Related Products

	74LVC157APW-T	74LVC157ADB-T	74LVC157AD-T
Description	Multiplexer, 4-Func, 2 Line Input, CMOS, PDSO16	Multiplexer, 4-Func, 2 Line Input, CMOS, PDSO16	Multiplexer, 4-Func, 2 Line Input, CMOS, PDSO16
Is it Rohs certified?	conform to	conform to	conform to
Maker	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	TSSOP, TSSOP16,.25	SSOP, SSOP16,.3	SOP, SOP16,.25
Reach Compliance Code	unknown	unknown	unknown
JESD-30 code	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16
Load capacitance (CL)	50 pF	50 pF	50 pF
Logic integrated circuit type	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER
MaximumI(ol)	0.024 A	0.024 A	0.024 A
Number of functions	4	4	4
Number of entries	2	2	2
Number of terminals	16	16	16
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSSOP	SSOP	SOP
Encapsulate equivalent code	TSSOP16,.25	SSOP16,.3	SOP16,.25
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE
method of packing	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL
power supply	3.3 V	3.3 V	3.3 V
Prop。Delay @ Nom-Sup	5.7 ns	5.7 ns	5.7 ns
Certification status	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	GULL WING	GULL WING
Terminal pitch	0.635 mm	0.635 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL
Humidity sensitivity level	-	1	1

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