74AHC3GU04 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > 74AHC3GU04

Preview

74AHC3GU04: Descriptionhigh-speed Si-gate CMOS device; File Size149KB，15 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

Download Datasheet Compare View All

74AHC3GU04 Overview

high-speed Si-gate CMOS device

Preview

Download Datasheet

View All

74AHC3GU04

Inverter

Rev. 04 — 7 January 2010

Product data sheet

1. General description

The 74AHC3GU04 is a high-speed Si-gate CMOS device. This device provides three

inverter gates with unbuffered outputs.

2. Features

Symmetrical output impedance

High noise immunity

ESD protection:

HBM JESD22-A114F exceeds 2 000 V

MM JESD22-A115-A exceeds 200 V

CDM JESD22-C101D exceeds 1 000 V

Low power dissipation

Balanced propagation delays

Multiple package options

Specified from

−40 °C

to +85

°C

and from

−40 °C

to +125

°C

3. Ordering information

Table 1.

Ordering information

Package

Temperature range

74AHC3GU04DP

74AHC3GU04DC

74AHC3GU04GD

−40 °C

to +125

°C

−40 °C

to +125

°C

−40 °C

to +125

°C

Name

TSSOP8

VSSOP8

XSON8U

Description

plastic thin shrink small outline package; 8 leads;

body width 3 mm; lead length 0.5 mm

Version

SOT505-2

Type number

plastic very thin shrink small outline package; 8 leads; SOT765-1

body width 2.3 mm

plastic extremely thin small outline package; no leads; SOT996-2

8 terminals; UTLP based; body 3

0.5 mm

74AHC3GU04 Related Products

	74AHC3GU04	74AHC3GU04DC	74AHC3GU04DP	74AHC3GU04GD
Description	high-speed Si-gate CMOS device	high-speed Si-gate CMOS device	high-speed Si-gate CMOS device	high-speed Si-gate CMOS device
Is it lead-free?	-	Lead free	Lead free	Lead free
Is it Rohs certified?	-	conform to	conform to	conform to
Maker	-	NXP	NXP	NXP
Parts packaging code	-	TSSOP	SOIC	SON
package instruction	-	VSSOP, TSSOP8,.12,20	3 MM WIDTH, PLASTIC, SOT505-2, TSSOP-8	VSON, SOLCC8,.11,20
Contacts	-	8	8	8
Reach Compliance Code	-	compli	compli	compli
series	-	AHC/VHC/H/U/V	AHC/VHC/H/U/V	AHC/VHC/H/U/V
JESD-30 code	-	R-PDSO-G8	S-PDSO-G8	R-PDSO-N8
JESD-609 code	-	e4	e4	e4
length	-	2.3 mm	3 mm	3 mm
Load capacitance (CL)	-	50 pF	50 pF	50 pF
Logic integrated circuit type	-	INVERTER	INVERTER	INVERTER
MaximumI(ol)	-	0.008 A	0.008 A	0.008 A
Humidity sensitivity level	-	1	1	1
Number of functions	-	3	3	3
Number of entries	-	1	1	1
Number of terminals	-	8	8	8
Maximum operating temperature	-	125 °C	125 °C	125 °C
Minimum operating temperature	-	-40 °C	-40 °C	-40 °C
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	VSSOP	TSSOP	VSON
Encapsulate equivalent code	-	TSSOP8,.12,20	TSSOP8,.16	SOLCC8,.11,20
Package shape	-	RECTANGULAR	SQUARE	RECTANGULAR
Package form	-	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE
method of packing	-	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL
Peak Reflow Temperature (Celsius)	-	260	260	260
power supply	-	2/5.5 V	2/5.5 V	2/5.5 V
Prop。Delay @ Nom-Su	-	9 ns	9 ns	9 ns
propagation delay (tpd)	-	13.5 ns	13.5 ns	13.5 ns
Certification status	-	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	-	NO	NO	NO
Maximum seat height	-	1 mm	1.1 mm	0.5 mm
Maximum supply voltage (Vsup)	-	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	-	2 V	2 V	2 V
Nominal supply voltage (Vsup)	-	5 V	5 V	5 V
surface mount	-	YES	YES	YES
technology	-	CMOS	CMOS	CMOS
Temperature level	-	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	-	Nickel/Palladium/Gold (Ni/Pd/Au)	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	-	GULL WING	GULL WING	NO LEAD
Terminal pitch	-	0.5 mm	0.65 mm	0.5 mm
Terminal location	-	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	-	30	30	30
width	-	2 mm	3 mm	2 mm

Recommended Resources

Isolated digital output circuit b

Automatic time-limited water supply circuit

Gem KYT-30A turning fan circuit diagram

XTR103 integrated current transmitter

Duplex wired telephone circuit diagram

Example of phase-shifted oscillator circuit

F28335 ADC learning process: 1 ADC conversion stepsThe A/D converter (ADC) usually goes through four steps to convert analog quantity into digital quantity: sampling, holding, quantization and encoding. Sampling: Converting a con...; 火辣西米秀 Microcontroller MCU

I think the best microcontroller learning materials continue: That's all for now. [[i] This post was last edited by lovedata on 2008-12-30 15:21 [/i]]...; lovedata MCU

Flashlight ZT made by a talented person: [font=宋体]My colleague asked me to make a flashlight for him. I had a 3.6V rechargeable lithium battery the size of an AA battery. I remembered that I had bought two large LED lamp beads with a diamete...; hanker510 DIY/Open Source Hardware

【Expecting suggestions】Please propose the section classification you think is reasonable: At present, our forum categories are as follows. Some friends have reported that some of them are repeated or unclear, so I would like to hear your suggestions::)...; EEWORLD社区 Suggestions & Announcements

About ISA bus driver: I am working on a project that requires communication via the ISA bus. This is my first time using an embedded WinCE operating system, so I don’t know much about it. I would like to ask for your advic...; gtongy Embedded System

ModelingPhasedArrayAntennasinAnsoft HFSS: A number of algorithms and procedures have been developed for the commercial 3D finite element solverAnsoft HFSS, to model antennas. Primary among these is the application of periodic boundary conditi...; JasonYoo Test/Measurement

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components