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74AHC3GU04DC

Description
high-speed Si-gate CMOS device
Categorylogic    logic   
File Size149KB,15 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric Compare View All

74AHC3GU04DC Overview

high-speed Si-gate CMOS device

74AHC3GU04DC Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeTSSOP
package instructionVSSOP, TSSOP8,.12,20
Contacts8
Reach Compliance Codecompli
seriesAHC/VHC/H/U/V
JESD-30 codeR-PDSO-G8
JESD-609 codee4
length2.3 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeINVERTER
MaximumI(ol)0.008 A
Humidity sensitivity level1
Number of functions3
Number of entries1
Number of terminals8
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeVSSOP
Encapsulate equivalent codeTSSOP8,.12,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)260
power supply2/5.5 V
Prop。Delay @ Nom-Su9 ns
propagation delay (tpd)13.5 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height1 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width2 mm
Base Number Matches1
74AHC3GU04
Inverter
Rev. 04 — 7 January 2010
Product data sheet
1. General description
The 74AHC3GU04 is a high-speed Si-gate CMOS device. This device provides three
inverter gates with unbuffered outputs.
2. Features
Symmetrical output impedance
High noise immunity
ESD protection:
HBM JESD22-A114F exceeds 2 000 V
MM JESD22-A115-A exceeds 200 V
CDM JESD22-C101D exceeds 1 000 V
Low power dissipation
Balanced propagation delays
Multiple package options
Specified from
−40 °C
to +85
°C
and from
−40 °C
to +125
°C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74AHC3GU04DP
74AHC3GU04DC
74AHC3GU04GD
−40 °C
to +125
°C
−40 °C
to +125
°C
−40 °C
to +125
°C
Name
TSSOP8
VSSOP8
XSON8U
Description
plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
Version
SOT505-2
Type number
plastic very thin shrink small outline package; 8 leads; SOT765-1
body width 2.3 mm
plastic extremely thin small outline package; no leads; SOT996-2
8 terminals; UTLP based; body 3
×
2
×
0.5 mm

74AHC3GU04DC Related Products

74AHC3GU04DC 74AHC3GU04 74AHC3GU04DP 74AHC3GU04GD
Description high-speed Si-gate CMOS device high-speed Si-gate CMOS device high-speed Si-gate CMOS device high-speed Si-gate CMOS device
Is it lead-free? Lead free - Lead free Lead free
Is it Rohs certified? conform to - conform to conform to
Maker NXP - NXP NXP
Parts packaging code TSSOP - SOIC SON
package instruction VSSOP, TSSOP8,.12,20 - 3 MM WIDTH, PLASTIC, SOT505-2, TSSOP-8 VSON, SOLCC8,.11,20
Contacts 8 - 8 8
Reach Compliance Code compli - compli compli
series AHC/VHC/H/U/V - AHC/VHC/H/U/V AHC/VHC/H/U/V
JESD-30 code R-PDSO-G8 - S-PDSO-G8 R-PDSO-N8
JESD-609 code e4 - e4 e4
length 2.3 mm - 3 mm 3 mm
Load capacitance (CL) 50 pF - 50 pF 50 pF
Logic integrated circuit type INVERTER - INVERTER INVERTER
MaximumI(ol) 0.008 A - 0.008 A 0.008 A
Humidity sensitivity level 1 - 1 1
Number of functions 3 - 3 3
Number of entries 1 - 1 1
Number of terminals 8 - 8 8
Maximum operating temperature 125 °C - 125 °C 125 °C
Minimum operating temperature -40 °C - -40 °C -40 °C
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code VSSOP - TSSOP VSON
Encapsulate equivalent code TSSOP8,.12,20 - TSSOP8,.16 SOLCC8,.11,20
Package shape RECTANGULAR - SQUARE RECTANGULAR
Package form SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE
method of packing TAPE AND REEL - TAPE AND REEL TAPE AND REEL
Peak Reflow Temperature (Celsius) 260 - 260 260
power supply 2/5.5 V - 2/5.5 V 2/5.5 V
Prop。Delay @ Nom-Su 9 ns - 9 ns 9 ns
propagation delay (tpd) 13.5 ns - 13.5 ns 13.5 ns
Certification status Not Qualified - Not Qualified Not Qualified
Schmitt trigger NO - NO NO
Maximum seat height 1 mm - 1.1 mm 0.5 mm
Maximum supply voltage (Vsup) 5.5 V - 5.5 V 5.5 V
Minimum supply voltage (Vsup) 2 V - 2 V 2 V
Nominal supply voltage (Vsup) 5 V - 5 V 5 V
surface mount YES - YES YES
technology CMOS - CMOS CMOS
Temperature level AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) - NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form GULL WING - GULL WING NO LEAD
Terminal pitch 0.5 mm - 0.65 mm 0.5 mm
Terminal location DUAL - DUAL DUAL
Maximum time at peak reflow temperature 30 - 30 30
width 2 mm - 3 mm 2 mm

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