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74AUP1G74

Description
Low-power D-type flip-flop with set and reset; positive-edge trigger
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size102KB,24 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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74AUP1G74 Overview

Low-power D-type flip-flop with set and reset; positive-edge trigger

74AUP1G74 Parametric

Parameter NameAttribute value
Reach Compliance Codeunknow
ECCN codeEAR99
Interface integrated circuit typeLINE DRIVER
Base Number Matches1
74AUP1G74
Low-power D-type flip-flop with set and reset; positive-edge
trigger
Rev. 04 — 3 June 2008
Product data sheet
1. General description
The 74AUP1G74 provides a low-power, low-voltage single positive-edge triggered D-type
flip-flop with individual data (D), clock (CP), set (SD) and reset (RD) inputs and
complementary Q and Q outputs. The SD and RD are asynchronous active LOW inputs
and operate independently of the clock input. Information on the data input is transferred
to the Q output on the LOW-to-HIGH transition of the clock pulse. The D input must be
stable one set-up time prior to the LOW-to-HIGH clock transition for predictable operation.
Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall
times across the entire V
CC
range from 0.8 V to 3.6 V.
This device ensures a very low static and dynamic power consumption across the entire
V
CC
range from 0.8 V to 3.6 V.
This device is fully specified for partial power-down applications using I
OFF
. The I
OFF
circuitry disables the output, preventing the damaging backflow current through the device
when it is powered down.
2. Features
I
Wide supply voltage range from 0.8 V to 3.6 V
I
High noise immunity
I
Complies with JEDEC standards:
N
JESD8-12 (0.8 V to 1.3 V)
N
JESD8-11 (0.9 V to 1.65 V)
N
JESD8-7 (1.2 V to 1.95 V)
N
JESD8-5 (1.8 V to 2.7 V)
N
JESD8-B (2.7 V to 3.6 V)
I
ESD protection:
N
HBM JESD22-A114E Class 3A exceeds 5000 V
N
MM JESD22-A115-A exceeds 200 V
N
CDM JESD22-C101C exceeds 1000 V
I
Low static power consumption; I
CC
= 0.9
µA
(maximum)
I
Latch-up performance exceeds 100 mA per JESD 78 Class II
I
Inputs accept voltages up to 3.6 V
I
Low noise overshoot and undershoot < 10 % of V
CC
I
I
OFF
circuitry provides partial Power-down mode operation
I
Multiple package options
I
Specified from
−40 °C
to +85
°C
and
−40 °C
to +125
°C

74AUP1G74 Related Products

74AUP1G74 74AUP1G74DC 74AUP1G74GT 74AUP1G74GD 74AUP1G74GM
Description Low-power D-type flip-flop with set and reset; positive-edge trigger Low-power D-type flip-flop with set and reset; positive-edge trigger Low-power D-type flip-flop with set and reset; positive-edge trigger Low-power D-type flip-flop with set and reset; positive-edge trigger Low-power D-type flip-flop with set and reset; positive-edge trigger
Reach Compliance Code unknow compli compli compli compli
Is it Rohs certified? - conform to conform to conform to conform to
Parts packaging code - TSSOP SON SON QFN
package instruction - VSSOP, TSSOP8,.12,20 VSON, SOLCC8,.04,20 VSON, SOLCC8,.11,20 HVQCCN, LCC8,.06SQ,20
Contacts - 8 8 8 8
series - AUP/ULP/V AUP/ULP/V AUP/ULP/V AUP/ULP/V
JESD-30 code - R-PDSO-G8 R-PDSO-N8 R-PDSO-N8 S-PQCC-N8
JESD-609 code - e4 e3 e4 e4
length - 2.3 mm 1.95 mm 3 mm 1.6 mm
Load capacitance (CL) - 30 pF 30 pF 30 pF 30 pF
Logic integrated circuit type - D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP
Maximum Frequency@Nom-Su - 70000000 Hz 70000000 Hz 150000000 Hz 70000000 Hz
MaximumI(ol) - 0.0017 A 0.0017 A 0.0017 A 0.0017 A
Humidity sensitivity level - 1 1 1 1
Number of digits - 1 1 1 1
Number of functions - 1 1 1 1
Number of terminals - 8 8 8 8
Maximum operating temperature - 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature - -40 °C -40 °C -40 °C -40 °C
Output polarity - COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - VSSOP VSON VSON HVQCCN
Encapsulate equivalent code - TSSOP8,.12,20 SOLCC8,.04,20 SOLCC8,.11,20 LCC8,.06SQ,20
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR SQUARE
Package form - SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
method of packing - TAPE AND REEL TAPE AND REEL TAPE AND REEL TAPE AND REEL
Peak Reflow Temperature (Celsius) - 260 260 260 260
power supply - 1.2/3.3 V 1.2/3.3 V 1.2/3.3 V 1.2/3.3 V
propagation delay (tpd) - 23.3 ns 23.3 ns 23.3 ns 23.3 ns
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height - 1 mm 0.5 mm 0.5 mm 0.5 mm
Maximum supply voltage (Vsup) - 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) - 0.8 V 0.8 V 0.8 V 0.8 V
Nominal supply voltage (Vsup) - 1.1 V 1.1 V 1.1 V 1.1 V
surface mount - YES YES YES YES
technology - CMOS CMOS CMOS CMOS
Temperature level - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface - Nickel/Palladium/Gold (Ni/Pd/Au) Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD
Terminal form - GULL WING NO LEAD NO LEAD NO LEAD
Terminal pitch - 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location - DUAL DUAL DUAL QUAD
Maximum time at peak reflow temperature - 30 30 30 30
Trigger type - POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE
width - 2 mm 1 mm 2 mm 1.6 mm
minfmax - 510 MHz 510 MHz 510 MHz 510 MHz
Maker - - NXP NXP NXP

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