EEWORLDEEWORLDEEWORLD

Part Number

Search

BZV55B33L1

Description
Zener Diode, 33V V(Z), 2%, 0.5W, Silicon, Unidirectional, DO-213AC, ROHS COMPLIANT, HERMETIC SEALED, GLASS, LL34, MINIMELF-2
CategoryDiscrete semiconductor    diode   
File Size365KB,4 Pages
ManufacturerTaiwan Semiconductor
Websitehttp://www.taiwansemi.com/
Environmental Compliance
Download Datasheet Parametric View All

BZV55B33L1 Overview

Zener Diode, 33V V(Z), 2%, 0.5W, Silicon, Unidirectional, DO-213AC, ROHS COMPLIANT, HERMETIC SEALED, GLASS, LL34, MINIMELF-2

BZV55B33L1 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerTaiwan Semiconductor
package instructionROHS COMPLIANT, HERMETIC SEALED, GLASS, LL34, MINIMELF-2
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresHIGH RELIABILITY
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JEDEC-95 codeDO-213AC
JESD-30 codeO-LELF-R2
Number of components1
Number of terminals2
Maximum operating temperature175 °C
Minimum operating temperature-65 °C
Package body materialGLASS
Package shapeROUND
Package formLONG FORM
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityUNIDIRECTIONAL
Maximum power dissipation0.5 W
Certification statusNot Qualified
Nominal reference voltage33 V
surface mountYES
technologyZENER
Terminal formWRAP AROUND
Terminal locationEND
Maximum time at peak reflow temperatureNOT SPECIFIED
Maximum voltage tolerance2%
Working test current5 mA
BZV55B2V4-BZV55B75
500mW,2% Tolerance Zener Diode
Small Signal Diode
Mini-MELF (LL34)
HERMETICALLY SEALED GLASS
Features
Wide zener voltage range selection:2.4V to 75V
Vz Tolerance Selection of ±2%
Designed for through-Hole Device Type Mounting
Hermetically Sealed Glass
Pb free version and RoHS compliant
High reliability glass passivation insuring parameter
stability and protection against junction contamination
Unit (mm)
Min
3.30
1.40
0.25
1.25
Mechanical Data
Case : Mini-MELF Package (JEDEC DO-213AC)
High temperature soldering guaranteed : 270°C/10s
Polarity : Indicated by cathode band
Weight : approx. 31 mg
Dimensions
A
B
C
D
Unit (inch)
Min
0.130
0.055
0.010
0.049
Max
3.70
1.60
0.40
1.40
Max
0.146
0.063
0.016
0.055
Ordering Information
Part No.
BZV55B2V4-75
BZV55B2V4-75
Package code
L0
L1
Package
LL34
LL34
Packing
10K / 13" Reel
2.5K / 7" Reel
Suggested PAD Layout
1.25
0.049
2.00
2.50
0.079
0.098
5.00
0.197
mm
inch
Maximum Ratings and Electrical Characteristics
Rating at 25°C ambient temperature unless otherwise specified.
Maximum Ratings
Type Number
Power Dissipation
Maximum Forward Voltage @I
F
=100mA
Thermal Resistance (Junction to Ambient) (Note 1)
Storage Temperature Range
Symbol
P
D
V
F
RθJA
T
J
,T
STG
Value
500
1
300
-65 to + 175
Units
mW
V
°C/W
°C
Zener I vs.V Characteristics
Current
I
F
V
ZM
V
Z
V
BR
V
R
I
R
I
ZK
V
F
Voltage
V
BR
I
ZK
Z
ZK
I
ZT
V
Z
Z
ZT
Forward Region
: Voltage at I
ZK
: Test current for voltage V
BR
: Dynamic impedance at I
ZK
: Test current for voltage V
Z
: Voltage at current I
ZT
: Dynamic impedance at I
ZT
: Maximum steady state current
: Voltage at I
ZM
I
ZT
I
ZM
BreakdownRegion
Leakage Region
I
ZM
V
ZM
Version : C11
About JTAG
The DSP I use does not have the emu0 and emu1 pins, but the emulator I bought has these two pins. So how do I deal with these two pins?...
l0700830216 DSP and ARM Processors
The coordinator controls the on and off of the node lights
How to use the coordinator to control the on and off of the node lights below through the serial port? How to make the code? Thank you...
高磊 RF/Wirelessly
Collection Post---74 Series Chip Application Encyclopedia--Chinese Manual, Application Circuit (10~100 Chip Coins Reward)
Are you bothered by the various English data manuals you have to face from time to time during the design process? Indeed, almost everyone of us has to face those English manuals when doing design. Wh...
tiankai001 MCU
Looking for a voltage detection circuit or chip, 3v to 12v
...
小小的世界 Power technology
Ask a question!
If the memory address range is: 4000H-43FFH, each storage unit can store 16 bits, and the storage area is composed of 4 memory chips, what is the capacity of the memory chips used to constitute the me...
a79571843 Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1428  2871  83  2671  1552  29  58  2  54  32 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号