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74HC21

Description
Dual 4-input AND gate
File Size74KB,14 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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74HC21 Overview

Dual 4-input AND gate

74HC21
Dual 4-input AND gate
Rev. 05 — 7 May 2009
Product data sheet
1. General description
The 74HC21 is a high-speed Si-gate CMOS device and is pin compatible with low-power
Schottky TTL (LSTTL).
The 74HC21 provide the 4-input AND function.
2. Features
I
Low-power dissipation
I
Complies with JEDEC standard no. 7A
I
ESD protection:
N
HBM JESD22-A114E exceeds 2000 V
N
MM JESD22-A115-A exceeds 200 V
I
Multiple package options
I
Specified from
−40 °C
to +80
°C
and from
−40 °C
to +125
°C.
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74HC21N
74HC21D
74HC21DB
74HC21PW
−40 °C
to +125
°C
−40 °C
to +125
°C
−40 °C
to +125
°C
−40 °C
to +125
°C
Name
DIP14
SO14
SSOP14
TSSOP14
Description
plastic dual in-line package; 14 leads (300 mil)
plastic small outline package; 14 leads;
body width 3.9 mm
plastic shrink small outline package; 14 leads;
body width 5.3 mm
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
Version
SOT27-1
SOT108-1
SOT337-1
SOT402-1
Type number

74HC21 Related Products

74HC21 74HC21DB 74HC21PW 74HC21N 74HC21D
Description Dual 4-input AND gate Dual 4-input AND gate Dual 4-input AND gate Dual 4-input AND gate Dual 4-input AND gate
Is it lead-free? - Lead free - Lead free Lead free
Is it Rohs certified? - conform to conform to conform to conform to
Maker - NXP NXP NXP NXP
Parts packaging code - SSOP TSSOP MO-001 SOIC
package instruction - 5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14 TSSOP, TSSOP14,.25 DIP, 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
Contacts - 14 14 14 14
Reach Compliance Code - unknow compli compli unknow
series - HC/UH HC/UH HC/UH HC/UH
JESD-30 code - R-PDSO-G14 R-PDSO-G14 R-PDIP-T14 R-PDSO-G14
JESD-609 code - e4 e4 e4 e4
length - 6.2 mm 5 mm 19.025 mm 8.65 mm
Load capacitance (CL) - 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type - AND GATE AND GATE AND GATE AND GATE
MaximumI(ol) - 0.004 A 0.004 A - 0.004 A
Humidity sensitivity level - 1 1 - 1
Number of functions - 2 2 2 2
Number of entries - 4 4 4 4
Number of terminals - 14 14 14 14
Maximum operating temperature - 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature - -40 °C -40 °C -40 °C -40 °C
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - SSOP TSSOP DIP SOP
Encapsulate equivalent code - SSOP14,.3 TSSOP14,.25 - SOP14,.25
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form - SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) - 260 260 NOT SPECIFIED 260
power supply - 2/6 V 2/6 V - 2/6 V
Prop。Delay @ Nom-Su - 33 ns 33 ns - 28 ns
propagation delay (tpd) - 165 ns 165 ns 165 ns 165 ns
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger - NO NO - NO
Maximum seat height - 2 mm 1.1 mm 4.2 mm 1.75 mm
Maximum supply voltage (Vsup) - 6 V 6 V 6 V 6 V
Minimum supply voltage (Vsup) - 2 V 2 V 2 V 2 V
Nominal supply voltage (Vsup) - 5 V 5 V 5 V 5 V
surface mount - YES YES NO YES
technology - CMOS CMOS CMOS CMOS
Temperature level - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface - NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD
Terminal form - GULL WING GULL WING THROUGH-HOLE GULL WING
Terminal pitch - 0.65 mm 0.65 mm 2.54 mm 1.27 mm
Terminal location - DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature - 30 30 NOT SPECIFIED 30
width - 5.3 mm 4.4 mm 7.62 mm 3.9 mm

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