EEWORLDEEWORLDEEWORLD

Part Number

Search

74HC21N

Description
Dual 4-input AND gate
Categorylogic    logic   
File Size74KB,14 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric Compare View All

74HC21N Overview

Dual 4-input AND gate

74HC21N Parametric

Parameter NameAttribute value
Source Url Status Check Date2013-06-14 00:00:00
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeMO-001
package instructionDIP,
Contacts14
Reach Compliance Codecompli
ECCN codeEAR99
seriesHC/UH
JESD-30 codeR-PDIP-T14
JESD-609 codee4
length19.025 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeAND GATE
Number of functions2
Number of entries4
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
propagation delay (tpd)165 ns
Certification statusNot Qualified
Maximum seat height4.2 mm
Maximum supply voltage (Vsup)6 V
Minimum supply voltage (Vsup)2 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm
74HC21
Dual 4-input AND gate
Rev. 05 — 7 May 2009
Product data sheet
1. General description
The 74HC21 is a high-speed Si-gate CMOS device and is pin compatible with low-power
Schottky TTL (LSTTL).
The 74HC21 provide the 4-input AND function.
2. Features
I
Low-power dissipation
I
Complies with JEDEC standard no. 7A
I
ESD protection:
N
HBM JESD22-A114E exceeds 2000 V
N
MM JESD22-A115-A exceeds 200 V
I
Multiple package options
I
Specified from
−40 °C
to +80
°C
and from
−40 °C
to +125
°C.
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74HC21N
74HC21D
74HC21DB
74HC21PW
−40 °C
to +125
°C
−40 °C
to +125
°C
−40 °C
to +125
°C
−40 °C
to +125
°C
Name
DIP14
SO14
SSOP14
TSSOP14
Description
plastic dual in-line package; 14 leads (300 mil)
plastic small outline package; 14 leads;
body width 3.9 mm
plastic shrink small outline package; 14 leads;
body width 5.3 mm
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
Version
SOT27-1
SOT108-1
SOT337-1
SOT402-1
Type number

74HC21N Related Products

74HC21N 74HC21 74HC21DB 74HC21PW 74HC21D
Description Dual 4-input AND gate Dual 4-input AND gate Dual 4-input AND gate Dual 4-input AND gate Dual 4-input AND gate
Is it lead-free? Lead free - Lead free - Lead free
Is it Rohs certified? conform to - conform to conform to conform to
Maker NXP - NXP NXP NXP
Parts packaging code MO-001 - SSOP TSSOP SOIC
package instruction DIP, - 5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14 TSSOP, TSSOP14,.25 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
Contacts 14 - 14 14 14
Reach Compliance Code compli - unknow compli unknow
series HC/UH - HC/UH HC/UH HC/UH
JESD-30 code R-PDIP-T14 - R-PDSO-G14 R-PDSO-G14 R-PDSO-G14
JESD-609 code e4 - e4 e4 e4
length 19.025 mm - 6.2 mm 5 mm 8.65 mm
Load capacitance (CL) 50 pF - 50 pF 50 pF 50 pF
Logic integrated circuit type AND GATE - AND GATE AND GATE AND GATE
Number of functions 2 - 2 2 2
Number of entries 4 - 4 4 4
Number of terminals 14 - 14 14 14
Maximum operating temperature 125 °C - 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C - -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP - SSOP TSSOP SOP
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE - SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED - 260 260 260
propagation delay (tpd) 165 ns - 165 ns 165 ns 165 ns
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified
Maximum seat height 4.2 mm - 2 mm 1.1 mm 1.75 mm
Maximum supply voltage (Vsup) 6 V - 6 V 6 V 6 V
Minimum supply voltage (Vsup) 2 V - 2 V 2 V 2 V
Nominal supply voltage (Vsup) 5 V - 5 V 5 V 5 V
surface mount NO - YES YES YES
technology CMOS - CMOS CMOS CMOS
Temperature level AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) - NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal form THROUGH-HOLE - GULL WING GULL WING GULL WING
Terminal pitch 2.54 mm - 0.65 mm 0.65 mm 1.27 mm
Terminal location DUAL - DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED - 30 30 30
width 7.62 mm - 5.3 mm 4.4 mm 3.9 mm
MaximumI(ol) - - 0.004 A 0.004 A 0.004 A
Humidity sensitivity level - - 1 1 1
Encapsulate equivalent code - - SSOP14,.3 TSSOP14,.25 SOP14,.25
power supply - - 2/6 V 2/6 V 2/6 V
Prop。Delay @ Nom-Su - - 33 ns 33 ns 28 ns
Schmitt trigger - - NO NO NO

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 968  1356  498  2216  212  20  28  11  45  5 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号