74HC21D datasheet, PDF - EEWORLD Datasheet

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74HC21D: DescriptionDual 4-input AND gate; Categorylogic logic; File Size74KB，14 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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74HC21D Overview

Dual 4-input AND gate

74HC21D Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	SOIC
package instruction	3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
Contacts	14
Reach Compliance Code	unknow
series	HC/UH
JESD-30 code	R-PDSO-G14
JESD-609 code	e4
length	8.65 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	AND GATE
MaximumI(ol)	0.004 A
Humidity sensitivity level	1
Number of functions	2
Number of entries	4
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP14,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
method of packing	TUBE
Peak Reflow Temperature (Celsius)	260
power supply	2/6 V
Prop。Delay @ Nom-Su	28 ns
propagation delay (tpd)	165 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	1.75 mm
Maximum supply voltage (Vsup)	6 V
Minimum supply voltage (Vsup)	2 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	NICKEL PALLADIUM GOLD
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	3.9 mm

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74HC21

Dual 4-input AND gate

Rev. 05 — 7 May 2009

Product data sheet

1. General description

The 74HC21 is a high-speed Si-gate CMOS device and is pin compatible with low-power

Schottky TTL (LSTTL).

The 74HC21 provide the 4-input AND function.

2. Features

Low-power dissipation

Complies with JEDEC standard no. 7A

ESD protection:

HBM JESD22-A114E exceeds 2000 V

MM JESD22-A115-A exceeds 200 V

Multiple package options

Speciﬁed from

−40 °C

to +80

°C

and from

−40 °C

to +125

°C.

3. Ordering information

Table 1.

Ordering information

Package

Temperature range

74HC21N

74HC21D

74HC21DB

74HC21PW

−40 °C

to +125

°C

−40 °C

to +125

°C

−40 °C

to +125

°C

−40 °C

to +125

°C

Name

DIP14

SO14

SSOP14

TSSOP14

Description

plastic dual in-line package; 14 leads (300 mil)

plastic small outline package; 14 leads;

body width 3.9 mm

plastic shrink small outline package; 14 leads;

body width 5.3 mm

plastic thin shrink small outline package; 14 leads;

body width 4.4 mm

Version

SOT27-1

SOT108-1

SOT337-1

SOT402-1

Type number

74HC21D Related Products

	74HC21D	74HC21	74HC21DB	74HC21PW	74HC21N
Description	Dual 4-input AND gate	Dual 4-input AND gate	Dual 4-input AND gate	Dual 4-input AND gate	Dual 4-input AND gate
Is it lead-free?	Lead free	-	Lead free	-	Lead free
Is it Rohs certified?	conform to	-	conform to	conform to	conform to
Maker	NXP	-	NXP	NXP	NXP
Parts packaging code	SOIC	-	SSOP	TSSOP	MO-001
package instruction	3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14	-	5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14	TSSOP, TSSOP14,.25	DIP,
Contacts	14	-	14	14	14
Reach Compliance Code	unknow	-	unknow	compli	compli
series	HC/UH	-	HC/UH	HC/UH	HC/UH
JESD-30 code	R-PDSO-G14	-	R-PDSO-G14	R-PDSO-G14	R-PDIP-T14
JESD-609 code	e4	-	e4	e4	e4
length	8.65 mm	-	6.2 mm	5 mm	19.025 mm
Load capacitance (CL)	50 pF	-	50 pF	50 pF	50 pF
Logic integrated circuit type	AND GATE	-	AND GATE	AND GATE	AND GATE
MaximumI(ol)	0.004 A	-	0.004 A	0.004 A	-
Humidity sensitivity level	1	-	1	1	-
Number of functions	2	-	2	2	2
Number of entries	4	-	4	4	4
Number of terminals	14	-	14	14	14
Maximum operating temperature	125 °C	-	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	-	SSOP	TSSOP	DIP
Encapsulate equivalent code	SOP14,.25	-	SSOP14,.3	TSSOP14,.25	-
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	-	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	IN-LINE
Peak Reflow Temperature (Celsius)	260	-	260	260	NOT SPECIFIED
power supply	2/6 V	-	2/6 V	2/6 V	-
Prop。Delay @ Nom-Su	28 ns	-	33 ns	33 ns	-
propagation delay (tpd)	165 ns	-	165 ns	165 ns	165 ns
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	-	NO	NO	-
Maximum seat height	1.75 mm	-	2 mm	1.1 mm	4.2 mm
Maximum supply voltage (Vsup)	6 V	-	6 V	6 V	6 V
Minimum supply voltage (Vsup)	2 V	-	2 V	2 V	2 V
Nominal supply voltage (Vsup)	5 V	-	5 V	5 V	5 V
surface mount	YES	-	YES	YES	NO
technology	CMOS	-	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	-	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	NICKEL PALLADIUM GOLD	-	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING	-	GULL WING	GULL WING	THROUGH-HOLE
Terminal pitch	1.27 mm	-	0.65 mm	0.65 mm	2.54 mm
Terminal location	DUAL	-	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	-	30	30	NOT SPECIFIED
width	3.9 mm	-	5.3 mm	4.4 mm	7.62 mm

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