EEWORLDEEWORLDEEWORLD

Part Number

Search

74LVC2G08GM

Description
Dual 2-input AND gate
Categorylogic    logic   
File Size81KB,16 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric Compare View All

74LVC2G08GM Overview

Dual 2-input AND gate

74LVC2G08GM Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeQFN
package instructionVBCC, LCC8,.06SQ,20
Contacts8
Reach Compliance Codecompli
seriesLVC/LCX/Z
JESD-30 codeS-PBCC-B8
JESD-609 codee4
length1.6 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeAND GATE
MaximumI(ol)0.024 A
Humidity sensitivity level1
Number of functions2
Number of entries2
Number of terminals8
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeVBCC
Encapsulate equivalent codeLCC8,.06SQ,20
Package shapeSQUARE
Package formCHIP CARRIER, VERY THIN PROFILE
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Prop。Delay @ Nom-Su5.9 ns
propagation delay (tpd)11.3 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height0.5 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1.65 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formBUTT
Terminal pitch0.5 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width1.6 mm
74LVC2G08
Dual 2-input AND gate
Rev. 08 — 9 June 2008
Product data sheet
1. General description
The 74LVC2G08 provides a 2-input AND gate function.
Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of the
74LVC2G08 as a translator in a mixed 3.3 V and 5 V environment.
This device is fully specified for partial power-down applications using I
OFF
. The I
OFF
circuitry disables the output, preventing a damaging backflow current through the device
when it is powered down.
2. Features
I
I
I
I
I
I
Wide supply voltage range from 1.65 V to 5.5 V
5 V tolerant outputs for interfacing with 5 V logic
High noise immunity
±24
mA output drive (V
CC
= 3.0 V)
CMOS low power consumption
Complies with JEDEC standard:
N
JESD8-7 (1.65 V to 1.95 V)
N
JESD8-5 (2.3 V to 2.7 V)
N
JESD8-B/JESD36 (2.7 V to 3.6 V)
Latch-up performance exceeds 250 mA
Direct interface with TTL levels
Inputs accept voltages up to 5 V
ESD protection:
N
HBM JESD22-A114E exceeds 2000 V
N
MM JESD22-A115-A exceeds 200 V
Multiple package options
Specified from
−40 °C
to +85
°C
and
−40 °C
to +125
°C
I
I
I
I
I
I

74LVC2G08GM Related Products

74LVC2G08GM 74LVC2G08DC 74LVC2G08GD 74LVC2G08GT
Description Dual 2-input AND gate Dual 2-input AND gate Dual 2-input AND gate Dual 2-input AND gate
Is it Rohs certified? conform to conform to conform to conform to
Maker NXP NXP NXP NXP
Parts packaging code QFN TSSOP SON SON
package instruction VBCC, LCC8,.06SQ,20 2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8 VSON, SOLCC8,.11,20 1 X 1.95 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT833-1, SON-8
Contacts 8 8 8 8
Reach Compliance Code compli compli compli compli
series LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z
JESD-30 code S-PBCC-B8 R-PDSO-G8 R-PDSO-N8 R-PDSO-N8
JESD-609 code e4 e4 e4 e3
length 1.6 mm 2.3 mm 3 mm 1.95 mm
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type AND GATE AND GATE AND GATE AND GATE
MaximumI(ol) 0.024 A 0.024 A 0.024 A 0.024 A
Humidity sensitivity level 1 1 1 1
Number of functions 2 2 2 2
Number of entries 2 2 2 2
Number of terminals 8 8 8 8
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code VBCC VSSOP VSON VSON
Encapsulate equivalent code LCC8,.06SQ,20 TSSOP8,.12,20 SOLCC8,.11,20 SOLCC8,.04,20
Package shape SQUARE RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE
method of packing TAPE AND REEL TAPE AND REEL TAPE AND REEL TAPE AND REEL
Peak Reflow Temperature (Celsius) 260 260 260 260
power supply 3.3 V 3.3 V 3.3 V 3.3 V
Prop。Delay @ Nom-Su 5.9 ns 5.9 ns 5.9 ns 5.9 ns
propagation delay (tpd) 11.3 ns 11.3 ns 11.3 ns 11.3 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO NO
Maximum seat height 0.5 mm 1 mm 0.5 mm 0.5 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 1.65 V 1.65 V 1.65 V 1.65 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Tin (Sn)
Terminal form BUTT GULL WING NO LEAD NO LEAD
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location BOTTOM DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 30 30 30
width 1.6 mm 2 mm 2 mm 1 mm

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2616  271  2755  2357  1813  53  6  56  48  37 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号