74LVC2G66GM datasheet, PDF - EEWORLD Datasheet

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74LVC2G66GM: DescriptionBilateral switch; CategoryAnalog mixed-signal IC The signal circuit; File Size119KB，24 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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74LVC2G66GM Overview

Bilateral switch

74LVC2G66GM Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	QFN
package instruction	1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT-902-1, XQFN-8
Contacts	8
Reach Compliance Code	compliant
Analog Integrated Circuits - Other Types	SPST
JESD-30 code	S-PQCC-N8
JESD-609 code	e4
length	1.6 mm
Humidity sensitivity level	1
Number of channels	1
Number of functions	2
Number of terminals	8
Nominal off-state isolation	46 dB
Maximum on-state resistance (Ron)	38 Ω
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	VQCCN
Encapsulate equivalent code	LCC8,.06SQ,20
Package shape	SQUARE
Package form	CHIP CARRIER, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	0.5 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.65 V
Nominal supply voltage (Vsup)	2.7 V
surface mount	YES
Maximum disconnect time	11.5 ns
Maximum connection time	13 ns
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	NICKEL PALLADIUM GOLD
Terminal form	NO LEAD
Terminal pitch	0.55 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	1.6 mm
Base Number Matches	1

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74LVC2G66

Bilateral switch

Rev. 04 — 1 July 2008

Product data sheet

1. General description

The 74LVC2G66 is a low-power, low-voltage, high-speed Si-gate CMOS device.

The 74LVC2G66 provides two single pole, single-throw analog switch functions. Each

switch has two input/output terminals (nY and nZ) and an active HIGH enable input (nE).

When nE is LOW, the analog switch is turned off.

Schmitt-trigger action at the enable inputs makes the circuit tolerant of slower input rise

and fall times across the entire V

range from 1.65 V to 5.5 V.

2. Features

Wide supply voltage range from 1.65 V to 5.5 V

Very low ON resistance:

7.5

Ω

(typical) at V

= 2.7 V

6.5

Ω

(typical) at V

= 3.3 V

Ω

(typical) at V

= 5 V

Switch current capability of 32 mA

High noise immunity

CMOS low power consumption

TTL interface compatibility at 3.3 V

Latch-up performance meets requirements of JESD78 Class I

ESD protection:

HBM JESD22-A114E exceeds 2000 V

MM JESD22-A115-A exceeds 200 V

Enable input accepts voltages up to 5.5 V

Multiple package options

Speciﬁed from

−40 °C

to +85

°C

and

−40 °C

to +125

°C

74LVC2G66GM Related Products

	74LVC2G66GM	74LVC2G66DC	74LVC2G66GD	74LVC2G66GT	74LVC2G66	74LVC2G66DP	74LVC2G66_08
Description	Bilateral switch	Bilateral switch	Bilateral switch	Bilateral switch	Bilateral switch	Bilateral switch	Bilateral switch
Is it Rohs certified?	conform to	conform to	conform to	conform to	-	conform to	-
Maker	NXP	NXP	NXP	NXP	-	NXP	-
Parts packaging code	QFN	TSSOP	SON	SON	-	SOIC	-
package instruction	1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT-902-1, XQFN-8	VSSOP, TSSOP8,.12,20	VSON, SOLCC8,.11,20	1 X 1.95 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-833-1, XSON-8	-	TSSOP, TSSOP8,.12,20	-
Contacts	8	8	8	8	-	8	-
Reach Compliance Code	compliant	compliant	compliant	compliant	-	compliant	-
Analog Integrated Circuits - Other Types	SPST	SPST	SPST	SPST	-	SPST	-
JESD-30 code	S-PQCC-N8	R-PDSO-G8	R-PDSO-N8	R-PDSO-N8	-	S-PDSO-G8	-
JESD-609 code	e4	e4	e4	e3	-	e4	-
length	1.6 mm	2.3 mm	3 mm	1.95 mm	-	3 mm	-
Humidity sensitivity level	1	1	1	1	-	1	-
Number of channels	1	1	1	1	-	1	-
Number of functions	2	2	2	2	-	2	-
Number of terminals	8	8	8	8	-	8	-
Nominal off-state isolation	46 dB	46 dB	46 dB	46 dB	-	46 dB	-
Maximum on-state resistance (Ron)	38 Ω	38 Ω	38 Ω	38 Ω	-	38 Ω	-
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	-	125 °C	-
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-	-40 °C	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	-
encapsulated code	VQCCN	VSSOP	VSON	VSON	-	TSSOP	-
Encapsulate equivalent code	LCC8,.06SQ,20	TSSOP8,.12,20	SOLCC8,.11,20	SOLCC8,.04,20	-	TSSOP8,.12,20	-
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	SQUARE	-
Package form	CHIP CARRIER, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE	-	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-
Peak Reflow Temperature (Celsius)	260	260	260	260	-	260	-
power supply	3.3 V	3.3 V	3.3 V	3.3 V	-	3.3 V	-
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	-
Maximum seat height	0.5 mm	1 mm	0.5 mm	0.5 mm	-	1.1 mm	-
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	-	5.5 V	-
Minimum supply voltage (Vsup)	1.65 V	1.65 V	1.65 V	1.65 V	-	1.65 V	-
Nominal supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	-	2.7 V	-
surface mount	YES	YES	YES	YES	-	YES	-
Maximum disconnect time	11.5 ns	11.5 ns	11.5 ns	11.5 ns	-	11.5 ns	-
Maximum connection time	13 ns	13 ns	13 ns	13 ns	-	13 ns	-
technology	CMOS	CMOS	CMOS	CMOS	-	CMOS	-
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	-	AUTOMOTIVE	-
Terminal surface	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)	Tin (Sn)	-	NICKEL PALLADIUM GOLD	-
Terminal form	NO LEAD	GULL WING	NO LEAD	NO LEAD	-	GULL WING	-
Terminal pitch	0.55 mm	0.5 mm	0.5 mm	0.5 mm	-	0.65 mm	-
Terminal location	QUAD	DUAL	DUAL	DUAL	-	DUAL	-
Maximum time at peak reflow temperature	30	30	30	30	-	30	-
width	1.6 mm	2 mm	2 mm	1 mm	-	3 mm	-
Base Number Matches	1	1	1	1	-	1	-

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