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74LVC2G66DP

Description
Bilateral switch
CategoryAnalog mixed-signal IC    The signal circuit   
File Size119KB,24 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric Compare View All

74LVC2G66DP Overview

Bilateral switch

74LVC2G66DP Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSOIC
package instructionTSSOP, TSSOP8,.12,20
Contacts8
Reach Compliance Codecompliant
Analog Integrated Circuits - Other TypesSPST
JESD-30 codeS-PDSO-G8
JESD-609 codee4
length3 mm
Humidity sensitivity level1
normal positionNO
Number of channels1
Number of functions2
Number of terminals8
Nominal off-state isolation46 dB
Maximum on-state resistance (Ron)38 Ω
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP8,.12,20
Package shapeSQUARE
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Certification statusNot Qualified
Maximum seat height1.1 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1.65 V
Nominal supply voltage (Vsup)2.7 V
surface mountYES
Maximum disconnect time11.5 ns
Maximum connection time13 ns
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width3 mm
Base Number Matches1
74LVC2G66
Bilateral switch
Rev. 04 — 1 July 2008
Product data sheet
1. General description
The 74LVC2G66 is a low-power, low-voltage, high-speed Si-gate CMOS device.
The 74LVC2G66 provides two single pole, single-throw analog switch functions. Each
switch has two input/output terminals (nY and nZ) and an active HIGH enable input (nE).
When nE is LOW, the analog switch is turned off.
Schmitt-trigger action at the enable inputs makes the circuit tolerant of slower input rise
and fall times across the entire V
CC
range from 1.65 V to 5.5 V.
2. Features
I
Wide supply voltage range from 1.65 V to 5.5 V
I
Very low ON resistance:
N
7.5
(typical) at V
CC
= 2.7 V
N
6.5
(typical) at V
CC
= 3.3 V
N
6
(typical) at V
CC
= 5 V
I
Switch current capability of 32 mA
I
High noise immunity
I
CMOS low power consumption
I
TTL interface compatibility at 3.3 V
I
Latch-up performance meets requirements of JESD78 Class I
I
ESD protection:
N
HBM JESD22-A114E exceeds 2000 V
N
MM JESD22-A115-A exceeds 200 V
I
Enable input accepts voltages up to 5.5 V
I
Multiple package options
I
Specified from
−40 °C
to +85
°C
and
−40 °C
to +125
°C

74LVC2G66DP Related Products

74LVC2G66DP 74LVC2G66DC 74LVC2G66GD 74LVC2G66GT 74LVC2G66 74LVC2G66GM 74LVC2G66_08
Description Bilateral switch Bilateral switch Bilateral switch Bilateral switch Bilateral switch Bilateral switch Bilateral switch
Is it Rohs certified? conform to conform to conform to conform to - conform to -
Maker NXP NXP NXP NXP - NXP -
Parts packaging code SOIC TSSOP SON SON - QFN -
package instruction TSSOP, TSSOP8,.12,20 VSSOP, TSSOP8,.12,20 VSON, SOLCC8,.11,20 1 X 1.95 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-833-1, XSON-8 - 1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT-902-1, XQFN-8 -
Contacts 8 8 8 8 - 8 -
Reach Compliance Code compliant compliant compliant compliant - compliant -
Analog Integrated Circuits - Other Types SPST SPST SPST SPST - SPST -
JESD-30 code S-PDSO-G8 R-PDSO-G8 R-PDSO-N8 R-PDSO-N8 - S-PQCC-N8 -
JESD-609 code e4 e4 e4 e3 - e4 -
length 3 mm 2.3 mm 3 mm 1.95 mm - 1.6 mm -
Humidity sensitivity level 1 1 1 1 - 1 -
Number of channels 1 1 1 1 - 1 -
Number of functions 2 2 2 2 - 2 -
Number of terminals 8 8 8 8 - 8 -
Nominal off-state isolation 46 dB 46 dB 46 dB 46 dB - 46 dB -
Maximum on-state resistance (Ron) 38 Ω 38 Ω 38 Ω 38 Ω - 38 Ω -
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C - 125 °C -
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C - -40 °C -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY -
encapsulated code TSSOP VSSOP VSON VSON - VQCCN -
Encapsulate equivalent code TSSOP8,.12,20 TSSOP8,.12,20 SOLCC8,.11,20 SOLCC8,.04,20 - LCC8,.06SQ,20 -
Package shape SQUARE RECTANGULAR RECTANGULAR RECTANGULAR - SQUARE -
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE - CHIP CARRIER, VERY THIN PROFILE -
Peak Reflow Temperature (Celsius) 260 260 260 260 - 260 -
power supply 3.3 V 3.3 V 3.3 V 3.3 V - 3.3 V -
Certification status Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified -
Maximum seat height 1.1 mm 1 mm 0.5 mm 0.5 mm - 0.5 mm -
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V - 5.5 V -
Minimum supply voltage (Vsup) 1.65 V 1.65 V 1.65 V 1.65 V - 1.65 V -
Nominal supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V - 2.7 V -
surface mount YES YES YES YES - YES -
Maximum disconnect time 11.5 ns 11.5 ns 11.5 ns 11.5 ns - 11.5 ns -
Maximum connection time 13 ns 13 ns 13 ns 13 ns - 13 ns -
technology CMOS CMOS CMOS CMOS - CMOS -
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE - AUTOMOTIVE -
Terminal surface NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au) Tin (Sn) - NICKEL PALLADIUM GOLD -
Terminal form GULL WING GULL WING NO LEAD NO LEAD - NO LEAD -
Terminal pitch 0.65 mm 0.5 mm 0.5 mm 0.5 mm - 0.55 mm -
Terminal location DUAL DUAL DUAL DUAL - QUAD -
Maximum time at peak reflow temperature 30 30 30 30 - 30 -
width 3 mm 2 mm 2 mm 1 mm - 1.6 mm -
Base Number Matches 1 1 1 1 - 1 -
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