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27CP128Q250/883

Description
IC,EPROM,16KX8,CMOS,DIP,28PIN,CERAMIC
Categorystorage    storage   
File Size742KB,10 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric Compare

27CP128Q250/883 Overview

IC,EPROM,16KX8,CMOS,DIP,28PIN,CERAMIC

27CP128Q250/883 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionDIP, DIP28,.6
Reach Compliance Codeunknow
Maximum access time250 ns
I/O typeCOMMON
JESD-30 codeR-XDIP-T28
JESD-609 codee0
memory density131072 bi
Memory IC TypeUVPROM
memory width8
Number of terminals28
word count16384 words
character code16000
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize16KX8
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP28,.6
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Programming voltage13 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

27CP128Q250/883 Related Products

27CP128Q250/883 27CP128E300/883 27CP128Q300/883 27CP128E250/883 27CP128E350/883 27CP128Q350/883
Description IC,EPROM,16KX8,CMOS,DIP,28PIN,CERAMIC IC,EPROM,16KX8,CMOS,LLCC,32PIN,CERAMIC IC,EPROM,16KX8,CMOS,DIP,28PIN,CERAMIC IC,EPROM,16KX8,CMOS,LLCC,32PIN,CERAMIC IC,EPROM,16KX8,CMOS,LLCC,32PIN,CERAMIC IC,EPROM,16KX8,CMOS,DIP,28PIN,CERAMIC
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP28,.6 QCCN, LCC32,.45X.55 DIP, DIP28,.6 QCCN, LCC32,.45X.55 QCCN, LCC32,.45X.55 DIP, DIP28,.6
Reach Compliance Code unknow unknow unknow unknow unknow unknow
Maximum access time 250 ns 300 ns 300 ns 250 ns 350 ns 350 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-XDIP-T28 R-XQCC-N32 R-XDIP-T28 R-XQCC-N32 R-XQCC-N32 R-XDIP-T28
JESD-609 code e0 e0 e0 e0 e0 e0
memory density 131072 bi 131072 bi 131072 bi 131072 bi 131072 bi 131072 bi
Memory IC Type UVPROM UVPROM UVPROM UVPROM UVPROM UVPROM
memory width 8 8 8 8 8 8
Number of terminals 28 32 28 32 32 28
word count 16384 words 16384 words 16384 words 16384 words 16384 words 16384 words
character code 16000 16000 16000 16000 16000 16000
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
organize 16KX8 16KX8 16KX8 16KX8 16KX8 16KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DIP QCCN DIP QCCN QCCN DIP
Encapsulate equivalent code DIP28,.6 LCC32,.45X.55 DIP28,.6 LCC32,.45X.55 LCC32,.45X.55 DIP28,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE CHIP CARRIER IN-LINE CHIP CARRIER CHIP CARRIER IN-LINE
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Programming voltage 13 V 13 V 13 V 13 V 13 V 13 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Filter level 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO YES NO YES YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE NO LEAD THROUGH-HOLE NO LEAD NO LEAD THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm
Terminal location DUAL QUAD DUAL QUAD QUAD DUAL
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