27CP128E250/883 datasheet, PDF

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27CP128E250/883: DescriptionIC,EPROM,16KX8,CMOS,LLCC,32PIN,CERAMIC; Categorystorage storage; File Size742KB，10 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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27CP128E250/883 Overview

IC,EPROM,16KX8,CMOS,LLCC,32PIN,CERAMIC

27CP128E250/883 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	QCCN, LCC32,.45X.55
Reach Compliance Code	unknow
Maximum access time	250 ns
I/O type	COMMON
JESD-30 code	R-XQCC-N32
JESD-609 code	e0
memory density	131072 bi
Memory IC Type	UVPROM
memory width	8
Number of terminals	32
word count	16384 words
character code	16000
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	16KX8
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	QCCN
Encapsulate equivalent code	LCC32,.45X.55
Package shape	RECTANGULAR
Package form	CHIP CARRIER
power supply	5 V
Programming voltage	13 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD

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Description	IC,EPROM,16KX8,CMOS,LLCC,32PIN,CERAMIC	IC,EPROM,16KX8,CMOS,LLCC,32PIN,CERAMIC	IC,EPROM,16KX8,CMOS,DIP,28PIN,CERAMIC	IC,EPROM,16KX8,CMOS,DIP,28PIN,CERAMIC	IC,EPROM,16KX8,CMOS,LLCC,32PIN,CERAMIC	IC,EPROM,16KX8,CMOS,DIP,28PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	QCCN, LCC32,.45X.55	QCCN, LCC32,.45X.55	DIP, DIP28,.6	DIP, DIP28,.6	QCCN, LCC32,.45X.55	DIP, DIP28,.6
Reach Compliance Code	unknow	unknow	unknow	unknow	unknow	unknow
Maximum access time	250 ns	300 ns	250 ns	300 ns	350 ns	350 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XQCC-N32	R-XQCC-N32	R-XDIP-T28	R-XDIP-T28	R-XQCC-N32	R-XDIP-T28
JESD-609 code	e0	e0	e0	e0	e0	e0
memory density	131072 bi	131072 bi	131072 bi	131072 bi	131072 bi	131072 bi
Memory IC Type	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM
memory width	8	8	8	8	8	8
Number of terminals	32	32	28	28	32	28
word count	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words
character code	16000	16000	16000	16000	16000	16000
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	16KX8	16KX8	16KX8	16KX8	16KX8	16KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	QCCN	QCCN	DIP	DIP	QCCN	DIP
Encapsulate equivalent code	LCC32,.45X.55	LCC32,.45X.55	DIP28,.6	DIP28,.6	LCC32,.45X.55	DIP28,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Programming voltage	13 V	13 V	13 V	13 V	13 V	13 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	NO	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	QUAD	QUAD	DUAL	DUAL	QUAD	DUAL

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