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27CP128E350/883

Description
IC,EPROM,16KX8,CMOS,LLCC,32PIN,CERAMIC
Categorystorage    storage   
File Size742KB,10 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric Compare

27CP128E350/883 Overview

IC,EPROM,16KX8,CMOS,LLCC,32PIN,CERAMIC

27CP128E350/883 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTexas Instruments
package instructionQCCN, LCC32,.45X.55
Reach Compliance Codeunknow
Maximum access time350 ns
I/O typeCOMMON
JESD-30 codeR-XQCC-N32
JESD-609 codee0
memory density131072 bi
Memory IC TypeUVPROM
memory width8
Number of terminals32
word count16384 words
character code16000
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize16KX8
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codeQCCN
Encapsulate equivalent codeLCC32,.45X.55
Package shapeRECTANGULAR
Package formCHIP CARRIER
power supply5 V
Programming voltage13 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD

27CP128E350/883 Related Products

27CP128E350/883 27CP128E300/883 27CP128Q250/883 27CP128Q300/883 27CP128E250/883 27CP128Q350/883
Description IC,EPROM,16KX8,CMOS,LLCC,32PIN,CERAMIC IC,EPROM,16KX8,CMOS,LLCC,32PIN,CERAMIC IC,EPROM,16KX8,CMOS,DIP,28PIN,CERAMIC IC,EPROM,16KX8,CMOS,DIP,28PIN,CERAMIC IC,EPROM,16KX8,CMOS,LLCC,32PIN,CERAMIC IC,EPROM,16KX8,CMOS,DIP,28PIN,CERAMIC
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
package instruction QCCN, LCC32,.45X.55 QCCN, LCC32,.45X.55 DIP, DIP28,.6 DIP, DIP28,.6 QCCN, LCC32,.45X.55 DIP, DIP28,.6
Reach Compliance Code unknow unknow unknow unknow unknow unknow
Maximum access time 350 ns 300 ns 250 ns 300 ns 250 ns 350 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-XQCC-N32 R-XQCC-N32 R-XDIP-T28 R-XDIP-T28 R-XQCC-N32 R-XDIP-T28
JESD-609 code e0 e0 e0 e0 e0 e0
memory density 131072 bi 131072 bi 131072 bi 131072 bi 131072 bi 131072 bi
Memory IC Type UVPROM UVPROM UVPROM UVPROM UVPROM UVPROM
memory width 8 8 8 8 8 8
Number of terminals 32 32 28 28 32 28
word count 16384 words 16384 words 16384 words 16384 words 16384 words 16384 words
character code 16000 16000 16000 16000 16000 16000
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
organize 16KX8 16KX8 16KX8 16KX8 16KX8 16KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code QCCN QCCN DIP DIP QCCN DIP
Encapsulate equivalent code LCC32,.45X.55 LCC32,.45X.55 DIP28,.6 DIP28,.6 LCC32,.45X.55 DIP28,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER CHIP CARRIER IN-LINE IN-LINE CHIP CARRIER IN-LINE
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Programming voltage 13 V 13 V 13 V 13 V 13 V 13 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Filter level 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES NO NO YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form NO LEAD NO LEAD THROUGH-HOLE THROUGH-HOLE NO LEAD THROUGH-HOLE
Terminal pitch 1.27 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location QUAD QUAD DUAL DUAL QUAD DUAL
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