OTP ROM, 64KX8, 250ns, CMOS, PQCC32, LCC-32
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| package instruction | QCCJ, LDCC32,.5X.6 |
| Reach Compliance Code | compli |
| Maximum access time | 250 ns |
| I/O type | COMMON |
| JESD-30 code | R-PQCC-J32 |
| JESD-609 code | e0 |
| memory density | 524288 bi |
| memory width | 8 |
| Humidity sensitivity level | 2 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 65536 words |
| character code | 64000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 64KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC32,.5X.6 |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.0001 A |
| Maximum slew rate | 0.04 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 30 |
| Base Number Matches | 1 |
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