KIS279-33GT datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > The connector> socket> KIS279-33GT

KIS279-33GT: DescriptionIC Socket, PGA279, 279 Contact(s),; CategoryThe connector socket; File Size175KB，2 Pages; ManufacturerAdvanced Interconnections Corp.

Download Datasheet Parametric View All

KIS279-33GT Overview

IC Socket, PGA279, 279 Contact(s),

KIS279-33GT Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Reach Compliance Code	compli
ECCN code	EAR99
Contact to complete cooperation	TIN LEAD OVER NICKEL
Contact completed and terminated	Gold (Au) - with Nickel (Ni) barrie
Contact material	BERYLLIUM COPPER
Device slot type	IC SOCKET
Type of equipment used	PGA279
Shell material	POLYAMIDE
JESD-609 code	e4
Number of contacts	279
Base Number Matches	1

Preview

Download Datasheet

View All

Low Insertion Force

Peel-A-Way

PGA Sockets

5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com

Peel-A-Way

Low Insertion Force PGA Sockets

Polyimide Film

.005

(.13)

Features:

• Disposable carriers peel away after

soldering.

• Peel-A-Way

tabs and full grid wafer

supplied on all Peel-A-Way

PGA sockets.

• Maximum air flow under PGA for greater

cooling.

• Better flux rinse and cleaning.

• Allows inspection of solder joints on both

sides of PCB.

• Lowest profile with use of type -210

terminal.

• Peel-A-Way

disposable socket terminal

carrier available in any configuration shown

or custom designed to meet your

specifications.

Footprint Dash #

If Applicable*

How To Order

068

-85

Contact Plating

G - Gold

T - Tin-Lead

Terminal Plating

G - Gold

T - Tin-Lead

Terminal Type

See next page

for terminal types

Body Type

KS - 2.5 oz.(70.85 g) avg. insertion force

KIS - 1 oz.(28.34 g) avg. insertion force

Number of Pins

004 to 484

*See pages 37 - 64

for PGA footprints

Polyimide Film

Terminals and Contacts:

Terminal: Brass - Copper Alloy (C36000)

ASTM-B-16

Contact: Beryllium Copper (C17200)

ASTM-B-194

Peel away

after soldering

to PCB.

PCB

Solder fillets visible both sides

for inspection and cleaning.

Solder Preform:

63% Tin, 37% Lead

How To Use:

1. Place socket in PCB.

2. Send PCB and socket through soldering operation.

3. Peel away polyimide film carrier.

Plating:

Terminal: Gold over Nickel or

Tin-Lead over Nickel

Contact: Gold over Nickel or

Tin-Lead over Nickel

Gold per MIL-G-45204

Tin-Lead per MIL-P-81728

Nickel per QQ-N-290

Sealant Options

RTV

Seal

Body Material:

KS/KIS -

Polyimide Film

-269˚C to 400˚C (-452˚F to 752˚F)

RTV Sealed

To order: Add RTV to end of part #

Note: RTV not available with HCS or HCIS Insulators

Peel-A-Way

covered by patent rights issued and/or pending.

Tape Sealed

To order: Add 3M to end of part #

inch/(mm)

Products shown covered by patents issued and/or pending. Specifications subject to change without notice.

Page 34

Recommended Resources

High and low temperature two-way thermometer circuit diagram

Small power switching power supply circuit

Kilowatt level full-bridge conversion switching power supply circuit

ATARI pulse width modulation regulated power supply circuit

Negative 2V-12V reference voltage source

3KHZ notch filter circuit diagram

Recruiting sales engineers and senior sales managers: [i=s]This post was last edited by orbitabaoce on 2014-7-4 11:46[/i] [b]Workplace: Beijing Resume receiving email: [url=mailto:orbitabj@163.com]orbitabj@163.com[/url] [/b] [b]Job description: Sales eng...; orbitabaoce Recruitment

Personal Tracker GPS Part Design Sharing: GPS module selection This design uses GPS modules from three platforms: SIRF, ublox, and MTK. Here is the overall situation of the test in August: 1. SIRF (7989 chip) Without any restrictions, after 3...; 小猪 Mobile and portable

How to simulate SAA1064 I2C with Proteus: There is no SAA1064 in proteus, how to simulate it?...; 彪悍小Y 51mcu

5 years of experience in MCU development, looking for sponsor: [align=left][color=rgb(68, 68, 68)][backcolor=transparent][font=Arail,&][size=12px]5 years of experience in MCU development[/size][/font][/backcolor][/color][/align][color=rgb(68, 68, 68)][backcolor=t...; tianye907 Talking about work

I need help with mmap and TCP length limitation. Thanks: I need help with the issue of limited mmap physical memory mapping length. Thanks. I wrote a simple physical memory migration program to transfer a certain length of content on a physical address from...; vlah Embedded System

I would like to ask about the problem of connecting 103VCT6 to NAND and SRAM: I'm using 103VCT6 in LQFP100 package to connect SRAM:Part of the code is as follows:// Initialization:// What is the difference between RCC_AHBPeriph_FSMC and RCC_AHBPeriph_SRAM in the following state...; hilltree stm32/stm8

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components