DUAL, PARALLEL, WORD INPUT LOADING, 0.8us SETTLING TIME, 12-BIT DAC, PDIP24, 0.300 INCH, PLASTIC, DIP-24
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Maker | Rochester Electronics |
| Parts packaging code | DIP |
| package instruction | 0.300 INCH, PLASTIC, DIP-24 |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| Converter type | D/A CONVERTER |
| Enter bit code | BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY |
| Input format | PARALLEL, WORD |
| JESD-30 code | R-PDIP-T24 |
| JESD-609 code | e0 |
| length | 30.545 mm |
| Maximum linear error (EL) | 0.0122% |
| Humidity sensitivity level | 1 |
| Number of digits | 12 |
| Number of functions | 2 |
| Number of terminals | 24 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | 245 |
| Certification status | COMMERCIAL |
| Maximum seat height | 4.572 mm |
| Nominal settling time (tstl) | 0.8 µs |
| Nominal supply voltage | 15 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | TIN LEAD |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |

| MX7537LN | MX7537JN | MX7537JEWG | MX7537KCWG | MX7537LEWG | MX7537LP | |
|---|---|---|---|---|---|---|
| Description | DUAL, PARALLEL, WORD INPUT LOADING, 0.8us SETTLING TIME, 12-BIT DAC, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | DUAL, PARALLEL, WORD INPUT LOADING, 0.8us SETTLING TIME, 12-BIT DAC, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | DUAL, PARALLEL, WORD INPUT LOADING, 0.8 us SETTLING TIME, 12-BIT DAC, PDSO24, 0.300 INCH, SOIC-24 | DUAL, PARALLEL, WORD INPUT LOADING, 0.8 us SETTLING TIME, 12-BIT DAC, PDSO24, 0.300 INCH, SOIC-24 | DUAL, PARALLEL, WORD INPUT LOADING, 0.8 us SETTLING TIME, 12-BIT DAC, PDSO24, 0.300 INCH, SOIC-24 | DUAL, PARALLEL, WORD INPUT LOADING, 0.8 us SETTLING TIME, 12-BIT DAC, PQCC28, 0.453 X 0.453 INCH, PLASTIC, LCC-28 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Maker | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| Parts packaging code | DIP | DIP | SOIC | SOIC | SOIC | QLCC |
| package instruction | 0.300 INCH, PLASTIC, DIP-24 | 0.300 INCH, PLASTIC, DIP-24 | SOP, | SOP, | SOP, | QCCJ, |
| Contacts | 24 | 24 | 24 | 24 | 24 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| Converter type | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| Enter bit code | BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY | BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY | BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY | BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY | BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY | BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY |
| Input format | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| JESD-30 code | R-PDIP-T24 | R-PDIP-T24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | S-PQCC-J28 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 30.545 mm | 30.545 mm | 15.4 mm | 15.4 mm | 15.4 mm | 11.505 mm |
| Maximum linear error (EL) | 0.0122% | 0.0244% | 0.0244% | 0.0122% | 0.0122% | 0.0122% |
| Humidity sensitivity level | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of digits | 12 | 12 | 12 | 12 | 12 | 12 |
| Number of functions | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 24 | 24 | 24 | 24 | 24 | 28 |
| Maximum operating temperature | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | SOP | SOP | SOP | QCCJ |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| Package form | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | 245 | 245 | 245 | 245 | 245 | 245 |
| Certification status | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Maximum seat height | 4.572 mm | 4.572 mm | 2.65 mm | 2.65 mm | 2.65 mm | 4.57 mm |
| Nominal settling time (tstl) | 0.8 µs | 0.8 µs | 0.8 µs | 0.8 µs | 0.8 µs | 0.8 µs |
| Nominal supply voltage | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| surface mount | NO | NO | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | J BEND |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.62 mm | 7.62 mm | 7.5 mm | 7.5 mm | 7.5 mm | 11.505 mm |
| Is it Rohs certified? | - | - | incompatible | incompatible | incompatible | incompatible |