P6SMBJ200CAP datasheet, PDF - EEWORLD Datasheet

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P6SMBJ200CAP: DescriptionDIODE 600 W, BIDIRECTIONAL, SILICON, TVS DIODE, DO-214AA, SMBJ, 2 PIN, Transient Suppressor; CategoryDiscrete semiconductor diode; File Size1MB，4 Pages; ManufacturerMicro Commercial Components (MCC); Environmental Compliance

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P6SMBJ200CAP Overview

DIODE 600 W, BIDIRECTIONAL, SILICON, TVS DIODE, DO-214AA, SMBJ, 2 PIN, Transient Suppressor

P6SMBJ200CAP Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Micro Commercial Components (MCC)
Parts packaging code	DO-214AA
package instruction	SMBJ, 2 PIN
Contacts	2
Reach Compliance Code	unknown

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MCC

Features

omponents

20736 Marilla Street Chatsworth

!"#

$ % !"#

P6SMBJ6.8(C)A

THRU

P6SMBJ550(C)A

Transient

Voltage Suppressor

6.8 to 550 Volts

600 Watt

DO-214AA

(SMBJ) (LEAD FRAME)

For surface mount applicationsin in or der to optimize

boar d space

L ow pr ofil e package

Fast response time: typical less than 1.0ps from 0 volts to

minimum

Low inductance

Excellent clamping capability

Mechanical Data

CASE: JEDEC DO-214AA

Terminals: solderable per MIL-STD-750, Method 2026

Polarity: Color band denotes posit ive end (cathode)

except Bidirectional

Maximum soldering temperature: 250 C for 10 seconds

Maximum Ratings @ 25

C Unless Otherwise Specified

Peak Pulse Current on

See Table 1 Note: 1

10/1000us waveform

Peak Pulse Power

600W

Note: 1,

Dissipation

Peak Forward Surge

FSM)

100A

Note: 3

Current

Operation And Storage T

, T

STG

Temperature Range

-55

C to

+150

DIM

DIMENSIONS

INCHES

MIN

.160

.130

.006

.030

.200

.079

.075

.002

MIN

4.06

3.30

0.15

0.76

5.08

2.00

1.91

0.05

MAX

.185

.155

.012

.060

.220

.096

.087

.008

MAX

4.70

3.94

0.31

..52

5.59

2.44

2.21

0.203

NOTE

NOTES:

Non-repetitive current pulse, per Fig.3 and derated above

=25 C per Fig.2.

Mounted on 5.0mm copper pads to each terminal.

8.3ms, single half sine wave duty cycle=4 pulses per. Minute

maximum.

SUGGESTED SOLDER

PAD LAYOUT

0.106"

0.082”

0.050”

www.mccsemi.com

Revision: 2

2004/08/20

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