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MMXZ5246B-TP-HF

Description
Zener Diode, 16V V(Z), 5%, 0.2W,
CategoryDiscrete semiconductor    diode   
File Size307KB,5 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance
Download Datasheet Parametric View All

MMXZ5246B-TP-HF Overview

Zener Diode, 16V V(Z), 5%, 0.2W,

MMXZ5246B-TP-HF Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
Reach Compliance Codecompliant
ECCN codeEAR99
ConfigurationSINGLE
Diode typeZENER DIODE
Maximum dynamic impedance17 Ω
Humidity sensitivity level1
Number of components1
Maximum operating temperature150 °C
Peak Reflow Temperature (Celsius)260
Maximum power dissipation0.2 W
Nominal reference voltage16 V
surface mountYES
Maximum time at peak reflow temperature10
Maximum voltage tolerance5%
Working test current7.8 mA
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

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$ %    !"#
MMXZ5223B
THRU
MMXZ5259B
200 mW
Zener Diodes
2.7 to 39 Volts
Features
Lead Free Finish/RoHS Compliant ("P" Suffix
designates RoHS Compliant. See ordering information)
Planar Die construction
Zener Voltages from 2.7V-39V and 200mW Power Dissipation
Halogen
free available upon request by adding suffix "-HF"
Ideally Suited for Automated Assembly Processes
Mechanical Data
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Approx. Weight: 0.008 gram
Mounting Position: Any
Storage & Operating Junction Temperature: -55 C to +150 C
o
o
SOD-323
A
B
C
E
Maximum Ratings @ 25
o
C Unless Otherwise Specified
10
mA
Forward Current
I
F
Maximum Forward
V
F
0.9
V
Voltage(Notes
1)
Power Dissipation
P
D
200
mWatt
(No te s
2)
o
Thermal Resistance,
R
thja
625
C/W
Junction to Ambient Air
NOTES:
1. Tested with pulses, Tp<1.0ms
2. Device mounted on ceramic PCBS; 7.6 mm x 9.4 mm x 0.87 mm
with pad areas 25 mm
2
.
H
D
G
J
DIM
A
B
C
D
E
G
H
J
DIMENSIONS
INCHES
MM
MIN
MAX
MIN
MAX
.090
.107
2.30
2.70
.063
.071
1.60
1.80
.045
.053
1.15
1.35
.031
.045
0.80
1.15
.010
.016
0.25
0.40
.004
.018
0.10
0.45
.004
.010
0.10
0.25
-----
.006
-----
0.15
SUGGESTED SOLDER
PAD LAYOUT
0.074"
NOTE
0.027”
0.022”
Revision:
C
www.mccsemi.com
1 of 5
2013/01/01
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