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Datasheet> All Categories > storage> storage> CYM4208HD-25C
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CYM4208HD-25C

Description
FIFO, 64KX9, 25ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, MODULE, DIP-28
Categorystorage    storage   
File Size256KB，9 Pages
ManufacturerCypress Semiconductor
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CYM4208HD-25C Overview

FIFO, 64KX9, 25ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, MODULE, DIP-28

CYM4208HD-25C Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerCypress Semiconductor
Parts packaging codeDIP
package instruction0.600 INCH, CERAMIC, MODULE, DIP-28
Contacts28
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time25 ns
Maximum clock frequency (fCLK)28.5 MHz
period time35 ns
JESD-30 codeR-CDIP-T28
JESD-609 codee0
length36.322 mm
memory density589824 bit
Memory IC TypeOTHER FIFO
memory width9
Number of functions1
Number of terminals28
word count65536 words
character code64000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64KX9
ExportableNO
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDIP
Encapsulate equivalent codeDIP28,.6
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height7.366 mm
Maximum standby current0.08 A
Maximum slew rate0.64 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width15.24 mm

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CYM4208HD-25C Related Products

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Description FIFO, 64KX9, 25ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, MODULE, DIP-28 FIFO, 64KX9, 40ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, MODULE, DIP-28 FIFO, 64KX9, 30ns, Asynchronous, CMOS FIFO, 128KX9, 25ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, MODULE, DIP-28 FIFO, 128KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, MODULE, DIP-28 FIFO, 128KX9, 40ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, MODULE, DIP-28 FIFO, 64KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, MODULE, DIP-28 FIFO, 64KX9, 40ns, Asynchronous, CMOS FIFO, 128KX9, 40ns, Asynchronous, CMOS FIFO, 128KX9, 30ns, Asynchronous, CMOS
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 25 ns 40 ns 30 ns 25 ns 30 ns 40 ns 30 ns 40 ns 40 ns 30 ns
period time 35 ns 50 ns 40 ns 35 ns 40 ns 50 ns 40 ns 50 ns 50 ns 40 ns
JESD-30 code R-CDIP-T28 R-CDIP-T28 R-XDMA-T28 R-CDIP-T28 R-CDIP-T28 R-CDIP-T28 R-CDIP-T28 R-XDMA-T28 R-XDMA-T28 R-XDMA-T28
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
memory density 589824 bit 589824 bit 589824 bit 1179648 bit 1179648 bit 1179648 bit 589824 bit 589824 bit 1179648 bit 1179648 bit
Memory IC Type OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO
memory width 9 9 9 9 9 9 9 9 9 9
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 28 28 28 28 28 28 28 28 28 28
word count 65536 words 65536 words 65536 words 131072 words 131072 words 131072 words 65536 words 65536 words 131072 words 131072 words
character code 64000 64000 64000 128000 128000 128000 64000 64000 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 125 °C 70 °C 70 °C 70 °C 70 °C 125 °C 125 °C 125 °C
organize 64KX9 64KX9 64KX9 128KX9 128KX9 128KX9 64KX9 64KX9 128KX9 128KX9
Exportable NO NO NO NO NO NO NO NO NO NO
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED UNSPECIFIED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP
Encapsulate equivalent code DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE MICROELECTRONIC ASSEMBLY IN-LINE IN-LINE IN-LINE IN-LINE MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum slew rate 0.64 mA 0.64 mA 0.72 mA 0.64 mA 0.64 mA 0.64 mA 0.64 mA 0.72 mA 0.72 mA 0.72 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL MILITARY COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Parts packaging code DIP DIP - DIP DIP DIP DIP - - -
package instruction 0.600 INCH, CERAMIC, MODULE, DIP-28 0.600 INCH, CERAMIC, MODULE, DIP-28 - 0.600 INCH, CERAMIC, MODULE, DIP-28 0.600 INCH, CERAMIC, MODULE, DIP-28 0.600 INCH, CERAMIC, MODULE, DIP-28 0.600 INCH, CERAMIC, MODULE, DIP-28 - - -
Contacts 28 28 - 28 28 28 28 - - -
length 36.322 mm 36.322 mm - 36.322 mm 36.322 mm 36.322 mm 36.322 mm - - -
Maximum seat height 7.366 mm 7.366 mm - 7.366 mm 7.366 mm 7.366 mm 7.366 mm - - -
width 15.24 mm 15.24 mm - 15.24 mm 15.24 mm 15.24 mm 15.24 mm - - -

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