CYM4208HD-40MB datasheet, PDF - EEWORLD Datasheet

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CYM4208HD-40MB: DescriptionFIFO, 64KX9, 40ns, Asynchronous, CMOS; Categorystorage storage; File Size256KB，9 Pages; ManufacturerCypress Semiconductor

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CYM4208HD-40MB Overview

FIFO, 64KX9, 40ns, Asynchronous, CMOS

CYM4208HD-40MB Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Cypress Semiconductor
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	40 ns
Maximum clock frequency (fCLK)	20 MHz
period time	50 ns
JESD-30 code	R-XDMA-T28
JESD-609 code	e0
memory density	589824 bit
Memory IC Type	OTHER FIFO
memory width	9
Number of functions	1
Number of terminals	28
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	64KX9
Exportable	NO
Package body material	UNSPECIFIED
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum standby current	0.1 A
Maximum slew rate	0.72 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

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	CYM4208HD-40MB	CYM4208HD-40C	CYM4208HD-30MB	CYM4208HD-25C	CYM4209HD-25C	CYM4209HD-30C	CYM4209HD-40C	CYM4208HD-30C	CYM4209HD-40MB	CYM4209HD-30MB
Description	FIFO, 64KX9, 40ns, Asynchronous, CMOS	FIFO, 64KX9, 40ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, MODULE, DIP-28	FIFO, 64KX9, 30ns, Asynchronous, CMOS	FIFO, 64KX9, 25ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, MODULE, DIP-28	FIFO, 128KX9, 25ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, MODULE, DIP-28	FIFO, 128KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, MODULE, DIP-28	FIFO, 128KX9, 40ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, MODULE, DIP-28	FIFO, 64KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, MODULE, DIP-28	FIFO, 128KX9, 40ns, Asynchronous, CMOS	FIFO, 128KX9, 30ns, Asynchronous, CMOS
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	40 ns	40 ns	30 ns	25 ns	25 ns	30 ns	40 ns	30 ns	40 ns	30 ns
period time	50 ns	50 ns	40 ns	35 ns	35 ns	40 ns	50 ns	40 ns	50 ns	40 ns
JESD-30 code	R-XDMA-T28	R-CDIP-T28	R-XDMA-T28	R-CDIP-T28	R-CDIP-T28	R-CDIP-T28	R-CDIP-T28	R-CDIP-T28	R-XDMA-T28	R-XDMA-T28
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
memory density	589824 bit	589824 bit	589824 bit	589824 bit	1179648 bit	1179648 bit	1179648 bit	589824 bit	1179648 bit	1179648 bit
Memory IC Type	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO
memory width	9	9	9	9	9	9	9	9	9	9
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of terminals	28	28	28	28	28	28	28	28	28	28
word count	65536 words	65536 words	65536 words	65536 words	131072 words	131072 words	131072 words	65536 words	131072 words	131072 words
character code	64000	64000	64000	64000	128000	128000	128000	64000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	70 °C	125 °C	70 °C	70 °C	70 °C	70 °C	70 °C	125 °C	125 °C
organize	64KX9	64KX9	64KX9	64KX9	128KX9	128KX9	128KX9	64KX9	128KX9	128KX9
Exportable	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
Package body material	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP28,.6	DIP28,.6	DIP28,.6	DIP28,.6	DIP28,.6	DIP28,.6	DIP28,.6	DIP28,.6	DIP28,.6	DIP28,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	IN-LINE	MICROELECTRONIC ASSEMBLY	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	0.72 mA	0.64 mA	0.72 mA	0.64 mA	0.64 mA	0.64 mA	0.64 mA	0.64 mA	0.72 mA	0.72 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Parts packaging code	-	DIP	-	DIP	DIP	DIP	DIP	DIP	-	-
package instruction	-	0.600 INCH, CERAMIC, MODULE, DIP-28	-	0.600 INCH, CERAMIC, MODULE, DIP-28	0.600 INCH, CERAMIC, MODULE, DIP-28	0.600 INCH, CERAMIC, MODULE, DIP-28	0.600 INCH, CERAMIC, MODULE, DIP-28	0.600 INCH, CERAMIC, MODULE, DIP-28	-	-
Contacts	-	28	-	28	28	28	28	28	-	-
length	-	36.322 mm	-	36.322 mm	36.322 mm	36.322 mm	36.322 mm	36.322 mm	-	-
Maximum seat height	-	7.366 mm	-	7.366 mm	7.366 mm	7.366 mm	7.366 mm	7.366 mm	-	-
width	-	15.24 mm	-	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	-	-

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