CYM4209HD-40C datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > storage> storage> CYM4209HD-40C

CYM4209HD-40C: DescriptionFIFO, 128KX9, 40ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, MODULE, DIP-28; Categorystorage storage; File Size256KB，9 Pages; ManufacturerCypress Semiconductor

Download Datasheet Parametric Compare View All

CYM4209HD-40C Overview

FIFO, 128KX9, 40ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, MODULE, DIP-28

CYM4209HD-40C Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Cypress Semiconductor
Parts packaging code	DIP
package instruction	0.600 INCH, CERAMIC, MODULE, DIP-28
Contacts	28
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	40 ns
period time	50 ns
JESD-30 code	R-CDIP-T28
JESD-609 code	e0
length	36.322 mm
memory density	1179648 bit
Memory IC Type	OTHER FIFO
memory width	9
Number of functions	1
Number of terminals	28
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX9
Exportable	NO
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	7.366 mm
Maximum slew rate	0.64 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm

Preview

Download Datasheet

View All

CYM4209HD-40C Related Products

	CYM4209HD-40C	CYM4208HD-40C	CYM4208HD-30MB	CYM4208HD-25C	CYM4209HD-25C	CYM4209HD-30C	CYM4208HD-30C	CYM4208HD-40MB	CYM4209HD-40MB	CYM4209HD-30MB
Description	FIFO, 128KX9, 40ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, MODULE, DIP-28	FIFO, 64KX9, 40ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, MODULE, DIP-28	FIFO, 64KX9, 30ns, Asynchronous, CMOS	FIFO, 64KX9, 25ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, MODULE, DIP-28	FIFO, 128KX9, 25ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, MODULE, DIP-28	FIFO, 128KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, MODULE, DIP-28	FIFO, 64KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, MODULE, DIP-28	FIFO, 64KX9, 40ns, Asynchronous, CMOS	FIFO, 128KX9, 40ns, Asynchronous, CMOS	FIFO, 128KX9, 30ns, Asynchronous, CMOS
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	40 ns	40 ns	30 ns	25 ns	25 ns	30 ns	30 ns	40 ns	40 ns	30 ns
period time	50 ns	50 ns	40 ns	35 ns	35 ns	40 ns	40 ns	50 ns	50 ns	40 ns
JESD-30 code	R-CDIP-T28	R-CDIP-T28	R-XDMA-T28	R-CDIP-T28	R-CDIP-T28	R-CDIP-T28	R-CDIP-T28	R-XDMA-T28	R-XDMA-T28	R-XDMA-T28
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
memory density	1179648 bit	589824 bit	589824 bit	589824 bit	1179648 bit	1179648 bit	589824 bit	589824 bit	1179648 bit	1179648 bit
Memory IC Type	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO
memory width	9	9	9	9	9	9	9	9	9	9
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of terminals	28	28	28	28	28	28	28	28	28	28
word count	131072 words	65536 words	65536 words	65536 words	131072 words	131072 words	65536 words	65536 words	131072 words	131072 words
character code	128000	64000	64000	64000	128000	128000	64000	64000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	125 °C	70 °C	70 °C	70 °C	70 °C	125 °C	125 °C	125 °C
organize	128KX9	64KX9	64KX9	64KX9	128KX9	128KX9	64KX9	64KX9	128KX9	128KX9
Exportable	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP28,.6	DIP28,.6	DIP28,.6	DIP28,.6	DIP28,.6	DIP28,.6	DIP28,.6	DIP28,.6	DIP28,.6	DIP28,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	MICROELECTRONIC ASSEMBLY	IN-LINE	IN-LINE	IN-LINE	IN-LINE	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	0.64 mA	0.64 mA	0.72 mA	0.64 mA	0.64 mA	0.64 mA	0.64 mA	0.72 mA	0.72 mA	0.72 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Parts packaging code	DIP	DIP	-	DIP	DIP	DIP	DIP	-	-	-
package instruction	0.600 INCH, CERAMIC, MODULE, DIP-28	0.600 INCH, CERAMIC, MODULE, DIP-28	-	0.600 INCH, CERAMIC, MODULE, DIP-28	0.600 INCH, CERAMIC, MODULE, DIP-28	0.600 INCH, CERAMIC, MODULE, DIP-28	0.600 INCH, CERAMIC, MODULE, DIP-28	-	-	-
Contacts	28	28	-	28	28	28	28	-	-	-
length	36.322 mm	36.322 mm	-	36.322 mm	36.322 mm	36.322 mm	36.322 mm	-	-	-
Maximum seat height	7.366 mm	7.366 mm	-	7.366 mm	7.366 mm	7.366 mm	7.366 mm	-	-	-
width	15.24 mm	15.24 mm	-	15.24 mm	15.24 mm	15.24 mm	15.24 mm	-	-	-

Recommended Resources

Application of motor drive circuit in automatic tracking car model

Low power pulse arc ignition circuit

Typical application circuit of TL1451

Phase control circuit using PUT thyristor

555 frequency and pulse width variable waveform generator circuit

Broadband transconductance amplifier circuit

Haha! IAR5.50 was installed successfully: Now successfully installed>... You can download the installation program by yourself... Website: IAR for MSP430 V5.50 [url=http://supp.iar.com/Register/Con]http://supp.iar.com/Register/Con[/url] ... C...; STM32shipeng Microcontroller MCU

Lithium battery 3.7V power management IC: [i=s] This post was last edited by Diandianshu on 2018-5-17 17:36 [/i] Looking for a 3.7V lithium battery IC with enable to control charge and discharge. 1. Current 1A 2. With EN enable pin, default d...; 点点舒 Power technology

Qt socket tcp communication_the most concise example: 1. It took most of the day to build the environment and implement the most basic socket communication. 2. One service and one client, currently based on mingw under window. Although qt is not as good ...; lyzhangxiang Embedded System

MSP430 Kit: [i=s]This post was last edited by yinyue01 on 2017-2-6 11:42[/i] [b][color=red]Both sets of boards are brand new, unopened and unused. Later, I stopped using MSP430, so I sold them at half the price. ...; yinyue01 Buy&Sell

F2H_SDRAM Issues: DE1-SoC board, the program uses avalon mm's Burst mode communication, and there are two modules that need to access DDR3, one for reading and one for writing. If both are connected to the f2h_axi_slav...; cncqzxj FPGA/CPLD

NXP MCU development environment installation prompts expiration: Can anyone tell me if there is a crack file for this software? Thanks!...; chenbingjy NXP MCU

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components