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NP352-115523.AC-22615

Description
Fine Ball Grid Array (FBGA, 1.00mm Pitch)
File Size554KB,8 Pages
ManufacturerYamaichi Electronics Co., Ltd.
Websitehttp://www.yamaichi.com/
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NP352-115523.AC-22615 Overview

Fine Ball Grid Array (FBGA, 1.00mm Pitch)

NP352 Series
(Open Top)
Fine Ball Grid Array
(FBGA, 1.00mm Pitch)
Specifications
1,000M
W
min. at 100V DC
Insulation Resistance:
Dielectric Withstanding Voltage: 100V AC for 1 minute
Contact Resistance:
100m
W
max. at 10mA/20mV max.
Operating Temperature Range: –40°C to +150°C / -55°C to +150°C
15g per pin approx.
Contact Force:
10,000 insertions minimun
Mating Cycles:
Part Number (Details)
NP352
-
560
Series No.
No. of Contact Pins
Design Number
09
-
*
-
*
Mark for Positioning Pins
Contact Terminal Lengths and Form
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled
Polyethersulphone (PES), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Features
í
Open top type sockets with "Tweezer Style Contacts"
For FBGA packages
í
Secure package alignment due to self contacting structure
without upper pressing force (ZIF)
í
Contacting structure to nip the sides of solder balls to lower
damages of coplanarity of solder balls
Outline Base Socket Dimensions
A
±0.4
Yamaichi's 2-point Tweezer Contact
B
±0.4
IC
Ball
Socket
Base A
Contacts
Socket
Base B
Since the solder balls are touched
by two contacts on each side,
the solder ball damage can be
minimized; additional features
are low actuation force and
compact socket size
D-36
Test & Burn-In
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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