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DSP56F801FA80

Description
0-BIT, 80 MHz, OTHER DSP, PQFP48
Categorysemiconductor    The embedded processor and controller   
File Size276KB,48 Pages
ManufacturerFREESCALE (NXP)
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DSP56F801FA80 Overview

0-BIT, 80 MHz, OTHER DSP, PQFP48

DSP56F801FA80 Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals48
Maximum operating temperature85 Cel
Minimum operating temperature-40 Cel
Maximum supply/operating voltage3.6 V
Minimum supply/operating voltage3 V
Rated supply voltage3.3 V
External data bus width0.0
Processing package descriptionLQFP-48
stateACTIVE
CraftsmanshipCMOS
packaging shapeSQUARE
Package SizeFLATPACK, LOW PROFILE, FINE PITCH
surface mountYes
Terminal formGULL WING
Terminal spacing0.5000 mm
Terminal locationQUAD
Packaging MaterialsPLASTIC/EPOXY
Temperature levelINDUSTRIAL
Address bus width0.0
barrel shifterYes
boundary scanYes
Maximum FCLK clock frequency80 MHz
Internal bus architectureMULTIPLE
low power modeYes
Microprocessor typeOTHER DSP
Number of data processing bits16
56F801
Data Sheet
Preliminary Technical Data
56F800
16-bit Digital Signal Controllers
DSP56F801
Rev. 17
09/2007
freescale.com

DSP56F801FA80 Related Products

DSP56F801FA80 56F801 56F801_1 56F801E DSP56F801 DSP56F801FA60
Description 0-BIT, 80 MHz, OTHER DSP, PQFP48 0-BIT, 60 MHz, OTHER DSP, PQFP48 0-BIT, 60 MHz, OTHER DSP, PQFP48 0-BIT, 60 MHz, OTHER DSP, PQFP48 0-BIT, 60 MHz, OTHER DSP, PQFP48 0-BIT, 60 MHz, OTHER DSP, PQFP48
Number of functions 1 1 1 1 1 1
Number of terminals 48 48 48 48 48 48
Maximum operating temperature 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel
Minimum operating temperature -40 Cel -40 Cel -40 Cel -40 Cel -40 Cel -40 Cel
Maximum supply/operating voltage 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply/operating voltage 3 V 3 V 3 V 3 V 3 V 3 V
Rated supply voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
External data bus width 0.0 0.0 0.0 0.0 0.0 0.0
Processing package description LQFP-48 PLASTIC, LQFP-48 PLASTIC, LQFP-48 PLASTIC, LQFP-48 PLASTIC, LQFP-48 PLASTIC, LQFP-48
state ACTIVE DISCONTINUED DISCONTINUED DISCONTINUED DISCONTINUED DISCONTINUED
Craftsmanship CMOS CMOS CMOS CMOS CMOS CMOS
packaging shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package Size FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
surface mount Yes Yes Yes Yes Yes Yes
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal spacing 0.5000 mm 0.5000 mm 0.5000 mm 0.5000 mm 0.5000 mm 0.5000 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD
Packaging Materials PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Address bus width 0.0 0.0 0.0 0.0 0.0 0.0
barrel shifter Yes Yes Yes Yes Yes Yes
boundary scan Yes Yes Yes Yes Yes Yes
Maximum FCLK clock frequency 80 MHz 60 MHz 60 MHz 60 MHz 60 MHz 60 MHz
Internal bus architecture MULTIPLE MULTIPLE MULTIPLE MULTIPLE MULTIPLE MULTIPLE
low power mode Yes Yes Yes Yes Yes Yes
Microprocessor type OTHER DSP OTHER DSP OTHER DSP OTHER DSP OTHER DSP OTHER DSP
Number of data processing bits 16 16 16 16 16 16
terminal coating - TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD

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