K4H510838G datasheet, PDF - EEWORLD Datasheet

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K4H510838G: Description512Mb G-die DDR SDRAM Specification; File Size22KB，1 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K4H510838G Overview

512Mb G-die DDR SDRAM Specification

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K4H510838G Related Products

	K4H510838G	K4H510438G-LC/LB0	K4H510438G	K4H510438G-LC/LB3	K4H510838G-LC/LCC	K4H510838G-LC/LB3	K4H511638G	K4H511638G-LC/LCC
Description	512Mb G-die DDR SDRAM Specification	512Mb G-die DDR SDRAM Specification	512Mb G-die DDR SDRAM Specification	512Mb G-die DDR SDRAM Specification	512Mb G-die DDR SDRAM Specification	512Mb G-die DDR SDRAM Specification	512Mb G-die DDR SDRAM Specification	512Mb G-die DDR SDRAM Specification
Parts packaging code	-	TSOP2	-	TSOP2	TSOP2	TSOP2	-	TSOP2
package instruction	-	TSOP2,	-	TSOP2,	TSOP2,	TSOP2,	-	TSOP2,
Contacts	-	66	-	66	66	66	-	66
Reach Compliance Code	-	unknow	-	unknow	unknown	unknow	-	unknow
ECCN code	-	EAR99	-	EAR99	EAR99	EAR99	-	EAR99
access mode	-	FOUR BANK PAGE BURST	-	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	-	FOUR BANK PAGE BURST
Maximum access time	-	0.75 ns	-	0.6 ns	0.55 ns	0.6 ns	-	0.55 ns
Other features	-	AUTO/SELF REFRESH	-	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	-	AUTO/SELF REFRESH
JESD-30 code	-	R-PDSO-G66	-	R-PDSO-G66	R-PDSO-G66	R-PDSO-G66	-	R-PDSO-G66
length	-	22.22 mm	-	22.22 mm	22.22 mm	22.22 mm	-	22.22 mm
memory density	-	536870912 bi	-	536870912 bi	536870912 bit	536870912 bi	-	536870912 bi
Memory IC Type	-	DDR DRAM	-	DDR DRAM	DDR DRAM	DDR DRAM	-	DDR DRAM
memory width	-	4	-	4	8	8	-	16
Number of functions	-	1	-	1	1	1	-	1
Number of ports	-	1	-	1	1	1	-	1
Number of terminals	-	66	-	66	66	66	-	66
word count	-	134217728 words	-	134217728 words	67108864 words	67108864 words	-	33554432 words
character code	-	128000000	-	128000000	64000000	64000000	-	32000000
Operating mode	-	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS
organize	-	128MX4	-	128MX4	64MX8	64MX8	-	32MX16
Package body material	-	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	-	TSOP2	-	TSOP2	TSOP2	TSOP2	-	TSOP2
Package shape	-	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR
Package form	-	SMALL OUTLINE, THIN PROFILE	-	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	-	SMALL OUTLINE, THIN PROFILE
Certification status	-	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified
Maximum seat height	-	1.2 mm	-	1.2 mm	1.2 mm	1.2 mm	-	1.2 mm
self refresh	-	YES	-	YES	YES	YES	-	YES
Maximum supply voltage (Vsup)	-	2.7 V	-	2.7 V	2.7 V	2.7 V	-	2.7 V
Minimum supply voltage (Vsup)	-	2.3 V	-	2.3 V	2.3 V	2.3 V	-	2.3 V
Nominal supply voltage (Vsup)	-	2.5 V	-	2.5 V	2.5 V	2.5 V	-	2.5 V
surface mount	-	YES	-	YES	YES	YES	-	YES
technology	-	CMOS	-	CMOS	CMOS	CMOS	-	CMOS
Terminal form	-	GULL WING	-	GULL WING	GULL WING	GULL WING	-	GULL WING
Terminal pitch	-	0.65 mm	-	0.65 mm	0.65 mm	0.65 mm	-	0.65 mm
Terminal location	-	DUAL	-	DUAL	DUAL	DUAL	-	DUAL
width	-	10.16 mm	-	10.16 mm	10.16 mm	10.16 mm	-	10.16 mm

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