FIN1019MMTC datasheet, PDF - EEWORLD Datasheet

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FIN1019MMTC: DescriptionLine Driver/Receiver, 1 Driver, PDSO14; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size1MB，14 Pages; ManufacturerFairchild; Websitehttp://www.fairchildsemi.com/

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FIN1019MMTC Overview

Line Driver/Receiver, 1 Driver, PDSO14

FIN1019MMTC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Fairchild
package instruction	TSSOP, TSSOP14,.25
Reach Compliance Code	unknown
Differential output	YES
Number of drives	1
High level input current maximum value	0.00002 A
JESD-30 code	R-PDSO-G14
JESD-609 code	e0
Number of terminals	14
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Minimum output swing	0.25 V
Maximum output low current	0.008 A
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP14,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
power supply	3.3 V
Certification status	Not Qualified
Maximum receive delay	2.5 ns
Maximum slew rate	12.5 mA
Nominal supply voltage	3.3 V
surface mount	YES
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.635 mm
Terminal location	DUAL

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FIN1019 3.3V LVDS High Speed Differential Driver/Receiver

April 2001

Revised September 2001

FIN1019

3.3V LVDS High Speed Differential Driver/Receiver

General Description

This driver and receiver pair are designed for high speed

interconnects utilizing Low Voltage Differential Signaling

(LVDS) technology. The driver translates LVTTL signals to

LVDS levels with a typical differential output swing of

350mV and the receiver translates LVDS signals, with a

typical differential input threshold of 100mV, into LVTTL

levels. LVDS technology provides low EMI at ultra low

power dissipation even at high frequencies. This device is

ideal for high speed clock or data transfer.

Features

Greater than 400Mbs data rate

3.3V power supply operation

0.5ns maximum differential pulse skew

2.5ns maximum propagation delay

Low power dissipation

Power-Off protection

100mV receiver input sensitivity

Fail safe protection open-circuit, shorted and terminated

conditions

Meets or exceeds the TIA/EIA-644 LVDS standard

Flow-through pinout simplifies PCB layout

14-Lead SOIC and TSSOP packages save space

Ordering Code:

Order Number

FIN1019M

FIN1019MTC

Package Number

M14A

MTC14

Package Description

14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow

14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide

Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.

Function Table

Inputs

IN+

Open

−

Circuit or Z

HIGH Logic Level

High Impedance

Connection Diagram

Outputs

OUT+

OUT

OUT−

IN−

Fail Safe Condition

Pin Descriptions

Pin Name

OUT+

OUT−

IN+

IN−

OUT

GND

Description

LVTTL Data Input

Non-inverting LVDS Output

Inverting LVDS Output

Driver Enable (LVTTL, Active HIGH)

Non-Inverting LVDS Input

Inverting LVDS Input

LVTTL Receiver Output

Receiver Enable (LVTTL, Active LOW)

Power Supply

Ground

No Connect

LOW Logic Level

Don’t Care

Fail Safe

Open, Shorted, Terminated

DS500506

www.fairchildsemi.com

FIN1019MMTC Related Products

	FIN1019MMTC	FIN1019MMTCX
Description	Line Driver/Receiver, 1 Driver, PDSO14	Line Driver/Receiver, 1 Driver, PDSO14
Is it Rohs certified?	incompatible	incompatible
Maker	Fairchild	Fairchild
package instruction	TSSOP, TSSOP14,.25	TSSOP, TSSOP14,.25
Reach Compliance Code	unknown	unknown
Differential output	YES	YES
Number of drives	1	1
High level input current maximum value	0.00002 A	0.00002 A
JESD-30 code	R-PDSO-G14	R-PDSO-G14
JESD-609 code	e0	e0
Number of terminals	14	14
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
Minimum output swing	0.25 V	0.25 V
Maximum output low current	0.008 A	0.008 A
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSSOP	TSSOP
Encapsulate equivalent code	TSSOP14,.25	TSSOP14,.25
Package shape	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
power supply	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified
Maximum receive delay	2.5 ns	2.5 ns
Maximum slew rate	12.5 mA	12.5 mA
Nominal supply voltage	3.3 V	3.3 V
surface mount	YES	YES
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING
Terminal pitch	0.635 mm	0.635 mm
Terminal location	DUAL	DUAL

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